Abstract: A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.

Abstract: Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.

Abstract: A light source having a substrate having first and second surfaces is disclosed. The substrate has first and second conducting traces on the first surface. A heat conducting metallic layer is attached to the second surface. First and second LEDs are disposed on the first surface, each LED having first and second contacts for powering that LED. The first contact is connected to a corresponding one of the first and second conducting traces. First and second conducting vias are in contact with the first and second LEDs, respectively. The first and second conducting vias extend from the first surface through the substrate and contact the heat conducting metallic layer. The second contacts of the first and second LEDs are electrically connected to the first and second conducting vias, respectively. The LEDs are powered by applying potentials between the external terminals and the heat-conducting layer.

Abstract: An LED is formed using terminal leads that are rolled instead of die-set formed. Using this process, the terminal leads can end in several terminals thereby allowing higher heat dissipation. The LED can be produced using an LED chip that has light coming only from the top or with light coming from the sides as well. In one embodiment, the side emitting LED can have reflectors constructed within the device to reflect light to the top.

Abstract: A New Phosphor-converted LED Device (“NPCLD”) is disclosed. The NPCLD may include a lens over a phosphor body, in which the lens and the phosphor body each have a substantially convex upper surface. The NPCLD may alternatively include first and second lenses, the first lens having a substantially flat interface with a phosphor body.

Abstract: A flash module has a first light-emitting diode (“LED”) optically coupled to a first lens having a first viewing angle, and a second LED optically coupled to a second lens having a second viewing angle. The second viewing angle is greater than the first viewing angle. A first control signal line coupled to the first LED allows selectively activating the first LED. A second control signal line coupled to the second LED activates the second LED.

Abstract: A white light emitting device by using off-white light emitting diodes (LED's). Rather than using just pure white LEDs, the white light emitting device arranges those LEDs which exhibit off-white colors in a manner such that the combination of light emanating from these off-white LEDs produces a radiation which appears substantially pure white to the human eye.

Abstract: Disclosed are systems and methods which provide an illuminator configuration in which an optical element is provided integral with a reflector component. Embodiments provide an LED encapsulation optical element having a boundary with a surrounding medium, such as air, which avoids or minimizes total internal reflection phenomena. Such an LED encapsulation optical element is formed integral with a reflector component in order to ensure proper relative placement of the LED light source, optical element, and reflector component and/or to facilitate rapid and predictable mechanical assembly of an illuminator. Plated through holes may be disposed in a substrate beneath the LED light source to dissipate heat from the LED light source, prolonging the life of the LED light source and/or the encapsulation material.

Abstract: Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.

Abstract: A white light emitting device by using off-white light emitting diodes (LED's). Rather than using just pure white LEDs, the white light emitting device arranges those LEDs which exhibit off-white colors in a manner such that the combination of light emanating from these off-white LEDs produces a radiation which appears substantially pure white to the human eye.

Abstract: A compiler includes a real register allocation stage, an optimization stage and a final code stage. The real register allocation stage is configured to generate intermediate code from a basic block of source code. Physical registers, instead of virtual registers, are allocated to operands from the generated intermediate code, and the operands are stored in the physical registers. Then, the intermediate code is optimized, and machine readable code is generated from the intermediated code using the optimized registers in the final code stage. By allocating physical registers in the front-end of the compiler, instead of just prior to generating the machine-readable code, compiling time and memory needed for compiling source code is reduced.