Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer has a structure represented by Formula (I) wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; n?0; m?1; n:m is from 0:100 to 99:1; the oligomer has a number average molecular weight of less than or equal to 12,000; and the repeat unit and the repeat unit are arranged in a random or block fashion.

Abstract: A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.

Abstract: A physiological signal measuring method and a physiological signal measuring device are provided. The physiological signal measuring method includes the following steps: A first inputting signal having a first frequency, a second inputting signal having a second frequency and a third inputting signal having a third frequency are respectively inputted to at least two electrode sheets attached on a skin. A first impedance value corresponding to the first inputting signal, a second impedance value corresponding to the second inputting signal and a third impedance value corresponding to the third inputting signal are respectively measured. An interference impedance between the electrode sheets and the skin is obtained according to the first frequency, the second frequency, the third frequency, the first impedance value, the second impedance value and the third impedance value. A measured physiological signal is corrected according to the interference impedance to obtain a corrected physiological signal.

Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be or a combination thereof, wherein a is 0 or 1, and R1 is independently hydrogen or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is wherein R2 is C5-10 alkyl group. The reactant (d) is wherein e is 0-10.

Abstract: A physiological signal measuring method and a physiological signal measuring device are provided. The physiological signal measuring method includes the following steps: A first inputting signal having a first frequency, a second inputting signal having a second frequency and a third inputting signal having a third frequency are respectively inputted to at least two electrode sheets attached on a skin. A first impedance value corresponding to the first inputting signal, a second impedance value corresponding to the second inputting signal and a third impedance value corresponding to the third inputting signal are respectively measured. An interference impedance between the electrode sheets and the skin is obtained according to the first frequency, the second frequency, the third frequency, the first impedance value, the second impedance value and the third impedance value. A measured physiological signal is corrected according to the interference impedance to obtain a corrected physiological signal.

Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer has a structure represented by Formula (I) wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; n?0; m?1; n:m is from 0:100 to 99:1; the oligomer has a number average molecular weight of less than or equal to 12,000; and the repeat unit and the repeat unit are arranged in a random or block fashion.

Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer has a structure represented by Formula (I) wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; n?0; m?1; n:m is from 0:100 to 99:1; the oligomer has a number average molecular weight of less than or equal to 12,000; and the repeat unit and the repeat unit are arranged in a random or block fashion.

Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be or a combination thereof, wherein a is 0 or 1, and R1 is independently hydrogen or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is wherein R2 is C5-10 alkyl group. The reactant (d) is wherein e is 0-10.

Abstract: A sensing device has a first substrate, a second substrate, a plurality of sets of first electrodes, a plurality of second electrodes, a plurality of first axis signal lines, a plurality of second axis signal lines, and a plurality of second signal lines. The second substrate is above the first substrate and has a reset structure. The second electrodes are on the first surface of the second substrate in array. Each set of first electrodes is on the first substrate in array, corresponding to one of the plurality of second electrodes, and having at least one first axis electrode and at least one second axis electrode. The first axis electrode and the second axis electrode both partially overlap with the corresponding second electrode.

Abstract: A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.

Abstract: A sensing device has a first substrate, a second substrate, a plurality of sets of first electrodes, a plurality of second electrodes, a plurality of first axis signal lines, a plurality of second axis signal lines, and a plurality of second signal lines. The second substrate is above the first substrate and has a reset structure. The second electrodes are on the first surface of the second substrate in array. Each set of first electrodes is on the first substrate in array, corresponding to one of the plurality of second electrodes, and having at least one first axis electrode and at least one second axis electrode. The first axis electrode and the second axis electrode both partially overlap with the corresponding second electrode.

Abstract: The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: The invention provides a low dielectric material. The low dielectric material comprises: (i) 5-50 parts by weight of polyphenylene ether (PPE) resin having a Mw of 1000˜7000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8; and (ii) 10-90 parts by weight of liquid crystal polymer with allyl group having a Mw of 1000˜5000, a Mn of 1000-4000 and Mw/Mn=1.0-1.8, wherein the dielectric material has Dk of 3.4-4.0 and Df of 0.0025-0.0050.

Abstract: The invention provides a dielectric material with low dielectric loss. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: Disclosed is a prepreg, including a reinforcing material and a polymer, wherein the polymer is polymerized from a monomer, an oligomer, or combinations thereof of an organic rod-like molecule. The organic rod-like molecule has at least one photo-polymerizable group. The organic rod-like molecule has the magnetic susceptibility along its long-axis direction (M1) greater than the magnetic susceptibility along other directions (M2), and the magnetic susceptibility ratio (M1/M2) is greater than 0.01 and less than 1.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.

Abstract: A layered clay material is modified by ion exchange with (1) ZrOCl2 and (2) a silane surfactant. The modified clay material is heat-kneaded with epoxy oligomers to undergo polymerization, thus obtaining an epoxy/clay composite comprising the clay material uniformly dispersed in the epoxy resin matrix on a nano-scale. The epoxy/clay nanocomposite has excellent adhesion and less hygroscopicity, which makes it especially suitable as molding or packaging material for electronic devices.

Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.