Patents by Inventor Meng-Jen Wang

Meng-Jen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230299124
    Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
  • Publication number: 20230223354
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Da LIN, Meng-Jen WANG, Hung Chen KUO, Wen Jin HUANG
  • Publication number: 20230204901
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is configured to connect an optical element, the movable assembly is movable relative to the fixed assembly, and the optical element has an optical axis. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The circuit assembly includes a plurality of circuits and is affixed to the fixed assembly.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 29, 2023
    Inventors: Sin-Hong LIN, Yung-Ping YANG, Wen-Yen HUANG, Yu-Cheng LIN, Kun-Shih LIN, Chao-Chang HU, Yung-Hsien YEH, Mao-Kuo HSU, Chih-Wei WENG, Ching-Chieh HUANG, Chih-Shiang WU, Chun-Chia LIAO, Chia-Yu CHANG, Hung-Ping CHEN, Wei-Zhong LUO, Wen-Chang LIN, Shou-Jen LIU, Shao-Chung CHANG, Chen-Hsin HUANG, Meng-Ting LIN, Yen-Cheng CHEN, I-Mei HUANG, Yun-Fei WANG, Wei-Jhe SHEN
  • Publication number: 20230196558
    Abstract: A medicine image recognition method applied to an electronic device is provided. The method includes obtaining target images by inputting medicine images into a position detection network. Character feature matrices are generated according to the target images and a character recognition network. Image feature matrices are generated by inputting the target images into a category recognition network. Reference matrices are generated according to the image feature matrices and corresponding character feature matrices. Once a matrix to be tested is generated by processing an image to be tested, and a recognition result of the image to be tested is generated according to a similarity between the matrix to be tested and each of the reference matrices.
    Type: Application
    Filed: June 20, 2022
    Publication date: June 22, 2023
    Inventors: YU-JEN WANG, MENG-PING LU
  • Patent number: 11682653
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: June 20, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • Patent number: 11626525
    Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: April 11, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun Yu Ko, Tsu-Hsiu Wu, Meng-Jen Wang
  • Publication number: 20230104397
    Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Meng-Jen WANG, Chien-Yuan TSENG, Hung Chen KUO, Ying-Hao WEI, Chia-Feng HSU, Yuan-Long CHIAO
  • Patent number: 11605598
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: March 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Da Lin, Meng-Jen Wang, Hung Chen Kuo, Wen Jin Huang
  • Publication number: 20220238502
    Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsung-Yueh TSAI, Meng-Jen WANG, Yu-Fang TSAI, Meng-Jung CHUANG
  • Patent number: 11302682
    Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: April 12, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tsung-Yueh Tsai, Meng-Jen Wang, Yu-Fang Tsai, Meng-Jung Chuang
  • Publication number: 20220077326
    Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.
    Type: Application
    Filed: September 4, 2020
    Publication date: March 10, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Yu KO, Tsu-Hsiu WU, Meng-Jen WANG
  • Publication number: 20220028836
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei WU, Chien-Yuan TSENG, Meng-Jen WANG, Chen-Tsung CHANG, Chih-Fang WANG, Cheng-Han LI, Chien-Hao CHEN, An-Chi TSAO, Per-Ju CHAO
  • Publication number: 20210327822
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Application
    Filed: April 17, 2020
    Publication date: October 21, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei Da LIN, Meng-Jen WANG, Hung Chen KUO, Wen Jin HUANG
  • Patent number: 11139274
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • Publication number: 20210175205
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
  • Publication number: 20210125974
    Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsung-Yueh TSAI, Meng-Jen WANG, Yu-Fang TSAI, Meng-Jung CHUANG
  • Patent number: 10937761
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: March 2, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Ming Hung, Meng-Jen Wang, Tsung-Yueh Tsai, Jen-Kai Ou
  • Publication number: 20200251449
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 6, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • Publication number: 20200194327
    Abstract: A semiconductor device package includes: (1) a conductive base comprising a sidewall, a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth; (2) a semiconductor die disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a second surface opposite the first surface, the second surface of the semiconductor die bonded to the bottom surface of the cavity; and (3) a first insulating material covering the sidewall of the conductive base and extending to a bottom surface of the conductive base.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Tsung CHIU, Meng-Jen WANG, Cheng-Hsi CHUANG, Hui-Ying HSIEH, Hui Hua LEE
  • Publication number: 20200118968
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 16, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU