Patents by Inventor Meng-Cheng Huang

Meng-Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953738
    Abstract: The present invention discloses a display including a display panel and a light redirecting film disposed on the viewing side of the display panel. The light redirecting film comprises a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at the bottom of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 9, 2024
    Assignee: BenQ Materials Corporation
    Inventors: Cyun-Tai Hong, Yu-Da Chen, Hsu-Cheng Cheng, Meng-Chieh Wu, Chuen-Nan Shen, Kuo-Jung Huang, Wei-Jyun Chen, Yu-Jyuan Dai
  • Publication number: 20240092665
    Abstract: A method for treating wastewater containing ertriazole compounds is provided. Hypochlorous acid (HOCl) having a neutral to slightly acidic pH value is added to the wastewater containing triazole compounds for reaction, thereby effectively reacting more than 90% of triazole compounds.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: KUO-CHING LIN, YUNG-CHENG CHIANG, SHR-HAN SHIU, MENG-CHIH CHUNG, YI-SYUAN HUANG
  • Publication number: 20170241430
    Abstract: A combined fan for cooling a heat source includes a hub and multiple blades. The hub has a first side and a second side opposite to each other. The blades are distributed along an outer circumferential surface of the hub, and each of the blades includes a first part extending from the hub and a second part connected to the first part. Each of the second parts protrudes beyond the first side or the second side, and each of the second parts is formed by multiple strip structures. Therefore, each of the strip structures can be closer to a surface of the heat source to dissipate the heat more effectively.
    Type: Application
    Filed: February 19, 2016
    Publication date: August 24, 2017
    Inventors: Meng-Cheng HUANG, Chin-Hsiung HUANG, Tang-Yi YEH, Shih-Lun Chiu
  • Patent number: 8488322
    Abstract: The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: July 16, 2013
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Meng-Cheng Huang, Chi-Chung Tseng
  • Patent number: 8431873
    Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: April 30, 2013
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Cheng-Tu Wang, Meng-Cheng Huang
  • Publication number: 20120106088
    Abstract: The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 3, 2012
    Inventors: Meng-Cheng HUANG, Chi-Chung Tseng
  • Patent number: 7841386
    Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: November 30, 2010
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Tony Wang, Meng-Cheng Huang
  • Publication number: 20100101763
    Abstract: A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.
    Type: Application
    Filed: October 27, 2008
    Publication date: April 29, 2010
    Inventors: Meng-Cheng Huang, Shih-Yuan Lin
  • Publication number: 20100078425
    Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 1, 2010
    Inventors: Cheng-Tu Wang, Meng-Cheng Huang
  • Publication number: 20090279262
    Abstract: A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Inventors: Meng-Cheng HUANG, Cheng-Tu Wang
  • Publication number: 20080222890
    Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.
    Type: Application
    Filed: March 14, 2007
    Publication date: September 18, 2008
    Inventors: Tony Wang, Meng-Cheng Huang
  • Publication number: 20080055908
    Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 6, 2008
    Inventors: Chung Wu, Meng-Cheng Huang, Zu-Chao Hsu
  • Patent number: 7338186
    Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: March 4, 2008
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Chung Wu, Meng-Cheng Huang, Zu-Chao Hsu
  • Publication number: 20070254519
    Abstract: A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chung Wu, Meng-Cheng Huang, Zu-Chao Hsu
  • Publication number: 20070253202
    Abstract: The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chung Wu, Meng-Cheng Huang, Zu-Chao Hsu
  • Publication number: 20070240859
    Abstract: A capillary structure of a heat pipe includes a hollow pipe body and a capillary structure adhered to the inner wall of the pipe body. The main part of the pipe body is provided with at least one heated section. The capillary structure within the heated section is constituted by sintered powder, and the capillary structure within the remaining portion of the main part of the pipe body is constituted by woven web or groove. By using two different kinds of capillary structures to form the capillary structure of the inner wall of the heat pipe, the heat pipe can withstand a heat source of higher temperature, and can also be suitable for a curved pipe.
    Type: Application
    Filed: April 17, 2006
    Publication date: October 18, 2007
    Inventors: Tony Wang, Meng-Cheng Huang, Ming Tsai
  • Publication number: 20070240868
    Abstract: An air-guiding structure for a heat-dissipating fin is manufactured by providing plural sets of air-guiding portions on each heat-dissipating fin. Each air-guiding-portion includes a plurality of thorns made by stamping. The thorns are arranged non-linearly and oriented to face the inlet or the outlet for external cooling air. With the above arrangement, when the external cooling air enters the inlet of the heat-dissipating fin and passes through the flowing path, as soon as contacting with the thorns of the air-guiding portion, the cooling air is hindered to form a three-dimensional turbulent flow on the heat-dissipating fin. As a result, the duration within which the cooling air stays in the heat-dissipating fin can be extended to efficiently carry the heat source out of the heat-dissipating fins, thereby to improve the efficiency in heat dissipation.
    Type: Application
    Filed: April 17, 2006
    Publication date: October 18, 2007
    Inventors: Chung Wu, Meng-Cheng Huang
  • Publication number: 20070240481
    Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.
    Type: Application
    Filed: April 17, 2006
    Publication date: October 18, 2007
    Inventors: Chung Wu, Meng-Cheng Huang, Tony Wang
  • Patent number: 7275409
    Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: October 2, 2007
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Chung Wu, Meng-Cheng Huang, Tony Wang
  • Publication number: 20060139935
    Abstract: A cooling device for LED lamp, which is disposed in an LED lamp set, includes a heat pipe. The cooling end of the heat pipe is disposed on the light reflection cover of the lamp set, while the reception end contacts the bottom portion of the light emitter. Therefore, the heat generated from the light emitter is transferred to the heat pipe and then to the light reflection cover. Thereafter, the heat is dissipated to the external environment, thereby achieving the cooling purpose.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Inventor: Meng-Cheng Huang