Abstract: A resin composition, comprising: (a) a resin of formula (I): (b) triallyl isocyanurate (TAIC) as a first hardener; and (c) a hardening promoter, which is a metallic salt compound of formula (II): wherein, R1, R2, R3, R4, A1, A2, Ma+, b, and n are as defined in the specification, and wherein the weight ratio of the resin (a) to the first hardener (b) is about 10:1 to about 1:1, and the content of the hardening promoter (c) is about 0.1 wt % to less than 15 wt % based on the total weight of the resin (a) and the first hardener (b).

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): and (b) a solvent, wherein, X, Y, R1 to R4, A1, A2, m and n are as defined in the specification.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 ?m to about 10 ?m. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition comprises: (a) a resin of formula (I): (b) a nonpolar elastomer containing vinyl group, wherein the content of the vinyl group is no more than 60% based on the total weight of the elastomer; and (c) a peroxide as a polymerization initiator, wherein, R1, R2, A1, A2, and n are as defined in the specification; and the content of component (b) is about 2% to about 100% based on the weight of component (a), and the content of component (c) is about 0.01% to about 10% based on the total weight of component (a) and component (b).

Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50K? and leakage current of below 100 ?Amp under operational voltage.

Abstract: Disclosed is an adhesive composition including 100 parts by weight of lignin, 150 to 400 parts by weight of epoxy resin, and 7.5 to 200 parts by weight of flexibilizer. The lignin and the flexibilizer can be pre-reacted to enhance the physical properties, e.g. glass transition temperature (Tg) and flexural endurance (MIT), of the cured adhesive composition. Furthermore, the adhesive composition and a flexible metal foil can be laminated to form a flexible substrate.

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 ?m, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50 K? and leakage current of below 100 ?Amp under operational voltage.

Abstract: The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.

Abstract: A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 ?m, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.

Abstract: The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Abstract: The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Abstract: A resin composition useful in the fabrication of circuit boards comprises (i) 1˜15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

Abstract: A resin composition for circuit boards. The resin composition comprises (i)1˜15 st % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.