Patents by Inventor Meng LIANG

Meng LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10835135
    Abstract: A non-contact heartbeat rate measurement system includes an image sensor, a target region selecting module, a heartbeat signal calculating module, a spectrum analyzing module, a vibration detecting module, a heartbeat peak selecting module. When a signal quality indicator is greater than a threshold value, and a first peak with global highest signal intensity in a heartbeat spectrum is similar to a face vibration frequency, the heartbeat peak selecting module selects a second peak with local highest signal intensity from a part frequency band of the heartbeat spectrum as an output heartbeat frequency. A non-contact heartbeat rate measurement method and an apparatus are disclosed herein.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: November 17, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Meng-Liang Chung, Tsong-Yang Tsou, Yun-Wei Chu, Kuan-Hung Chen, Po-Wei Huang, Yin-Yin Yang
  • Publication number: 20200352504
    Abstract: A drunken driving judgment system includes an image capturing module configured to obtain multiple images associated with a subject; a physiological parameter computing module coupled to the image capturing module, and configured to generate at least one physiological parameter according to the multiple images associated with the subject, wherein the at least one physiological parameter comprises at least one of a Remote PhotoPlethysmoGraphy, a heart rate, a heart rate variability, a blood oxygen, a breath rate, and a blood pressure; and an alcohol detection calculation unit coupled to the physiological parameter computing module, and configured to generate a drunken driving judgment result according to the at least one physiological parameter to indicate whether the subject is drunken.
    Type: Application
    Filed: July 17, 2019
    Publication date: November 12, 2020
    Inventors: Tsuey-Huey Shiue, Yin-Cheng Tsai, Kuan-Hung Chen, Meng-Liang Chung
  • Patent number: 10824936
    Abstract: A recycling system and a method based on deep-learning and computer vision technology are disclosed. The system includes a trash sorting device and a trash sorting algorithm. The trash sorting device includes a trash arraying mechanism, trash sensors, a trash transfer mechanism and a controller. The trash arraying mechanism is configured to process trash in a batch manner. The controller drives the trash arraying mechanism according to the signals of trash sensors and controls the sorting gates of the trash sorting mechanism to rotate. The trash sorting algorithm makes use of the images of trash, wherein the images are taken by cameras in different directions. The trash sorting algorithm includes a dynamic object detection algorithm, an image pre-processing algorithm, an identification module and a voting and selecting algorithm. The identification module is based on the convolutional neural networks (CNNs) and may at least identify four kinds of trash.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: November 3, 2020
    Assignee: National Chiao Tung University
    Inventors: Bing-Fei Wu, Wan-Ju Tseng, Yu-Ming Chen, Bing-Jhang Wu, Yi-Chiao Wu, Meng-Liang Chung
  • Publication number: 20200330622
    Abstract: Berberine or its derivatives are used in the preparation of myocardial perfusion imaging agents It has been verified using in vitro investigations, in vivo biodistribution, and small animal PET dynamic imaging, etc., that 18F-labeled berberine derivatives can specifically accumulate in cardiomyocytes or heart tissues, and has good distribution properties of targetting heart muscle in living animals, together with high contrast values of heart v.s. peripheral tissue (liver, lung, blood, muscle, bone, etc.).
    Type: Application
    Filed: June 7, 2018
    Publication date: October 22, 2020
    Inventors: Chengzhong FAN, Xiaoai WU, Meng LIANG, Xiaoli MEI, Tong ZHANG, Rang WANG, Haotian CHEN
  • Patent number: 10804254
    Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 13, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin
  • Patent number: 10803654
    Abstract: The invention is related to a method of three-dimensional face reconstruction by inputting a single face image to reconstruct a three-dimensional face model, therefore, the human face image is seen at various angles of three-dimensional face through rotating the model images.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: October 13, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Chun-Hsien Lin, Yi-Chiao Wu, Bing-Jhang Wu, Chih-Cheng Huang, Meng-Liang Chung
  • Publication number: 20200312773
    Abstract: A package structure and a formation method of a package structure are provided. The method includes forming a redistribution structure over a carrier substrate and disposing a semiconductor die over the redistribution structure. The method also includes stacking an interposer substrate over the redistribution structure. The interposer substrate extends across edges of the semiconductor die. The method further includes disposing one or more device elements over the interposer substrate. In addition, the method includes forming a protective layer to surround the semiconductor die.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 1, 2020
    Inventors: Po-Hao TSAI, Meng-Liang LIN, Po-Yao CHUANG, Techi WONG, Shin-Puu JENG
  • Patent number: 10790162
    Abstract: In an embodiment, a package includes: a first redistribution structure; a first integrated circuit die connected to the first redistribution structure; a ring-shaped substrate surrounding the first integrated circuit die, the ring-shaped substrate connected to the first redistribution structure, the ring-shaped substrate including a core and conductive vias extending through the core; a encapsulant surrounding the ring-shaped substrate and the first integrated circuit die, the encapsulant extending through the ring-shaped substrate; and a second redistribution structure on the encapsulant, the second redistribution structure connected to the first redistribution structure through the conductive vias of the ring-shaped substrate.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng
  • Patent number: 10779739
    Abstract: The present invention provides a contactless-type sport training monitor method, comprising: selecting at least an image database to recognize a plurality of expressions in the image database; making pre-processing for the plurality of expressions: using a convolutional neural network as a feature point extraction model; acquiring a human image; tracking a first target region and a second target region in the human image; making chrominance-based rPPG trace extraction; using the deep level model to compare the second target region image; and to calculate a post-exercise heart rate recovery achievement ratio, to judge the Rating of Perceived Exertion, and judging whether the human body is under overtraining status or not.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: September 22, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Chun-Hsien Lin, Po-Wei Huang, Tzu-Min Lin, Meng-Liang Chung
  • Patent number: 10776614
    Abstract: A facial expression recognition training system includes a training module, feature database, a capturing module, a recognition module and an adjusting module. The training module trains a facial expression feature capturing model according to known face images. The feature database stores known facial expression features of the known face images. The capturing module continuously captures first face images, and the facial expression feature capturing model outputs facial expression features of the first face images according to the first face images. The recognition module compares the facial expression features and the known facial expression features, and fit the facial expression features to the first known facial expression features that is one kind of the known facial expression feature accordingly. The adjusting module adjusts the facial expression feature capturing model to reduce the differences between the facial expression features and the known facial expression features.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: September 15, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Chun-Hsien Lin, Meng-Liang Chung
  • Publication number: 20200211962
    Abstract: A package structure and method for forming the same are provided. The package structure includes a die structure formed over a first interconnect structure, and the die structure includes a first region and a second region. The package structure includes a dam structure formed on the first region of the die structure, and a second interconnect structure formed over the die structure and the dam structure. The package structure also includes a package layer formed between the first interconnect structure and the second interconnect structure, and the package layer is formed on the second region of the die structure to surround the dam structure.
    Type: Application
    Filed: April 10, 2019
    Publication date: July 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Hao TSAI, Techi WONG, Meng-Liang LIN, Yi-Wen WU, Po-Yao CHUANG, Shin-Puu JENG
  • Patent number: 10694959
    Abstract: The present invention provides an image based blood pressure monitoring method, comprising: acquiring at least a human image information of at least a human skin area; according to the human image information to locate at least a ROI; extracting the human image information of the ROI, and calculate; filtering the average value of the human image information; monitoring the filtered signal; calculating an image pulse transmit time of the filtered signal, and calculating an inter-beat interval of the filtered signal; and employ the specific prediction model, to calculate a systolic pressure value and a diastolic pressure value.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 30, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Po-Wei Huang, Chun-Hao Lin, Meng-Liang Chung, Tzu-Min Lin
  • Publication number: 20200184229
    Abstract: A people-flow analysis system includes an image source, a computing device, and a host. The image source captures a first image and a second image. The computing device is connected to the image source. The computing device identifies the first image according to a data set to generate a first detecting image. The first detecting image has a position box corresponding to a pedestrian in the first image. The computing device generates a tracking image according to the data set and a difference between the first detecting image and the second image. The tracking image has another position box corresponding to a pedestrian in the second image. The host is connected to the computing device and generates a people-flow list according to the first detecting image and the tracking image.
    Type: Application
    Filed: July 8, 2019
    Publication date: June 11, 2020
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: BING-FEI WU, CHUN-HSIEN LIN, PO-WEI HUANG, MENG-LIANG CHUNG
  • Publication number: 20200167990
    Abstract: The invention is related to a method of three-dimensional face reconstruction by inputting a single face image to reconstruct a three-dimensional face model, therefore, the human face image is seen at various angles of three-dimensional face through rotating the model images.
    Type: Application
    Filed: September 23, 2019
    Publication date: May 28, 2020
    Inventors: BING-FEI WU, CHUN-HSIEN LIN, YI-CHIAO WU, BING-JHANG WU, CHIH-CHENG HUANG, MENG-LIANG CHUNG
  • Publication number: 20200135653
    Abstract: Structures and formation methods of a package structure are provided. The method includes forming a conductive structure over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes pressing a protective substrate against the carrier substrate at an elevated temperature to bond the protective substrate to the conductive structure. The method further includes forming a protective layer to surround the semiconductor die.
    Type: Application
    Filed: June 11, 2019
    Publication date: April 30, 2020
    Inventors: Po-Hao TSAI, Hsien-Wen LIU, Shin-Puu JENG, Meng-Liang LIN, Shih-Yung PENG, Shih-Ting HUNG
  • Publication number: 20200105663
    Abstract: In an embodiment, a package includes: a first redistribution structure; a first integrated circuit die connected to the first redistribution structure; a ring-shaped substrate surrounding the first integrated circuit die, the ring-shaped substrate connected to the first redistribution structure, the ring-shaped substrate including a core and conductive vias extending through the core; a encapsulant surrounding the ring-shaped substrate and the first integrated circuit die, the encapsulant extending through the ring-shaped substrate; and a second redistribution structure on the encapsulant, the second redistribution structure connected to the first redistribution structure through the conductive vias of the ring-shaped substrate.
    Type: Application
    Filed: December 3, 2018
    Publication date: April 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng
  • Publication number: 20200105544
    Abstract: Embodiments include forming an interposer having reinforcing structures disposed in a core layer of the interposer. The interposer may be attached to a package device by electrical connectors. The reinforcing structures provide rigidity and thermal dissipation for the package device. Some embodiments may include an interposer with an opening in an upper core layer of the interposer to a recessed bond pad. Some embodiments may also use connectors between the interposer and the package device where a solder material connected to the interposer surrounds a metal pillar connected to the package device.
    Type: Application
    Filed: April 1, 2019
    Publication date: April 2, 2020
    Inventors: Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang, Meng-Liang Lin, Shih-Ting Hung, Po-Yao Lin
  • Publication number: 20200050922
    Abstract: A recycling system and a method based on deep-learning and computer vision technology are disclosed. The system includes a trash sorting device and a trash sorting algorithm. The trash sorting device includes a trash arraying mechanism, trash sensors, a trash transfer mechanism and a controller. The trash arraying mechanism is configured to process trash in a batch manner. The controller drives the trash arraying mechanism according to the signals of trash sensors and controls the sorting gates of the trash sorting mechanism to rotate. The trash sorting algorithm makes use of the images of trash, wherein the images are taken by cameras in different directions. The trash sorting algorithm includes a dynamic object detection algorithm, an image pre-processing algorithm, an identification module and a voting and selecting algorithm. The identification module is based on the convolutional neural networks (CNNs) and may at least identify four kinds of trash.
    Type: Application
    Filed: January 28, 2019
    Publication date: February 13, 2020
    Inventors: Bing-Fei WU, Wan-Ju TSENG, Yu-Ming CHEN, Bing-Jhang WU, Yi-Chiao WU, Meng-Liang CHUNG
  • Publication number: 20200006214
    Abstract: A method includes forming an interposer, which includes forming a rigid dielectric layer, and removing portions of the rigid dielectric layer. The method further includes bonding a package component to an interconnect structure, and bonding the interposer to the interconnect structure. A spacer in the interposer has a bottom surface contacting a top surface of the package component, and the spacer includes a feature selected from the group consisting of a metal feature, the rigid dielectric layer, and combinations thereof. A die-saw is performed on the interconnect structure.
    Type: Application
    Filed: August 31, 2018
    Publication date: January 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng
  • Publication number: 20200006307
    Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.
    Type: Application
    Filed: November 16, 2018
    Publication date: January 2, 2020
    Inventors: Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou, Meng-Liang Lin