Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

Abstract: A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.

Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).

Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).

Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.

Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

Abstract: A waveguide includes a first layer and a second layer. The first layer comprises a material of a first refractive index. The second layer is surrounded by the first layer and comprises a material of a second refractive index greater than the first refractive index. The second layer comprises a main body, a first fork and a second fork. The main body has a first substantially constant thickness. The first fork is extended from the main body and has a first tapering end exposed by the first layer. The first fork has the first substantially constant thickness. The second fork is extended from the main body and has a second tapering end exposed by the first layer. The second fork has the first substantially constant thickness.

Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.

Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.

Abstract: The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident surface. The light reflection surface is inclined at an angle of about 30 degrees to about 60 degrees with respect to the core portion, and the light incident surface is substantially flat and is substantially parallel with the core portion.

Abstract: A pixel structure includes a scan line, a data line, an active device, a first electrode layer, a second electrode layer, and an insulation layer. The active device is electrically connected to the scan line and the data line. The first electrode layer is electrically connected to the active device. The second electrode layer is electrically insulated from the first electrode layer. The insulation layer is located between the first electrode layer and the second electrode layer, and the first electrode layer or the second electrode layer includes an enclosed-frame-shaped portion, first V-shaped branch portions, and second V-shaped branch portions. The first V-shaped branch portions and the second V-shaped branch portions are arranged within the enclosed-frame-shaped portion in opposite directions, and end terminals of the first V-shaped branch portions and end terminals of the second V-shaped branch portions are connected to the enclosed-frame-shaped portion.