Abstract: A prepreg and uses thereof are provided. The prepreg includes an organic fiber woven fabric impregnated or coated with a thermally curable resin composition, wherein the thermally curable resin composition includes: (A) a polyphenylene ether resin having an unsaturated functional group; (B) a polyfunctional vinyl aromatic copolymer; and (C) a compound having the structure of formula (I), wherein, in formula (I), X is a C1-C10 linear or branched alkylene; and the polyfunctional vinyl aromatic copolymer is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

Abstract: A resin composition and the uses of it are provided. The resin composition comprises: (A) a polyfunctional vinyl aromatic copolymer; and (B) a diene compound, represented by the following formula (I) wherein, in formula (I), R10 and R11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R10 and R11 are not simultaneously H; and the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C1 to C10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

Abstract: A halogen-free low dielectric resin composition is provided.

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): (b) a nonpolar elastomer containing vinyl group, wherein the content of the vinyl group is no more than 60%; and (c) a peroxide as a polymerization initiator, wherein, R1, R2, A1, A2, and n are as defined in the specification; and the content of component (b) is about 2% to about 100% based on the weight of component (a), and the content of component (c) is about 0.01% to about 10% based on the total weight of component (a) and component (b).

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A resin composition is provided. The resin composition comprises the following: (a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and (b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof: wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.

Abstract: A halogen-free low dielectric resin composition is provided.

Abstract: A resin composition, comprising: (a) a resin of formula (I): (b) triallyl isocyanurate (TAIC) as a first hardener; and (c) a hardening promoter, which is a metallic salt compound of formula (II): wherein, R1, R2, R3, R4, A1, A2, Ma+, b, and n are as defined in the specification, and wherein the weight ratio of the resin (a) to the first hardener (b) is about 10:1 to about 1:1, and the content of the hardening promoter (c) is about 0.1 wt % to less than 15 wt % based on the total weight of the resin (a) and the first hardener (b), and the weight ratio of the resin (a) to the total amount of the first hardener (b) and BMI is not lower than 1:1.

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): and (b) a solvent, wherein, X, Y, R1 to R4, A1, A2, m and n are as defined in the specification.

Abstract: A resin composition is provided. The resin composition comprises the following: (a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and (b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof: wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.

Abstract: A resin composition is provided. The resin composition comprises the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.008 at 10 GHz and comprises a bismaleimide resin of the following formula (I), wherein M1 and the Z1 groups are as defined in the specification; and (b) an organic compound of the following formula (II) or formula (III), wherein R?, R11 to R19 and R21 to R28 are as defined in the specification, and wherein the amount of the organic compound (b) ranges from 1 wt % to 30 wt % based on the total weight of the resin system (a) and the organic compound (b).

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (DO of not higher than 0.006 at 10 GHz; and (b) a metal hypophosphite of formula (I), wherein a, R, and Ma+ are as defined in the specification, and wherein the amount of the metal hypophosphite (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the metal hypophosphite (b).

Abstract: A resin composition, comprising the following components: (a) a thermal-curable resin system, which has a dielectric loss (Df) of not higher than 0.004 at 10 GHz; and (b) an alkenyl phenoxy phosphazene component, wherein the amount of the component (b) is 1 wt % to 30 wt % based on the total weight of the resin system (a) and the component (b).

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 ?m to about 10 ?m. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.