Abstract: A circuit structure includes an enhancement mode transistor and a turn-off slew rate controller for automatically adding drain-source capacitance to the transistor when the transistor is transitioning to an off state. The added drain-source capacitance slows the turn-off slew rate (dV/dt_off) of the transistor without also increasing the turn-off energy loss (E_off). The slew rate controller can include: sensors connected to the drain region for sensing both the drain voltage and the slew rate, respectively; a logic circuit for generating and outputting an enable signal based on output voltages from the sensors; and a capacitance adder for adding to the drain-source capacitance only when the logic value of the enable signal indicates that the drain voltage is at or above a predetermined positive drain voltage level and the slew rate is positive.

Abstract: Disclosed in the present disclosure are novel ultra-high-strength stainless steel and a manufacturing method. The novel ultra-high-strength stainless steel is composed of the following components in percentage by mass: C: 0.06-0.4%, Cr: 4-16%, Co: 8-17%, Ni: 2-15%, Mo: 1-7%, V: 0.1-0.8%, W: 0.2-3%, Nb: 0.01-0.3%, B: 0.1-0.3%, Si<0.1%, Mn<0.1%, Al<0.01%, Ti<0.015%, S<0.005%, P<0.008%, Cu<0.2%, La<0.2%, and the balance Fe and other inevitable impurities. The manufacturing process includes material melting, a high temperature diffusion process, cogging and forming of steel ingots, and material heat treatment. The novel ultra-high-strength stainless steel manufactured by using the method provided by the present disclosure has the tensile strength not lower than 2100 MPa, elongation not lower than 8%, reduction of area not lower than 40%, fracture toughness greater than 60 MPa ?{square root over (m)}, and a stress corrosion threshold greater than 40 MPa ?{square root over (m)}.

Abstract: Disclosed circuit structure embodiments include an enhancement mode transistor and a turn-off slew rate controller for automatically adding drain-source capacitance to the transistors when the transistor is transitioning to an off state. The added drain-source capacitance slows the turn-off slew rate (dV/dt_off) of the transistor without also increasing the turn-off energy loss (E_off). In some embodiments, the slew rate controller includes: sensors connected to the drain region for sensing both the drain voltage and the slew rate, respectively; a logic circuit for generating and outputting an enable signal based on output voltages from the sensors; and a capacitance adder for adding to the drain-source capacitance only when the logic value of the enable signal indicates that the drain voltage is at or above a predetermined positive drain voltage level and the slew rate is positive.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: A GaN logic circuit may include an input node receiving an input voltage, a first pull up transistor pulling up an output voltage in response to the input voltage, and a first depletion mode transistor having a first gate to which a first gate voltage is applied and a second gate to which a second gate voltage is applied. The first depletion mode transistor may control the first pull up transistor in response to a gate voltage difference between the first gate voltage and the second gate voltage. The logic device may further include a capacitor having a first end coupled to the first depletion mode transistor and a second end coupled to the first pull up transistor.

Abstract: A meander embedding sector traveling-wave antenna for series superconducting detectors is provided, including: a detector array, a meander metal layer, a pair of bend-line metal layers, and a pair of sector metal layers. The detector array is individually connected in the meander metal layer and the pair of bend-line metal layers; the pair of bend-line metal layers is correspondingly connected to the pair of sector metal layers; and the pair of sector metal layers is disposed symmetrically centered on the detector array. The antenna improves working bandwidth of THz antenna and completes low-impedance matching between a single antenna and each series Josephson junction embedded in the antenna. The embedding meander can be connected to a plurality of low-impedance detectors, and performance of the antenna is not influenced while target impedance matching is completed. And the working bandwidth of the THz antenna embedded with the series detectors is increased.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A di(2-ethylhexyl) terephthalate composition is provided. The di(2-ethylhexyl) terephthalate composition comprises di(2-ethylhexyl)terephthalate, at least one of a first component, a second component and a third component, and a fourth component When the di(2-ethylhexyl) terephthalate composition is characterized by gas chromatography (GC), the first component is eluted at a retention time ranging from 4.8 minutes to 6.0 minutes, the second component is eluted at a retention time ranging from 9.0 minutes to 10.0 minutes, the third component is eluted at a retention time ranging from 10.1 minutes to 12.0 minutes, and the fourth component is eluted at a retention time ranging from 21.0 minutes to 22.1 minutes. The ratio of the total area of the chromatographic peaks indicating the first component, second component, and third component to the area of the chromatographic peaks indicating the fourth component is 0.135 to 1.720.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a lead frame and a sub-substrate disposed on the lead frame, wherein the thickness of the sub-substrate is between 0 and 0.5 ?m. The semiconductor structure also includes an epitaxial layer disposed on the sub-substrate. The epitaxial layer includes a buffer layer, a channel layer and a barrier layer. The buffer layer is disposed between the sub-substrate and the channel layer. The channel layer is disposed between the buffer layer and the barrier layer. The semiconductor structure further includes a device layer disposed on the barrier layer and an interconnector structure electrically connected to the epitaxial layer and/or the device layer by a through hole.

Abstract: The invention relates to a method, an apparatus and a computer program product for reading data from multiple flash dies. The method is performed by a processing unit when loading and executing program code to include: issuing a read instruction to a flash interface to drive the flash interface to activate a data read operation for reading data from a location in a die; calculating an output time point corresponding to the read instruction; and issuing a random out instruction corresponding to the read instruction to the flash interface to drive the flash interface to store the data in a random access memory (RAM) when a current time reaches to, or is later than the output time point.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.

Abstract: A di(2-ethylhexyl) terephthalate composition is provided. The di(2-ethylhexyl) terephthalate composition comprises di(2-ethylhexyl)terephthalate, at least one of a first component, a second component and a third component, and a fourth component When the di(2-ethylhexyl) terephthalate composition is characterized by gas chromatography (GC), the first component is eluted at a retention time ranging from 4.8 minutes to 6.0 minutes, the second component is eluted at a retention time ranging from 9.0 minutes to 10.0 minutes, the third component is eluted at a retention time ranging from 10.1 minutes to 12.0 minutes, and the fourth component is eluted at a retention time ranging from 21.0 minutes to 22.1 minutes. The ratio of the total area of the chromatographic peaks indicating the first component, second component, and third component to the area of the chromatographic peaks indicating the fourth component is 0.135 to 1.720.

Abstract: A system for eliminating interference of randomly stacked workpieces is disclosed. The system includes a three-dimensional sensing module, a pick-up apparatus and a control module. The control module is coupled to the three-dimensional sensing module and the pick-up apparatus. The control module is configured to control the three-dimensional sensing module to capture a three-dimensional image, analyze the three-dimensional image to obtain an image information, select a target workpiece to be picked up according to the image information, arrange an interference elimination path for the target workpiece, and control the pick-up apparatus to eliminate interference of the target workpiece according to the interference elimination path.

Abstract: A method of forming dice includes the following steps. First, a wafer structure is provides, which includes a substrate and a stack of semiconductor layers disposed in die regions and a scribe line region. Then, the substrate and the stack of the semiconductor layers in the scribe line region are removed to form a groove in the substrate. After the formation of the groove, the substrate is further thinned to obtain the substrate with a reduced thickness. Finally, a separation process is performed on the substrate with the reduced thickness.

Abstract: The invention relates to a method, an apparatus and a computer program product for reading data from multiple flash dies. The method is performed by a processing unit when loading and executing program code to include: issuing a read instruction to a flash interface to drive the flash interface to activate a data read operation for reading data from a location in a die; calculating an output time point corresponding to the read instruction; and issuing a random out instruction corresponding to the read instruction to the flash interface to drive the flash interface to store the data in a random access memory (RAM) when a current time reaches to, or is later than the output time point.

Abstract: A chip structure includes a substrate, a bottom conductive layer, a semiconductor layer, an interlayer dielectric layer, at least one electrode, and at least one top electrode. The substrate includes in order a core layer and a composite material. The bottom conductive layer is disposed on the bottom surface of the core layer, the semiconductor layer is disposed on the substrate, and an interlayer dielectric layer is disposed on the semiconductor layer. The at least one electrode is disposed between the semiconductor layer and the interlayer dielectric layer, and the at least one top electrode is disposed on the interlayer dielectric layer and electrically coupled to the at least one electrode.