Abstract: A packaging substrate includes a core board having a first surface and an opposite second surface; at least a conic through hole formed in the core board and penetrating the first and second surfaces; a plurality of conductive paths formed on a wall of the conic through hole, free from being electrically connected to one another in the conic through hole; and a plurality of first circuits and second circuits disposed on the first and second surfaces of the core board, respectively, and being in contact with peripheries of two ends of the conic through hole, wherein each of the first circuits is electrically connected through each of the conductive paths to each of the second circuits. Compared to the prior art, the packaging substrate has a reduced number of through holes or vias and an increased overall layout density.

Abstract: Disclosed are a coreless packaging substrate and a manufacturing method thereof. The substrate includes a built-up structure and a first wiring layer. The built-up structure has a first outside and an opposite second outside, and includes one or more second dielectric layers and second wiring layers, and a plurality of conductive vias. The second dielectric layers have first and second surfaces respectively facing the first and second outsides. The second wiring layers are disposed on the second surface. The conductive vias are disposed in the second dielectric layer. The outermost second wiring layer at the second outside has a plurality of second conductive pads. The first wiring layer is embedded into and exposed from the first surface of the outermost second dielectric layer at the first outside, and has a plurality of first conductive pads. The conductive vias electrically connect the first wiring layer and the second wiring layer.

Abstract: The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion.

Abstract: The present invention provides an adaptive infotainment device, comprising a display unit, a processing module, and a network module. The processing module is coupled to the display unit to decrypt and process the multi-media content. The network module is coupled to the processing module to receive the multi-media content and selecting paths and accessing nodes. The network module collects the usage log to be processed by the processing module to generate an accumulated user profile to be fused with user default information in a user default unit coupled to the processing module to generate at least one threshold value so that the display unit is capable of displaying the processed multi-media content according to the threshold value. Hence, the user's network behavior can be learned by combining the pre-determined preferences and the past usage preferences so as to generate the most favorable displaying means to enhance the convenience for browsing information.

Abstract: The present invention discloses a system, which can be used to run one or more widgets randomly at specific schedule according to user preference. The system, in one of the embodiments, comprises, a memory, for storing one or more of the widgets and an inputted schedule according to the user instruction; a user interface, for providing the users to input the schedule; a LCD, for displaying the contents of the widgets; a random program selector, for searching the appointed widgets during a specific time frame according to the schedule; a processing unit, for accessing a specific content from a server according to the appointed widgets; and a player, for playing the specific content according to the selecting result of the random program selector.

Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.

Abstract: Disclosed are a coreless packaging substrate and a manufacturing method thereof. The substrate includes a built-up structure and a first wiring layer. The built-up structure has a first outside and an opposite second outside, and includes one or more second dielectric layers and second wiring layers, and a plurality of conductive vias. The second dielectric layers have first and second surfaces respectively facing the first and second outsides. The second wiring layers are disposed on the second surface. The conductive vias are disposed in the second dielectric layer. The outermost second wiring layer at the second outside has a plurality of second conductive pads. The first wiring layer is embedded into and exposed from the first surface of the outermost second dielectric layer at the first outside, and has a plurality of first conductive pads. The conductive vias electrically connect the first wiring layer and the second wiring layer.

Abstract: A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

Abstract: A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.

Abstract: A heat dissipating structure for a portable electronic device which includes a heat generating electronic member. The heat dissipating structure includes a base, a first heat pipe, a heat conducting sleeve, and a second heat pipe. The base is mounted on the heat generating electronic member. The base includes a through groove defined therein. One end of the first heat pipe is received in the through groove. The heat conducting sleeve includes a through hole defined therein. The through hole is configured for pivotably connecting the other end of the first heat pipe. One end of the coaxially joining with the first heating pipe in the heat conducting sleeve. The base is configured for conducting heat generated by the heat generating electronic member to the first heat pipe. It is advantageous that the heat dissipating structured can be mounted in limited space.

Abstract: A multimedia system for playing multimedia data is provided. The multimedia system comprises a media receiver and a remote control device. The media receiver comprises a multimedia processor and an interface server. The multimedia processor is for playing the multimedia data, accordingly generating first media information, and outputting the first media information. The interface server is for receiving and transforming the first media information into second media information, and outputting the second media information, wherein the second media information has a first markup language format. The remote control device receives and displays the second media information.

Abstract: A communication system includes a mobile communication apparatus and a back-end server. The mobile communication apparatus is for respectively generating and outputting a piece of communication operation data, a piece of network operation data or a piece of multimedia playing operation data when a communication operation event, a network operation event or a multimedia playing operation event is triggered, wherein the mobile communication apparatus also detects and provides its position data. The back-end server is for receiving and analyzing the communication operation data or the network operation data to generate and output a piece of catalog statistic data. The mobile communication apparatus generates and outputs a piece of motion data to the back-end server in response to the multimedia playing operation data or the catalog statistic data. The back-end server provides active information to the mobile communication apparatus according to the position data and the motion data.

Abstract: A method for forming a semiconductor device is disclosed. A substrate comprising trenches are provided. Dopants are doped into a region of the substrate neighboring a sidewall of the trenches by using an isotropic doping method. A gate dielectric layer is formed on the sidewall of the substrate. A gate electrode is formed in the trenches, wherein the gate electrode protrudes a surface of the substrate.

Abstract: An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.

Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.

Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.

Abstract: A method is disclosed for creating a new control chart in a basic record system that includes a server and a database coupled to the server. The method includes the steps of storing a number of SPC control charts and a number of tables in the database and determining whether information stored in at least one of the tables has changed. If the information has changed, the method then determines whether the changed information can be described by at least one of the SPC control charts. If the changed information can be described, then the method updates at least one of the SPC control charts with the changed information. If the changed information cannot be described, then the method creates a new control chart that can describe the changed information.

Abstract: A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.

Abstract: The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.

Abstract: An air-guiding structure for a heat-dissipating fin is manufactured by providing plural sets of air-guiding portions on each heat-dissipating fin. Each air-guiding-portion includes a plurality of thorns made by stamping. The thorns are arranged non-linearly and oriented to face the inlet or the outlet for external cooling air. With the above arrangement, when the external cooling air enters the inlet of the heat-dissipating fin and passes through the flowing path, as soon as contacting with the thorns of the air-guiding portion, the cooling air is hindered to form a three-dimensional turbulent flow on the heat-dissipating fin. As a result, the duration within which the cooling air stays in the heat-dissipating fin can be extended to efficiently carry the heat source out of the heat-dissipating fins, thereby to improve the efficiency in heat dissipation.