Abstract: A capillary structure of a heat pipe includes a hollow pipe body and a capillary structure adhered to the inner wall of the pipe body. The main part of the pipe body is provided with at least one heated section. The capillary structure within the heated section is constituted by sintered powder, and the capillary structure within the remaining portion of the main part of the pipe body is constituted by woven web or groove. By using two different kinds of capillary structures to form the capillary structure of the inner wall of the heat pipe, the heat pipe can withstand a heat source of higher temperature, and can also be suitable for a curved pipe.

Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.

Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.

Abstract: An innovative apparatus and method for media handover in the network is proposed. The apparatus comprises a communication network; a data source provider and handover devices. The handover device comprises a handover module for executing the handover execution. The handover process comprises searching for handover target devices by a searching protocol in a communication network, wherein the communication network comprises a wireless communication network or a wired communication network; selecting the target device and starting a handover process; querying the operation mode of the target device; and performing the handover process.

Abstract: A cooling device for LED lamp, which is disposed in an LED lamp set, includes a heat pipe. The cooling end of the heat pipe is disposed on the light reflection cover of the lamp set, while the reception end contacts the bottom portion of the light emitter. Therefore, the heat generated from the light emitter is transferred to the heat pipe and then to the light reflection cover. Thereafter, the heat is dissipated to the external environment, thereby achieving the cooling purpose.

Abstract: A heat sink is heat sinkdisposed facing the air output of a fan. A concave portion is formed on the heat sink facing the fan. The air flow generated from the fan encounters the concave portion of the heat sink. The concave portion can evenly distribute the air speed flowing from the fan to enhance the cooling effect.

Abstract: The method for preparing a deep trench uses a dry etching process to form a trench in a silicon substrate, and an etching mixture is then coated on the surface of the silicon substrate and inside the deep trench. A portion of etching mixture is removed from the surface of the silicon substrate and the trench above a predetermined depth from the surface of the substrate, and an etching process is then performed using the etching mixture remaining inside the trench to etch the silicon substrate below the predetermined depth so as to form the deep trench. The etching mixture comprises a conveying solution and an etchant, and the viscosity of the conveying solution is higher than that of the etchant. The conveying solution is spin-on-glass or a photoresist, and the etchant is tetramethylammonium hydroxide, ammonium, or hydrofluoric acid. The volume ratio of the conveying solution and the etchant is preferably between 50:1 and 20:1.

Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.

Abstract: The present invention relates to a method of differentiating specific content in a web page displayed by a display device (109). The method comprises the steps of identifying (105) content in said web page with identification parameters comprised by a predefined set of identification parameters and of transmitting (107) information about said identified content to said display device (109). The display device (109) is adapted for displaying the content according to the information in a way, which differentiates the content from other content in the web page.

Abstract: A method, a system and a client of/for rendering a first media type (11) content on a browser (10) on a client (16) with a rendering support from a server (13). The method includes the steps of determining if the first media type content is not suitable for being rendered due to limited resources on the client, and, if this is the case activating a first software component (12) prepared for handling and receiving rendering support from the server, sending, from the client, a link to the first media type content with a request for rendering support; determining, on the server, a second media type content of the received link, wherein the second media type content is suitable for being rendered on the client; transferring the second media type content to the client; and rendering, by the first software component, the second media type content.

Abstract: This invention provides a configuring apparatus and a processing method for a thermal conductive plate, which uses high-temperature fusion to seal a top plate and a bottom plate of the thermal conductive plate together. Thereby, the sealing condition is improved to enhance yield. Further, the processing method speeds up fabrication of the thermal conductive plate to aid in execution of automatic process.

Abstract: A processing method, a chip set and a controller for supporting message signaled interrupt. A memory write transaction on a PCI bus is monitored. When the address of the system memory specified in the interrupt message of the write transaction is located at a range of a reserved interrupt address, the interrupting service sequence is performed. The reserved interrupt address is located in an address of a system memory. Thus, the data to be processed and the system-specified message are written in the buffer and arranged in sequence. The problem of “write buffer latency” is resolved, and is irrelevant to the level of the PCI bus. Many system specified messages can be stored in the system memory, so that multiple system message signaled interrupts issue from different peripheral components can be processed in the same interrupt service routine.

Abstract: A structure for expanding thermal conducting performance of a heat sink includes a bottom plate, a top plate, a hollow filling tube, a wick structure and a hollow thermal expansion conductor. The top and bottom plates are covered with each other to form a planar shell, in which an upper receiving chamber and a lower receiving chamber are formed. The wick structure is attached to the planar shell in upper and lower receiving chambers. The filling tube is filled with a working fluid. The thermal conductor has good conducting performance and is embedded in the planar shell. Further, the thermal conductor is in fluid communication with the upper and the lower chamber, such that the thermal conductor can serve as an extension of the planar shell for heat dissipation.

Abstract: A heat dissipation structure includes a heat sink installed over a heat generating electronic device and a plurality of heat pipes. Proximal ends of the heat pipes are located on the heat sink, and distal ends of the heat pipes extend outside of the heat sink and are connected to a set of fins. The structure is characterized in a plurality of conductor blocks formed on the heat sink at two sides of each heat pipe to aid heat absorption of the heat pipe. Therefore, the lifetime of the heat pipes are prolonged, and the heat dissipation performance is enhanced.

Abstract: An improved structure of a uniform thermal conductive heat dissipation device, having a thermal conductor and a plurality of heat pipes. The thermal conductor includes a convex body member, on which a plurality of parallel connecting parts is formed to allow the heat pipes embedded therein. Each of the heat pipes has a wick structure and a working fluid therein. Each heat pipe has a heat absorbing portion and a heat dissipation portion. The heat absorption portion is closely in contact with the thermal conductor. Thereby, each of the heat is subject to the same amount of heat to result in a uniform thermal conduction and dissipation effect.

Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.

Abstract: A three-phase heat transfer structure includes a heat conducting plate, a heat sink mounted on the heat conducting plate near one end, a thermal tube embedded in and extended through two distal ends of the heat conducting plate, and a phase change material filled in recessed receiving spaces in the heat conducting plate near one end remote from the heat sink and adapted to accumulate heat energy absorbed by the heat conducting plate from a heat source.

Abstract: A three-phase heat transfer structure includes a heat conducting plate, a heat sink mounted on the heat conducting plate near one end, a thermal tube embedded in and extended through two distal ends of the heat conducting plate, and a phase change material filled in recessed receiving spaces in the heat conducting plate near one end remote from the heat sink and adapted to accumulate heat energy absorbed by the heat conducting plate from a heat source.

Abstract: The present invention provides an automatic shaping method and structure of fin and connection element. A feeder drives a material belt to enter a punch having a continuous die. The material belt passes a guide device, a bottom die, and a top die of the continuous die to perform operations of punching a central hole, shaping of outer appearance, and hole expansion and drawing. After an a period's interval, the top die is used to shear the material belt, and a pressure piece moves downwards for side shearing. At the same time of shearing, shaped sheet fins are pressured onto the connection element. A stepping device drives the pressure piece to stack the fins on the connection element one by one. The connection elements are arranged at the feeder. The connection element is sent into a positioning device one by one. After the fins are stacked, automatic replacement is performed.

Abstract: The present invention provides a joining structure of heat-radiating plate and optoelectronic heat-emitting device, which comprises an optoelectronic heat-emitting device, a heat radiator, and a thermal conductive material. The top face of the optoelectronic heat-emitting device is joined with the bottom face of the heat radiator. A receiving space is disposed on the bottom face of the heat radiator. The thermal conductive material is placed in the receiving space. The area of the top face of the optoelectronic heat-emitting device is smaller than that of the receiving space so that the top face of the optoelectronic heat-emitting device can contact the thermal conductive material in the receiving space. The thermal conductive material can melt into liquid to have good fluidity after being uniformly heated to fill up the gap between the heat radiator and the optoelectronic heat-emitting device, thereby effectively helping the optoelectronic heat-emitting device quickly radiate out heat.