Abstract: A computer system. The computer system comprises a display device for image display, a storage device to store a video signal, and a video-playing subsystem, wherein power is supplied to the display device, the storage device, and the video-playing subsystem. The video-playing subsystem comprises a digital video recording (DVR) module to process the video signal transmitted from the storage device in a video-playing mode, and to output the audio signal and the image signal of the video signal respectively, and an image-processing module to process the image signal transmitted from the DVR module into an image for image display.

Abstract: Substituted 2-phenyl-4-quinolone-3-carboxylic acid derivatives and their salts were synthesized. The results of preliminary screening revealed that these compounds are potent in killing solid tumor cancers.

Abstract: Organometallic reversible addition-fragmentation chain transfer reagents (RAFT reagents), processes of free radical polymerization employing the same and polymers with low polydispersity index obtained thereby. The process includes polymerizing at least one monomer with at least one initiator and at least one organometallic RAFT reagent to obtain polymers having terminal organometallic functional groups with low polydispersity index. In addition, the terminal organometallic functional group may be removed by subjecting the obtained polymer to elimination to provide the corresponding organic polymers.

Abstract: Substituted 2-phenyl-4-quinolone-3-carboxylic acid derivatives and their salts were synthesized. The results of preliminary screening revealed that these compounds are potent in killing solid tumor cancers.

Abstract: Nonvolatile memory wordlines (160) are formed as sidewall spacers on sidewalls of row structures (280). Each row structure may contain floating and control gates (120, 140), or some other elements. Pedestals (340) are formed adjacent to the row structures before the conductive layer (160) for the wordlines is deposited. The pedestals are formed in the area of the contact openings (330.1) that will be etched in an overlying dielectric (310) to form contacts to the wordlines. The pedestals raise the top surface of the wordline layer near the contact openings, so the contact opening etch can be made shorter. The pedestals also increase the minimum thickness of the wordline layer near the contact openings, so the loss of the wordline layer during the etch of the contact openings becomes less critical, and the photolithographic tolerances required for patterning the contact openings can be relaxed. The pedestals can be dummy structures (they may have no electrical functionality).

Abstract: A package structure for a multi-chip integrated circuit (IC) is disclosed and the structure includes substrate having a position for bonding with chips for chip-bonding and having at least a hole for the passage of a gold wire in the course of wire-bonding, a first chip attached to the substrate with a chip bonding agent and being wire-bonded on the substrate and the chip bonding position being opposite to the 2nd chip with the substrate in-between, and the gold wire of the wire-bonding passed through the hole of the substrate from the substrate bonding pad at the substrate and on the same lateral side of the second chip and being connected to the pin pad of the first chip, at least a second chip being flip-chip bonded onto the substrate and the bonding position being at different sides of the bonding between the substrate and the first chip, and a package body including filler of the second chip extended to cover the hole of the substrate and the first chip and the gold wire connected to the substrate and th

Abstract: Nonvolatile memory wordlines (160) are formed as sidewall spacers on sidewalls of row structures (280). Each row structure may contain floating and control gates (120, 140), or some other elements. Pedestals (340) are formed adjacent to the row structures before the conductive layer (160) for the wordlines is deposited. The pedestals are formed in the area of the contact openings (330.1) that will be etched in an overlying dielectric (310) to form contacts to the wordlines. The pedestals raise the top surface of the wordline layer near the contact openings, so the contact opening etch can be made shorter. The pedestals also increase the minimum thickness of the wordline layer near the contact openings, so the loss of the wordline layer during the etch of the contact openings becomes less critical, and the photolithographic tolerances required for patterning the contact openings can be relaxed. The pedestals can be dummy structures (they may have no electrical functionality).

Abstract: A catalyst composition and process for preparing norbornene-type homopolymers or copolymers. The norbornene-type homopolymers or copolymers can be prepared using an in-situ catalyst composition including: (a) a transition metal compound of ML4, wherein M is a Group 10 metal and L is a neutral electron donor ligand; (b) a hydrocarbyl halogen containing a double bond or a triple bond; and (c) a salt of a non or weakly coordinative anion that can replace a halogen bonded to a metal. The catalyst composition is in a mixing state of components (a), (b), and (c), or in a mixing state of a reaction product of components (a) and (b) together with component (c).

Abstract: A cleaning device for internal combustion engine by way of suction force generated at the air-inlet tube of the engine is disclosed. The tapered air passage accelerates the air stream to produce a suction force, or a moveable or adjustable valve device to change the surface area of the air passage so as to control the effect of vacuum, and the cleaning solution is sucked into the air-inlet tube to clean away the accumulated carbon and debris in the valves or the internal combustion engine.

Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.

Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,

Abstract: A screwdriver includes a handle, a ratchet socket, a rotary linkage and a cap. The handle has a channel inside to accommodate the rotary linkage with one end inserted with the ratchet socket and a screwdriver socket. The rotary linkage includes a linkage, a tube, a stop section, a spring and a pivoting rod. The linkage has one end pivoted to the stop section inserted in the spring and penetrates axially in the tube. One end of the tube protrudes a wall at the inner periphery and has a pair of gaps at the end. Another end of the linkage is pivoted to the pivoting rod and the cap. The cap is pulled to draw out the linkage with the stop section at the end of the linkage to compress the spring to hold against the wall of the tube, and the pivoting rod is bent for rotation.

Abstract: A catalyst composition and process for preparing norbornene-type homopolymers or copolymers. The norbornene-type homopolymers or copolymers can be prepared using an in-situ catalyst composition including: (a) a transition metal compound of ML4, wherein M is a Group 10 metal and L is a neutral electron donor ligand; (b) a hydrocarbyl halogen containing a double bond or a triple bond; and (c) a salt of a non or weakly coordinative anion that can replace a halogen bonded to a metal. The catalyst composition is in a mixing state of components (a), (b), and (c), or in a mixing state of a reaction product of components (a) and (b) together with component (c).

Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regio

Abstract: A therapeutic method is provided, employing an antiviral compound of the general formula: wherein Z is HI OR′ or N(R)2, wherein R′ is H, (C1-C4)alkyl, aryl, CHO, (C1-C16)alkanoyl or O═P(OH)2, Y is CH or N, and X is selected from the group consisting of H, N(R)2, SR, OR′ or halogens wherein R is H, lower(C1-C4)alkyl, aryl or mixtures thereof, and the pharmaceutically acceptable salts thereof.

Abstract: A light weight and fast drying warp weaving fabric that is capable of absorbing and dispersing perspiration in one direction is fabricated by warp or weft yarns made from P.P. or PVC fibers or yarns which have water absorption and dispersion capability and low water content and low specific weight property, and weft or warp yarns made from natural fibers, manmade fibers or synthetic fibers which have high water absorption and dispersion capability. The weft yarns are formed linearly in the fabric texture and the warp yarns are formed in an undulant manner threading around the weft yarns such that the warp yarns are woven at the inner layer of the fabric texture for constantly contact the skin of human body and the weft yarns are woven at the outer layer of the texture remote from the skin.

Abstract: A light weight and fast drying warp weaving fabric that is capable of absorbing and dispersing perspiration in one direction is fabricated by warp or weft yarns made from P.P. or PVC fibers or yarns having water absorption and dispersion capability, low water content and low specific weight, and weft or warp yarns made from natural fibers, or synthetic fibers having high water absorption and dispersion capability. The weft yarns of the fabric are linear while the warp yarns are undulantly threaded around the weft yarns such that the warp yarns contact a person's skin and the weft yarns are remote from the skin. The warp yarns absorb perspiration from the skin and transport the moisture to the weft yarns so that the warp yarns keep the skin dry and comfortable, while the moisture in the weft yarns is dispersed and vaporized for fast drying.

Abstract: A ladies' underwear fabrication method and structure that in addition to addressing the difficulty of effectively keeping conventionally fabricated women's underwear in position while worn also provides a newly researched and developed fabrication method that improves finished product appearance and comfort. A double-layer elastic fabric material is overlapped, a punch cutting pattern of a bust-shaped section is traced, breast cups are emplaced, and the fabric material is folded back and cut into shape. Tension-adjustable straps are then attached to the torso band section extending from the bottom of the brassiere and, furthermore, the upper end of the torso band section to effectively provide for stronger positioning and an enhanced bustline profile while the ladies underwear of the present invention is worn.

Abstract: A measuring method for equivalent circuitry is disclosed herein to characterize the interconnects using time-domain reflectometry measurement. By combining the layer peeling algorithm for transmission lines and the matrix-pencil approach for discontinuities, the technique yields a simple equivalent circuit model which consists of distributed transmission lines and networks of lumped elements. With element values being independent of frequency, the model is well suited to model nonlinear broadband circuit simulation for electrical performance of the interconnects.

Abstract: A therapeutic method is provided, employing an antiviral compound of the general formula: ##STR1## wherein Z is H, OR' or N(R).sub.2, wherein R' is H, (C.sub.1 -C.sub.4)alkyl, aryl, CHO, (C.sub.1 -C.sub.16)alkanoyl or O.dbd.P(OH).sub.2, Y is CH or N, and X is selected from the group consisting of H, N(R).sub.2, SR, OR' or halogen, wherein R is H, lower (C.sub.1 -C.sub.4)alkyl, aryl or mixtures thereof, and the pharmaceutically acceptable salts thereof.