Patents by Inventor Mei Hua

Mei Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10383223
    Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 13, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Ning Hou, Si-Hong He, Biao Li, Mei-Hua Huang
  • Publication number: 20190127572
    Abstract: An epoxy resin composition is provided. The epoxy resin composition includes 80-100 parts by weight of a thermal curable epoxy resin, and 0.1-20 parts by weight of a branched rubber copolymer. The branched rubber copolymer includes a rubber polymer serving as a main portion, and a polymer composed of polyethylene glycol (PEG), derivatives of polyethylene glycol, polycaprolactone (PCL), derivatives of polycaprolactone, or a combination thereof serving as a branched chain.
    Type: Application
    Filed: October 26, 2018
    Publication date: May 2, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Feng-Ming Hsieh, Mei-Hua Wang
  • Publication number: 20190098754
    Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 28, 2019
    Inventors: NING HOU, SI-HONG HE, BIAO LI, MEI-HUA HUANG
  • Publication number: 20190069418
    Abstract: A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.
    Type: Application
    Filed: June 28, 2018
    Publication date: February 28, 2019
    Inventors: BIAO LI, WEI-XIANG LI, PENG HE, MEI-HUA HUANG, XIAO-WEI KANG, MENG-LU JIA
  • Patent number: 10202618
    Abstract: In alternative embodiments, the invention provides methods for treating, ameliorating or protecting (preventing) an individual or a patient against a disease, an infection or a condition responsive to an increased paracrine polypeptide level in vivo comprising: providing a paracrine polypeptide-encoding nucleic acid or gene operatively linked to a transcriptional regulatory sequence; or an expression vehicle, a vector, a recombinant virus, or equivalent, having contained therein a paracrine-encoding nucleic acid or gene, and the expression vehicle, vector, recombinant virus, or equivalent can express the paracrine-encoding nucleic acid or gene in a cell or in vivo; and administering or delivering the paracrine polypeptide -encoding nucleic acid or gene operatively linked to a transcriptional regulatory sequence, or the expression vehicle, vector, recombinant virus, or equivalent, to an individual or a patient in need thereof, thereby treating, ameliorating or protecting (preventing) the individual or patient
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: February 12, 2019
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: H. Kirk Hammond, Mei Hua Gao
  • Patent number: 10187984
    Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: January 22, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co
    Inventors: Ning Hou, Si-Hong He, Biao Li, Mei-Hua Huang
  • Publication number: 20180333445
    Abstract: Provided is a method for preparing a fresh chlorella drink by sterile culturing and freezing and then rapidly raising the temperature.
    Type: Application
    Filed: May 17, 2017
    Publication date: November 22, 2018
    Inventors: Ting-Jung Lin, Mei-Hua Huang
  • Publication number: 20180311286
    Abstract: The present application provides an in-vitro committed differentiation method for inducing human induced pluripotent stem cells (hiPSCs) into Leydig cells (LCs) by neural crest stem cells (NCSCs). The hiPS-derived LCs is verified by an animal model to have the capacity of regenerating senile or injured LCs, so that a new treatment for supplementing testosterone is provided for patients suffering from hypogonadism, particularly for patients suffering from late-onset hypogonadism (LOH).
    Type: Application
    Filed: May 24, 2018
    Publication date: November 1, 2018
    Inventors: Peng Xiang, Mei Hua Jiang, Weiqiang Li
  • Patent number: 10077436
    Abstract: Described herein are beta-glucosidase enzymes that have improved beta-glucosidase activity compared to a control beta-glucosidase enzyme. The improved beta-glucosidase enzymes are useful for converting a cellulosic biomass to fermentable sugars such as glucose. Also described are isolated polynucleotides that encode polypeptides having improved beta-glucosidase activity, expression cassettes for expressing the improved beta-glucosidase polypeptides, and cells, such as yeast cells, transformed with the expression cassettes.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: September 18, 2018
    Assignee: EDENIQ, INC.
    Inventors: Lan Sun, Ngim Muy Ung Ferrell, Deepak Singh, Jennifer Headman, Mei-Hua Chu, Michael Guerini, Sandra Jacobson
  • Publication number: 20180010148
    Abstract: In alternative embodiments, the invention provides methods for treating, ameliorating or protecting (preventing) an individual or a patient against a disease, an infection or a condition responsive to an increased paracrine polypeptide level in vivo comprising: providing a paracrine polypeptide-encoding nucleic acid or gene operatively linked to a transcriptional regulatory sequence; or an expression vehicle, a vector, a recombinant virus, or equivalent, having contained therein a paracrine-encoding nucleic acid or gene, and the expression vehicle, vector, recombinant virus, or equivalent can express the paracrine-encoding nucleic acid or gene in a cell or in vivo; and administering or delivering the paracrine polypeptide-encoding nucleic acid or gene operatively linked to a transcriptional regulatory sequence, or the expression vehicle, vector, recombinant virus, or equivalent, to an individual or a patient in need thereof, thereby treating, ameliorating or protecting (preventing) the individual or patient a
    Type: Application
    Filed: June 16, 2017
    Publication date: January 11, 2018
    Inventors: H. Kirk HAMMOND, Mei Hua GAO
  • Publication number: 20170273574
    Abstract: A wearable physiological measuring device has a torso-worn module and a limb-worn module configured to communicate in a wireless way with each other. The torso-worn module is configured to be coupled with a torso of a user to obtain an R-peak from an electrocardiac signal. The limb-worn module is configured to be coupled with at least one limb of four limbs of the user to obtain a pulse wave peak from a plethysmograph signal. There are no physical connections (neither wire nor cable) between the torso-worn module and the limb-worn module. The wearable physiological measuring device is configured to use the R-peak time and the pulse wave peak time to generate a pulse transit time data.
    Type: Application
    Filed: March 27, 2017
    Publication date: September 28, 2017
    Applicant: Hong Yue Technology Corporation
    Inventors: Chi-Sheng Wu, Yu-Sheng Liao, Mei-Hua Liao
  • Publication number: 20170182129
    Abstract: In alternative embodiments, provided are methods for treating, ameliorating or protecting (preventing) congestive heart failure (CHF) or a diabetes-related cardiac dysfunction, comprising: providing a urocortin 2-encoding and/or a urocortin 3-encoding nucleic acid, transcript or message, or gene, operatively linked to a transcriptional regulatory sequence, optionally contained in an expression vehicle or a vector such as an adeno-associated virus (AAV), e.g., an AAV8 serotype; and administering to an individual or a patient in need thereof, such as a type 2 diabetic (T2DM), e.g., by IV administration, thereby treating, ameliorating or protecting against (preventing) the T2DM and/or the diabetes-related cardiac dysfunction in the individual or patient.
    Type: Application
    Filed: April 3, 2015
    Publication date: June 29, 2017
    Inventors: Kirk H. Hammond, Mei Hua Gao
  • Publication number: 20170127966
    Abstract: An electrode device has a conductive body, a silver layer situated above the conductive body, a silver compound layer situated above the silver layer, a liquid absorbing and releasing element situated above the silver compound layer, a shielding element configured to cover an upper surface and a portion of a side surface of the liquid absorbing and releasing element, and a moving mechanism configured to move the shielding element reciprocally between at least two positions.
    Type: Application
    Filed: October 12, 2016
    Publication date: May 11, 2017
    Applicant: Hong Yue Technology Corporation
    Inventors: Chi-Sheng Wu, Yu-Sheng Liao, Mei-Hua Liao
  • Patent number: 9611392
    Abstract: A self-assembly coating material including carbon particles and polymer shells is provided. The polymer shells respectively cover and are bonded to the carbon particles, wherein each polymer shell has both a first functional group for adsorbing on a surface of a substrate and a second functional group for self cross-linking. The first functional groups include thiol groups. The second functional groups include epoxy groups or carboxylic groups. The self-assembly coating material can be applied to a metal substrate to form a heat dissipation layer.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: April 4, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lin Hsin, Chih-Kuang Chang, Mei-Hua Wang, Ting-Yao Su, Hsiao-Chun Yeh
  • Publication number: 20160304849
    Abstract: Described herein are beta-glucosidase enzymes that have improved beta-glucosidase activity compared to a control beta-glucosidase enzyme. The improved beta-glucosidase enzymes are useful for converting a cellulosic biomass to fermentable sugars such as glucose. Also described are isolated polynucleotides that encode polypeptides having improved beta-glucosidase activity, expression cassettes for expressing the improved beta-glucosidase polypeptides, and cells, such as yeast cells, transformed with the expression cassettes.
    Type: Application
    Filed: September 16, 2014
    Publication date: October 20, 2016
    Inventors: Lan Sun, Ngim Muy Ung Ferrell, Deepak Singh, Jennifer Headman, Mei-Hua Chu, Michael Guerini, Sandra Jacobson
  • Patent number: 9418579
    Abstract: An electronic billboard includes a base, bracket, a display and a touch device. The bracket is removable and mounted to the base. The display is removable and mounted to the bracket. The display includes a slot and a receiving portion configured to receive a host. The touch device is received in the slot.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: August 16, 2016
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chun Liu, Chih-Kang Cho, Quan Liao, Zhan-Ao Yu, Te-Hsu Wang, Mei-Hua Liu
  • Patent number: D806068
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 26, 2017
    Assignees: HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Mei-Hua Liu, Chun Liu, Chih-Kang Cho, Yao Li
  • Patent number: D811361
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: February 27, 2018
    Assignees: HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ye Peng, Yen-Chun Lin, Mei-Hua Liu
  • Patent number: D833247
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: November 13, 2018
    Inventor: Mei-Hua Huang
  • Patent number: D849817
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: May 28, 2019
    Assignees: HONGFUJIN PRECISION ELECTRONICS (CHONGQING) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yi-Wen Wang, Chih-Kang Cho, Mei-Hua Liu