Patents by Inventor Meng LIANG

Meng LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200135653
    Abstract: Structures and formation methods of a package structure are provided. The method includes forming a conductive structure over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes pressing a protective substrate against the carrier substrate at an elevated temperature to bond the protective substrate to the conductive structure. The method further includes forming a protective layer to surround the semiconductor die.
    Type: Application
    Filed: June 11, 2019
    Publication date: April 30, 2020
    Inventors: Po-Hao TSAI, Hsien-Wen LIU, Shin-Puu JENG, Meng-Liang LIN, Shih-Yung PENG, Shih-Ting HUNG
  • Publication number: 20200105663
    Abstract: In an embodiment, a package includes: a first redistribution structure; a first integrated circuit die connected to the first redistribution structure; a ring-shaped substrate surrounding the first integrated circuit die, the ring-shaped substrate connected to the first redistribution structure, the ring-shaped substrate including a core and conductive vias extending through the core; a encapsulant surrounding the ring-shaped substrate and the first integrated circuit die, the encapsulant extending through the ring-shaped substrate; and a second redistribution structure on the encapsulant, the second redistribution structure connected to the first redistribution structure through the conductive vias of the ring-shaped substrate.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng
  • Publication number: 20200105544
    Abstract: Embodiments include forming an interposer having reinforcing structures disposed in a core layer of the interposer. The interposer may be attached to a package device by electrical connectors. The reinforcing structures provide rigidity and thermal dissipation for the package device. Some embodiments may include an interposer with an opening in an upper core layer of the interposer to a recessed bond pad. Some embodiments may also use connectors between the interposer and the package device where a solder material connected to the interposer surrounds a metal pillar connected to the package device.
    Type: Application
    Filed: April 1, 2019
    Publication date: April 2, 2020
    Inventors: Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang, Meng-Liang Lin, Shih-Ting Hung, Po-Yao Lin
  • Publication number: 20200050922
    Abstract: A recycling system and a method based on deep-learning and computer vision technology are disclosed. The system includes a trash sorting device and a trash sorting algorithm. The trash sorting device includes a trash arraying mechanism, trash sensors, a trash transfer mechanism and a controller. The trash arraying mechanism is configured to process trash in a batch manner. The controller drives the trash arraying mechanism according to the signals of trash sensors and controls the sorting gates of the trash sorting mechanism to rotate. The trash sorting algorithm makes use of the images of trash, wherein the images are taken by cameras in different directions. The trash sorting algorithm includes a dynamic object detection algorithm, an image pre-processing algorithm, an identification module and a voting and selecting algorithm. The identification module is based on the convolutional neural networks (CNNs) and may at least identify four kinds of trash.
    Type: Application
    Filed: January 28, 2019
    Publication date: February 13, 2020
    Inventors: Bing-Fei WU, Wan-Ju TSENG, Yu-Ming CHEN, Bing-Jhang WU, Yi-Chiao WU, Meng-Liang CHUNG
  • Publication number: 20200006214
    Abstract: A method includes forming an interposer, which includes forming a rigid dielectric layer, and removing portions of the rigid dielectric layer. The method further includes bonding a package component to an interconnect structure, and bonding the interposer to the interconnect structure. A spacer in the interposer has a bottom surface contacting a top surface of the package component, and the spacer includes a feature selected from the group consisting of a metal feature, the rigid dielectric layer, and combinations thereof. A die-saw is performed on the interconnect structure.
    Type: Application
    Filed: August 31, 2018
    Publication date: January 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng
  • Publication number: 20200006307
    Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.
    Type: Application
    Filed: November 16, 2018
    Publication date: January 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin
  • Publication number: 20200006176
    Abstract: A method for forming a chip package structure is provided. The method includes disposing a chip over a redistribution structure. The method includes forming a molding layer over the redistribution structure adjacent to the chip. The method includes partially removing the molding layer to form a trench in the molding layer, and the trench is spaced apart from the chip.
    Type: Application
    Filed: November 26, 2018
    Publication date: January 2, 2020
    Inventors: Po-Hao TSAI, Techi WONG, Meng-Wei CHOU, Meng-Liang LIN, Po-Yao CHUANG, Shin-Puu JENG
  • Publication number: 20190328246
    Abstract: A non-contact heartbeat rate measurement system includes an image sensor, a target region selecting module, a heartbeat signal calculating module, a spectrum analyzing module, a vibration detecting module, a heartbeat peak selecting module. When a signal quality indicator is greater than a threshold value, and a first peak with global highest signal intensity in a heartbeat spectrum is similar to a face vibration frequency, the heartbeat peak selecting module selects a second peak with local highest signal intensity from a part frequency band of the heartbeat spectrum as an output heartbeat frequency. A non-contact heartbeat rate measurement method and an apparatus are disclosed herein.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 31, 2019
    Inventors: Bing-Fei WU, Meng-Liang CHUNG, Tsong-Yang TSOU, Yun-Wei CHU, Kuan-Hung CHEN, Po-Wei HUANG, Yin-Yin YANG
  • Patent number: 10446522
    Abstract: Semiconductor devices and methods of forming the same are described. An embodiment is a device including a pad on a substrate. A passivation film is on the substrate and covering at least a portion of the pad. A first conductive feature is on the pad and has a planar top surface, with the first conductive feature having a first height as measured from the pad to the planar top surface of the first conductive feature. A second conductive feature is on the passivation film and has a non-planar top surface, with the second conductive feature having a second height as measured from the passivation film to the non-planar top surface of the second conductive feature.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: October 15, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Liang Lin, Cheng-Lin Huang
  • Publication number: 20190251336
    Abstract: A facial expression recognition training system includes a training module, feature database, a capturing module, a recognition module and an adjusting module. The training module trains a facial expression feature capturing model according to known face images. The feature database stores known facial expression features of the known face images. The capturing module continuously captures first face images, and the facial expression feature capturing model outputs facial expression features of the first face images according to the first face images. The recognition module compares the facial expression features and the known facial expression features, and fit the facial expression features to the first known facial expression features that is one kind of the known facial expression feature accordingly. The adjusting module adjusts the facial expression feature capturing model to reduce the differences between the facial expression features and the known facial expression features.
    Type: Application
    Filed: January 23, 2019
    Publication date: August 15, 2019
    Inventors: Bing-Fei WU, Chun-Hsien LIN, Meng-Liang CHUNG
  • Publication number: 20190246910
    Abstract: The present invention provides an imaging-type heart rate monitoring device and method thereof. It acquires the human image information tracks the target area in the human image information, and extracts the target image in the target area. It transforms the human image information through the first frequency domain transform. It filters the residual noise of the continuous wavelet transform information. It rebuilds the residual noise filtered information by the continuous wavelet transform. It transforms the continuous wavelet transform rebuilt information by the Fourier transform. It obtains a heart rate value through the second frequency domain transformed information.
    Type: Application
    Filed: July 19, 2018
    Publication date: August 15, 2019
    Applicant: National Chiao Tung University
    Inventors: Bing-Fei Wu, Po-Wei Huang, Tsong-Yang Tsou, Tzu-Min Lin, Meng-Liang Chung
  • Publication number: 20190246917
    Abstract: The present invention provides an image based blood pressure monitoring method, comprising: acquiring at least a human image information of at least a human skin area; according to the human image information to locate at least a ROI; extracting the human image information of the ROI, and calculate; filtering the average value of the human image information; monitoring the filtered signal; calculating an image pulse transmit time of the filtered signal, and calculating an inter-beat interval of the filtered signal; and employ the specific prediction model, to calculate a systolic pressure value and a diastolic pressure value.
    Type: Application
    Filed: July 20, 2018
    Publication date: August 15, 2019
    Applicant: National Chiao Tung University
    Inventors: Bing-Fei Wu, Po-Wei Huang, Chun-Hao Lin, Meng-Liang Chung, Tzu-Min Lin
  • Publication number: 20190246921
    Abstract: The present invention provides a contactless-type sport training monitor method, comprising: selecting at least an image database to recognize a plurality of expressions in the image database; making pre-processing for the plurality of expressions: using a convolutional neural network as a feature point extraction model; acquiring a human image; tracking a first target region and a second target region in the human image; making chrominance-based rPPG trace extraction; using the deep level model to compare the second target region image; and to calculate a post-exercise heart rate recovery achievement ratio, to judge the Rating of Perceived Exertion, and judging whether the human body is under overtraining status or not.
    Type: Application
    Filed: July 20, 2018
    Publication date: August 15, 2019
    Applicant: National Chiao Tung University
    Inventors: Bing-Fei Wu, Chun-Hsien Lin, Po-Wei Huang, Tzu-Min Lin, Meng-Liang Chung
  • Publication number: 20190209083
    Abstract: A monitoring system for infant includes image sensors, a face region determination module, a human face identification module, a non-contact physiological information measurement module and a physiological information determination module. The image sensors are configured to capture images consecutively. The face region determination module is configured to determine whether images include a face region. When not include, the face region determination module outputs a first warning information and when include, the human face identification module is configured to identify a monitored person in images to extract the historical information. The non-contact physiological information measurement module is configured to calculate color difference of each pixel of the face region, output heartbeat waveform and calculate physiological information.
    Type: Application
    Filed: January 8, 2019
    Publication date: July 11, 2019
    Inventors: Bing-Fei Wu, Kuan-Hung Chen, Meng-Liang Chung, Po-Wei Huang, Tsong-Yang Tsou, Yun-Wei Chu, Han-Kuang Kao
  • Patent number: 10003504
    Abstract: A management device includes a first server, a first control module, a management module connected to the first control module through the first server; and a first executing module connected to the first control module. When the first server is operating normally, the first server outputs a first signal to the first control module, the first control module controls the first executing module to operate corresponding to the first signal. When the first server is operating abnormally, the management module outputs a second signal, the first control module controls the first executing module to operate corresponding to the second signal.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: June 19, 2018
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN) CO., LTD.
    Inventor: Meng-Liang Yang
  • Patent number: 9996141
    Abstract: The disclosure storage device provides a hard disk drive (HDD) module, the HDD module includes a plurality of HDD units, and each the HDD unit include a plurality of HDDs, a switching unit, and a plurality of indication units. The switching unit configured for operating in a first state or a second state. Each indication unit is configured to electrically couple to the switching unit. When the switching unit outputs a first state signal, the switch control circuit outputs a first control signal to turn off the corresponding indicating control circuits. When the switch control circuit operates in the second state, the switch control circuit outputs a second control signal to turn on the corresponding indicating control circuits. An electronic device using the same is also provided.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: June 12, 2018
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD
    Inventors: Ching-Hsiang Chan, Jiing-Shyang Jang, Meng-Liang Yang
  • Patent number: 9904640
    Abstract: A program loading system effective for several different types of motherboard includes a first storage module, a first control module, first switch module, and a type module. The first control module is coupled between the first storage module and the first switch module. The first switch module is coupled between the first switch module and the type module. When a program stored in the first storage module is needed to be loaded, the first switch module is turned on. The type module outputs a motherboard type signal to the first control module through the first switch module. The first control module loads the program selectively according to the type signal received.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: February 27, 2018
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Meng-Liang Yang
  • Patent number: 9907203
    Abstract: A fan control circuit includes a power supply module, a timing circuit, and a switching circuit. The switching circuit is coupled to the timing circuit and is configured to couple to a fan module. The power supply module is coupled to the switching circuit and is capable of supplying power to the fan module via the switching circuit. The timing circuit is configured to output a first control signal to the switching circuit after receiving an input starting signal. The switching circuit is configured to deactivate after receiving the first control signal, thereby enabling the power supply module to stop supplying power to the fan module.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: February 27, 2018
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Meng-Liang Yang
  • Patent number: 9901006
    Abstract: A control circuit for a fan includes a temperature sensor, a fan controller, a first power supply unit, a second power supply unit, and a control unit. The second power supply unit supplies power to the fan, controlled by the control unit, when an electronic device is powered on. The first power supply unit supplies power to the fan controlled by the control unit, when the electronic device is in a standby mode.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: February 20, 2018
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jiing-Shyang Jang, Meng-Liang Yang
  • Patent number: 9824054
    Abstract: A firmware updating method in just a bunch of disks includes the following blocks. A motherboard is coupled to a first primary storage extension chip or to a second primary storage extension chip. The first primary storage extension chip and the second primary storage extension chip are coupled to each other. At least one secondary storage extension chip is coupled to the first primary storage extension chip. At least one secondary storage extension chip is coupled to the second primary storage extension chip. A signal sent to the first primary storage extension chip or to the second primary storage extension chip by the motherboard causes firmware of each storage extension chip to be updated.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: November 21, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jiing-Shyang Jang, Yang Gao, Meng-Liang Yang