Patents by Inventor Meng-Chun Chen

Meng-Chun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6932259
    Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: August 23, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Kuei-Jung Chen, Meng-Chun Chen, Chih-Ming Chen, Chih-Yi Lai
  • Publication number: 20050121486
    Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.
    Type: Application
    Filed: February 23, 2004
    Publication date: June 9, 2005
    Inventors: Kuei-Jung Chen, Meng-Chun Chen, Chih-Ming Chen, Chih-Yi Lai
  • Patent number: 6782883
    Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: August 31, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Kuei-Jung Chen, Meng-Chun Chen, Chih-Yi Lai
  • Publication number: 20040094010
    Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.
    Type: Application
    Filed: February 5, 2003
    Publication date: May 20, 2004
    Inventors: Kuei-Jung Chen, Meng-Chun Chen, Chih-Yi Lai
  • Patent number: 6338297
    Abstract: A precise and rapid positioning mechanism for stencil printing comprising a stencil, a carrier, a plurality of pins, and a plurality of positioning pins. There are a plurality of same sized pin eyes formed on both the stencil and the carrier respectively at positions facing against each other for interposing the pins therebetween to set the stencil and the carrier. Next, raising the positioning pins by air cylinder supplied from the carrier so as to fit setting holes on the substrate into the corresponding positioning pins thereby firmly securing the substrate. Then afterwards, by imbibing the substrate with vacuum evacuation force from the carrier so as to put down the positioning pins thereby attaching the stencil together with the substrate and trans-printing a desired pattern on the substrate.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: January 15, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Hwai-Yi Wang, Chan-Chung Du, Meng-Chun Chen
  • Patent number: 6254068
    Abstract: A shock absorbing support arrangement for a vibration feeder, which includes an upright support fixedly mounted on a bottom plate to hold a bearing, a carrier board slidably coupled to the upright support and supported on the bearing, two shock absorbing sliding mechanisms respectively mounted on the upright support at different elevations to hold the carrier board there between, enabling the carrier board to be smoothly oscillated upon operation of the vibration feeder.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: July 3, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chun Chen, Chih-Chien Lin, Fang Chang
  • Patent number: 5878911
    Abstract: A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: March 9, 1999
    Assignee: Industrial Technology Research Institute
    Inventors: Ching-Lin Lin, Meng-Chun Chen, Chen-Chung Du, Jing-Ching Lin, Chyi-Liou Lin
  • Patent number: 5704536
    Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.
    Type: Grant
    Filed: March 12, 1996
    Date of Patent: January 6, 1998
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Chun Chen, Weng-Jung Lu