THIN HEAT DISSIPATING APPARATUS

Abstract

A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a heat dissipating apparatus, and more particularly to a thin heat dissipating apparatus adopting a thermal exchange technology.

2. Description of Prior Art

An application of a heat pipe used as a heat dissipating apparatus of a computer, particularly for a notebook computer with limited internal space has become a common technical measure for dissipating heat, and the heat pipe generally comes with no movable element. A pipe body at a still state can be used for conducting heat. In addition, the pipe body is bendable, so that the heat pipe occupies a relatively smaller space.

In FIG. 1, a heat dissipating apparatus la applied in a notebook computer is shown. The heat dissipating apparatus 1a comprises two heat pipes 10a, and a heat dissipating element 11a is formed by stacking a plurality of fins and disposed at a condensing end of the two heat pipes 10a, and a heat conducting base 12a is disposed at an evaporation end of the two heat pipes 10a. With the foregoing structure, the two heat conducting bases 12a respectively correspond to electronic components with a heat generating source, such as a Southbridge and a Northbridge, and the heat produced by the two electronic components with a heat generating source is conducted to the heat dissipating element 11a through the two heat pipes 10a, and dissipated by the heat dissipating element 11a.

Since the two heat pipes 10a must be combined with the heat dissipating element 11a for the thermal conduction, the heat dissipating element 11a must provide two contact portions for combining the two heat pipes 10a with the heat dissipating element 11a. The heat dissipating apparatus of this sort is generally applied in a notebook computer with a limited internal space, such that if the heat dissipating element 11a occupies a relatively larger space, then such heat dissipating apparatus no longer fits the intended application. Furthermore, the installation of a fan may be affected due to the space limitation.

In view of the foregoing shortcomings of the prior art, the inventor of the present invention based on years of experience in the related field to conduct extensive researches and experiments, and finally developed a feasible design to overcome the shortcomings of the prior art.

SUMMARY OF THE INVENTION

It is a primary objective of the present invention to provide a thin heat dissipating apparatus having a single heat pipe for connecting two heat conducting bases in series. In other words, both ends of the heat pipe are evaporation ends, and a heat dissipating element is disposed at an appropriate position of the middle section of the heat pipe to serve as a condensation section, and the heat dissipating element is connected to the single heat pipe to reduce the occupied space.

To achieve the foregoing objective, the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed on both ends of the pipe body respectively and a condensation section disposed on a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the thin heat dissipating apparatus.

Another objective of the present invention is to provide a thin heat dissipating apparatus comprising a single heat pipe connected to two heat conducting bases. In other words, both ends of the heat pipe serve as evaporation ends, and an appropriate position of a middle section of the heat pipe is selected and provided for installing a heat dissipating element and serving as a condensation section, so that the heat dissipating element can be connected to the single heat pipe to reduce the occupied volume or space.

To achieve the foregoing objective, the present invention provides a thin heat dissipating apparatus comprising a heat pipe, a heat dissipating element, and two heat conducting bases, wherein the pipe body of the heat pipe is formed integrally and includes two evaporation ends disposed at the distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively to constitute the foregoing thin heat dissipating apparatus.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a conventional heat dissipating apparatus;

FIG. 2 is an exploded view of a first preferred embodiment of the present invention;

FIG. 3 is a perspective view of a first preferred embodiment of the present invention;

FIG. 4 is a schematic view of a partial application status in accordance with a first preferred embodiment of the present invention;

FIG. 5 is a cross-sectional view Section 5-5 as depicted in FIG. 4;

FIG. 6 is a cross-sectional view of a second preferred embodiment of the present invention; and

FIG. 7 is a cross-sectional view of a third preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The technical characteristics, features and advantages of the present invention will become apparent in the following detailed description of preferred embodiments with reference to the accompanying drawings, and the preferred embodiments are used for illustrating the present invention only, but not intended to limit the scope of the invention.

With reference to FIGS. 2 and 3 for an exploded view and a perspective view of a first preferred embodiment of the present invention respectively, the present invention provides a thin heat dissipating apparatus 1 comprising a heat pipe 10, a heat dissipating element 11, and two heat conducting bases 12.

The heat pipe 10 is a pipe body with vacuum inside, and having a thermal conducting element of a capillary tissue and a working fluid, and the pipe body of the heat pipe 10 is integrally formed and comes with a specific appropriate length and includes an evaporation end 100 disposed on both ends of the heat pipe 10 separately and a condensation section 101 disposed at a specific portion of the pipe body. In addition, the heat pipe 10 is in a flat shape and disposed at the position of the pipe body of the two evaporation ends 100 and a condensation section 101 to provide a larger area of a thermal conduction contact for the heat dissipating element 11 and the heat conducting base 12. In each preferred embodiment of the present invention, all pipe bodies of the heat pipe 10 are in a flat shape. Of course, the pipe bodies of the heat pipe 10 can be maintained in the original circular tubular shape.

The heat dissipating element 11 is connected to the condensation section 101 of the heat pipe 10 for conducting heat and cooling down the temperature of the condensation section 101. In each preferred embodiment of the present invention, the heat dissipating element 11 is a stacked heat dissipating apparatus formed by arranging a plurality of fins 110 transversally, and each fin 110 has an indent 111 disposed concavely and inwardly on a lateral side of the fin 110, and the indent 111 comes with a shape corresponding to the shape of the flat surface of the pipe body of the heat pipe 10, such that after the fins 110 are stacked, an indentation portion 112 is formed at the indent 111 and provided for a thermal conducting contact to the surface of the condensation section 101 of the heat pipe 10 and disposed at an upper half of the surface of the condensation section 101.

The two heat conducting bases 12 are connected to the two evaporation ends 100 respectively for the thermal conduction, and the pipe body of the heat pipe 10 is extended and bent, such that the two heat conducting bases 12 correspond to a heat generating source 3 of an electronic component for the dissipating heat (as shown in FIG. 4) and conducting the heat produced by the two heat generating source 3 of the electronic components through the heat pipe 10 concurrently for providing a cooling effect by the heat dissipating element 2. In each preferred embodiment of the present invention, each of the two heat conducting bases 12 includes a groove 120 concavely embedded into the evaporation end 100 of the heat pipe 10, such that the evaporation end 100 is combined with the heat conducting base 12 to increase the contact area of the evaporation end 100 and the conducting base 12 and facilitate the thermal conduction.

With the foregoing structure, a thin heat dissipating apparatus of the invention is formed.

In FIGS. 4 and 5, if the heat dissipating apparatus 1 is applied to a notebook computer 2 with limited height and space, and the heat dissipating apparatus 1 adopts a heat pipe 10 to provide the required thermal conduction of the two heat conducting bases 12, then the heat dissipating element 11 only needs a condensation section 101 of the heat pipe 10 for the thermal conducting contact without increasing the volume or space of the heat dissipating element 11 due to the requirement of aligning the two heat conducting bases 12 with the two heat pipes respectively to prevent its affection to the applications or occupying too much internal space of the notebook computer 2. The heat dissipating element 11 is installed at a position corresponding to a ventilation opening 20 of the notebook computer 2, and a centrifugal heat dissipating fan 13 is installed for driving hot currents away from the heat dissipating element 11, so that the heat dissipating element 13 of the heat pipe 10 can conduct the heat from the evaporation end 100 to the condensation section 101 and force the heat to be discharged from the ventilation opening 20 to the outside through the heat dissipating fan 13.

Since the heat dissipating element 11 requires the condensation section 101 of the heat pipe 10 for the thermal conducting contact, therefore the structure for connecting the heat pipe 10 and the heat dissipating element 11 can be simplified. In FIG. 6, another heat dissipating element 11 is installed at the condensation section 101 of the heat pipe 10 and disposed at a lower half of the surface of the condensation section 101, so that the two heat dissipating elements 11 can be used for clamping the condensation section 101 of the heat pipe 10 vertically up and down through the indent section 112. In FIG. 7, the heat dissipating element 11 can be installed directly at each fin 110 and passed through a through hole 113 of each fin 110 and the condensation section 101 of the heat pipe 10.

With the thin heat dissipating apparatus of the invention, a heat pipe 10 is connected to the two heat conducting bases 12 in series, such that the heat dissipating element 12 simply requires a connection of the single heat pipe 10 to reduce the volume or space occupied by the heat dissipating element 12.

In summation of the description above, the invention is a novel product capable of achieving the expected objectives and overcoming the shortcomings of the present invention, and also complies with patent application requirements, and is duly filed for patent application.

While the invention has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims

1. A thin heat dissipating apparatus, comprising;

a heat pipe, being integrally formed with a pipe body, and having two evaporation ends disposed at distal ends of the heat pipe respectively and a condensation section disposed at a portion of the pipe body;

a heat dissipating element, installed at the condensation section of the heat pipe; and

two heat conducting bases, disposed on the two evaporation ends of the heat pipe respectively.

2. The thin heat dissipating apparatus of claim 1, wherein the pipe body of the heat pipe disposed at the two evaporation ends and at the condensation section is in a flat shape.

3. The thin heat dissipating apparatus of claim 2, wherein the pipe body of the heat pipe is in a flat shape at the remaining portion.

4. The thin heat dissipating apparatus of claim 1, wherein the pipe body of the heat pipe is in a circular tubular shape.

5. The thin heat dissipating apparatus of claim 1, wherein the heat dissipating element is a stacked heat dissipating device formed by arranging a plurality of fins transversally.

6. The thin heat dissipating apparatus of claim 5, wherein each fin includes a through hole for passing through the condensation section of the heat pipe to install the heat dissipating element on the condensation section.

7. The thin heat dissipating apparatus of claim 5, wherein each fin includes an indent concavely disposed on a lateral edge of the fin, and having a shape matched precisely with the shape of the surface of the pipe body of the heat pipe, and the indents are used for forming an indent portion, and the indent portion is in contact with a surface of the condensation section of the heat pipe.

8. The thin heat dissipating apparatus of claim 7, wherein the heat dissipating element is disposed on the first half of the surface of the condensation section.

9. The thin heat dissipating apparatus of claim 8, further comprising another heat dissipating element disposed at a lower half of a surface of the condensation section.

10. The thin heat dissipating apparatus of claim 1, wherein the two heat conducting bases have a groove disposed thereon for embedding the evaporation end of the heat pipe, such that the two heat conducting bases are disposed on the two evaporation ends respectively.

11. The thin heat dissipating apparatus of claim 1, further comprising a heat dissipating fan for providing a heat driving effect for the heat dissipating element.

12. The thin heat dissipating apparatus of claim 11, wherein the heat dissipating fan is a centrifugal fan.