Abstract: An anti-fuse array includes first through fourth adjacent anti-fuse bit columns, the anti-fuse bits of the first and second anti-fuse bit columns including portions of active areas of a first active area column, and the anti-fuse bits of the third and fourth anti-fuse bit columns including portions of active areas of a second active area column. Each row of a first set of conductive segment rows includes first and second conductive segments positioned between adjacent active areas of the first active area column and a third conductive segment positioned between adjacent active areas of the second active area column. Each row of a second set of conductive segments alternating with the first set of conductive segment rows includes a fourth conductive segment positioned between adjacent active areas of the first active area column and fifth and sixth conductive segments positioned between adjacent active areas of the second active area column.

Abstract: A device includes a memory cell that randomly presents either a first logic state or a second logic state. The memory cell includes: a plurality of first nanostructures extending along a first lateral direction; a plurality of second nanostructures extending along the first lateral direction and disposed at a first side of the plurality of first nanostructures; a plurality of third nanostructures extending along the first lateral direction and disposed at a second side of the plurality of first nanostructures; a dielectric fin structure disposed immediately next to the plurality of first nanostructures along a second lateral direction, wherein a first sidewall of each of the plurality of first nanostructures facing toward or away from the second lateral direction is in contact with the dielectric fin structure; and a first gate structure wrapping around each of the plurality of first nanostructures except for the first sidewall.

Abstract: A method of forming a memory cell includes: providing a semiconductor substrate; forming an active region on the semiconductor substrate; providing a first conductive line over a first portion of the active region to form a first transistor coupled to a bit line of the memory cell; providing a second conductive line over a second portion of the active region to form a second transistor coupled to the bit line of the memory cell; and providing a third conductive line over a third portion of the active region to form a third transistor coupled to a first word line of the memory cell. The first transistor and the second transistor are disposed on two sides of the third transistor, and the third transistor electrically couples the first transistor to the second transistor. A threshold voltage of the second transistor is different from a threshold voltage of the first transistor.

Abstract: A memory device is disclosed. The memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

Abstract: A memory device is disclosed. The memory device includes a plurality of memory cells, each of the memory cells including an access transistor and a resistor coupled to each other in series. The resistors of the memory cells are each formed as one of a plurality of interconnect structures disposed over a substrate. The access transistors of the memory cells are disposed opposite a first metallization layer containing the plurality of interconnect structures from the substrate.

Abstract: In some aspects of the present disclosure, a memory circuit is disclosed. In some aspects, the memory circuit includes a first memory cell including a first resistor; and a first transistor coupled to the first resistor, wherein a first bulk port of the first transistor is biased at a first voltage level; a second memory cell coupled to the first memory cell, the second memory cell including a second resistor; and a second transistor coupled to the second memory cell, wherein a second bulk port of the second transistor is biased at a second voltage level, wherein the second voltage level is less than the first voltage level.

Abstract: A method includes receiving a design rule deck including a predetermined set of widths and spacings associated with active regions. The method also includes providing a cell library including cells having respective active regions, wherein widths and spacings of the active regions are selected from the predetermined set of the design rule deck. The method includes placing a first cell and a second cell from the cell library in a design layout. The first cell has a cell height in a first direction, and a first active region having a first width in the first direction. The second cell has the cell height, and a second active region having a second width in the first direction. The second width is different from the first width. The method further includes manufacturing a semiconductor device according to the design layout.

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a first set of memory cells including a first subset of memory cells and a second subset of memory cells. In one aspect, the memory array includes a first switch including a first electrode connected to first electrodes of the first subset of memory cells, and a second electrode connected to a first global line. In one aspect, the memory array includes a second switch including a first electrode connected to first electrodes of the second subset of memory cells, and a second electrode connected to the first global line.

Abstract: A memory device is disclosed. The memory device includes a transistor. The memory device includes a resistor electrically coupled to the transistor, the transistor and the resistor forming an electrical fuse (eFuse) memory cell. The memory device includes a plurality of interconnect structures formed over a source/drain structure of the transistor. The memory device includes a plurality of via structures formed over the source/drain structure of the transistor. The resistor is disposed between the source/drain structure of the transistor and a topmost one of the plurality of interconnect structures. The resistor is formed of titanium nitride (TiN).

Abstract: Disclosed herein are related to a memory array. In one aspect, the memory array includes a set of resistive storage circuits including a first subset of resistive storage circuits connected between a first local line and a second local line in parallel. The first local line and the second local line may extend along a first direction. In one aspect, for each resistive storage circuit of the first subset of resistive storage circuits, current injected at a first common entry point of the first local line exits through a first common exit point of the second local line, such that each resistive storage circuit of the first subset of resistive storage circuits may have same or substantial equal resistive loading.

Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.

Abstract: A memory device includes a first memory cell having a first polysilicon line associated with a first read word line and intersecting a first active region and a second active region, and a second polysilicon line and a first CPODE associated with a first program word line, the second polysilicon line intersecting the first active region and the first CPODE intersecting the second active region. The memory device also includes a second memory cell adjacent to the first memory cell, the second memory cell having a third polysilicon line associated with a second read word line and intersecting the first active region and the second active region, and a fourth polysilicon line and a second CPODE associated with a second program word line, the fourth polysilicon line intersecting the second active region and the second CPODE intersecting the first active region to form a cross-arrangement of CPODE.

Abstract: A method of generating an IC layout diagram includes abutting first and second cells to define a first active region including first and second anti-fuse bits, abutting third and fourth cells to define a second active region including third and fourth anti-fuse bits, and defining a third active region including fifth and sixth anti-fuse bits adjacent to the first through fourth anti-fuse bits. The first cell includes first and second via regions overlapping first and second gate regions shared by respective structures and transistors of the first, third, and fifth anti-fuse bits, the fourth cell includes third and fourth via regions overlapping third and fourth gate regions shared by respective transistors and structures of the second, fourth, and sixth anti-fuse bits, the third cell includes fifth and sixth via regions overlapping the first gate region, and the second cell includes seventh and eighth via regions overlapping the fourth gate region.

Abstract: A method includes receiving a design rule deck including a predetermined set of widths and spacings associated with active regions. The method also includes providing a cell library including cells having respective active regions, wherein widths and spacings of the active regions are selected from the predetermined set of the design rule deck. The method includes placing a first cell and a second cell from the cell library in a design layout. The first cell has a cell height in a first direction, and a first active region having a first width in the first direction. The second cell has the cell height, and a second active region having a second width in the first direction. The second width is different from the first width. The method further includes manufacturing a semiconductor device according to the design layout.

Abstract: A memory device includes a plurality of memory cells, each of which includes a first transistor, a second transistor, and a resistor operatively coupled to each other in series. Each of the first and second transistors include a sub-transistor, the sub-transistor having a channel structure, a source structure disposed on one side of the channel structure, and a drain structure disposed on the other side of the channel structure. The resistor includes a metal structure disposed above the first and second transistors. The channel structures, source structures, and drain structures of the sub-transistors are all formed in a first active region of a substrate.

Abstract: A memory circuit includes a first programming device, a first circuit branch and a second circuit branch. The first programming device includes a first control terminal coupled to a first word line, and a first connecting end. The first circuit branch includes a first diode, and a first fuse element coupled to the first diode. The second circuit branch includes a second diode, and a second fuse element coupled to the second diode. The first circuit branch and the second circuit branch are coupled to the first connecting end of the first programming device.

Abstract: A metal fuse structure may be provided. The metal fuse structure may comprise a first fuse element and a second fuse element. The second fuse element may be adjacent to the first fuse element for a length L. The second fuse element may be spaced apart from first fuse element by a width W.

Abstract: An IC device includes a first anti-fuse structure including a first dielectric layer between a first gate conductor and a first active area, and a second anti-fuse structure including a second dielectric layer between a second gate conductor and the first active area. A first via is electrically connected to the first gate conductor at a first location a first distance from the first active area, a second via is electrically connected to the second gate conductor at a second location a second distance from the first active area, and the first distance is approximately equal to the second distance.

Abstract: A method includes: programming a first bit of a physical unclonable function into a first memory cell; and generating, by a first memory circuit in the first memory cell, a first current indicating a logic value of the first bit. The programming the first bit includes: turning on a first switch in the first memory circuit and at least one second switch in at least one second memory circuit in the first memory cell in response to a first bit line signal, to program one of the first memory circuit and the at least one second memory circuit while rest of the first memory circuit and the at least one second memory circuit is not programmed, according to the first bit line signal. A memory device and a system are also disclosed herein.

Abstract: A fusible structure includes: a metal line in a first metal layer extending along a first direction; and a first dummy structure disposed proximal to the metal line relative to a second direction, the second direction being perpendicular to the first direction, the first dummy structure being in a second metal layer. Relative to the first direction, the metal line includes first, second and third portions, the second portion being between the first portion and third portion. Relative to a third direction that is perpendicular to the first direction and the second direction, the first portion has a first thickness and the second portion has a second thickness, the first thickness being greater than the second thickness.