Abstract: An apparatus for multi-joint lower limb exercise is disclosed, which comprises: a first supporting part; a second supporting part, rotatably connected to the first supporting part; and a hydraulic device, connected to the first and the second supporting parts respectively by the two ends thereof, for providing a hydraulic pressure to the first and the second supporting parts while the first supporting part is rotated about the second supporting part. As a user is fitted with the aforesaid apparatus to perform a lower limb exercise, such as exercising its knee joint or ankle joint, a comparatively better exercise effect can be achieved as the magnitude of the hydraulic pressure provided by the hydraulic device is adjustable by the use of a throttle valve of the hydraulic device.

Abstract: An apparatus for multi-joint lower limb exercise disclosed, which comprises: a first supporting part; a second supporting part, rotatably connected to the first supporting part; a driving device, connected to the second supporting part, for providing a driving force to push the second supporting part to rotate about the first supporting part while simultaneously providing a resistance exerting on the second supporting part for damping the rotation of the same. As a user is fitted with the aforesaid apparatus to perform a lower limb exercise, such as exercising its knee joint or ankle joint, a comparatively better exercise effect can be achieved as the driving force of the driving device is able to reinforce the lower limb exercise performed by the user no matter it is actively performed by the user or is passively driven by the driving device.

Abstract: A cutting tool adjustment method is disclosed to lower a cutting tool on a transparent Mylar to produce an indentation before actual scribing operation, and then to pick up the image of the indentation, and then to use a numerical analysis method and the set formula to automatically calculate the correction angle and position and to adjust the angle and position of the cutting tool subject to the calculation result, and then to repeat the calculation and adjustment procedure if necessary. Thus, the cutting tool and its cutting edge can be accurately adjusted to the correct angle and position to obtain a precise indentation. Further, by means of the automatic adjustment procedure, the present invention saves much adjusting time, thereby improving the productivity.

Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.

Abstract: A brittle material breaking apparatus using a lifting mechanism to lift/lower a carrier wherein the lifting mechanism is controlled to lift the carrier for holding the brittle material for breaking, and then to lower the carrier from the brittle material to a distance for enabling the brittle material to be shifted to a next scribe line for further breaking, preventing the occurrence of friction between the brittle material and the carrier and the production of static electricity and micro particles and, improving the breaking quality. The brittle material breaking apparatus further includes a stroke fine adjustment mechanism adapted to adjust the stroke of the breaking-cutter relative to the brittle material.

Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

Abstract: A cutting device for breaking fragile materials is constructed to include a lifting mechanism adapted to move the cutter vertically, a rotary table adapted to control the cutting angle of the cutter on the workpiece, a feed mechanism adapted to control the federate of the cutter, and a rotary mechanism adapted to rotate the cutter for enabling the cutter to cut the workpiece with one of multiple cutting points thereof selectively.

Abstract: A precise and rapid positioning mechanism for stencil printing comprising a stencil, a carrier, a plurality of pins, and a plurality of positioning pins. There are a plurality of same sized pin eyes formed on both the stencil and the carrier respectively at positions facing against each other for interposing the pins therebetween to set the stencil and the carrier. Next, raising the positioning pins by air cylinder supplied from the carrier so as to fit setting holes on the substrate into the corresponding positioning pins thereby firmly securing the substrate. Then afterwards, by imbibing the substrate with vacuum evacuation force from the carrier so as to put down the positioning pins thereby attaching the stencil together with the substrate and trans-printing a desired pattern on the substrate.

Abstract: A shock absorbing support arrangement for a vibration feeder, which includes an upright support fixedly mounted on a bottom plate to hold a bearing, a carrier board slidably coupled to the upright support and supported on the bearing, two shock absorbing sliding mechanisms respectively mounted on the upright support at different elevations to hold the carrier board there between, enabling the carrier board to be smoothly oscillated upon operation of the vibration feeder.

Abstract: A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.

Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.