Patents by Inventor Meiling Li

Meiling Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TWO-STEP STRIPPING METHOD FOR REMOVING VIA PHOTORESIST DURING THE FABRICATION OF PARTIAL-VIA DUAL DAMASCENE FEATURES
    Publication number: 20050239286
    Abstract: A two-step stripping method for removing via photoresist during the fabrication of trench-first partial-via dual damascene features is disclosed. In the first cleaning step, inert gas (He, Ar, N2)/fluorocarbon plasma is used to contact the remaining “Via Photo” for a short time period not exceeding 20 seconds. Thereafter, in the second cleaning step, a reducing plasma is used to completely strip the remaining “Via Photo”, thereby preventing the low-k or ultra low-k carbon-containing dielectric layer from potential carbon depletion.
    Type: Application
    Filed: October 27, 2004
    Publication date: October 27, 2005
    Inventors: Chih-Ning Wu, Wen-Liang Lien, Charlie Lee, Meiling Li