Abstract: A 24 GHz band-pass filter includes a step impedance resonator, a first U-shape feeding portion, a second U-shape feeding portion, short-circuit stubs and open-circuit stubs. The step impedance resonator includes a first main portion, a second main portion, and a connection portion for connecting the main portions to each other. The first main portion and the second main portion are electrically connected to a first signal input/output port and a second signal input/output port. The first U-shape feeding portion is electrically connected between the first main portion and the first signal input/output port. The second U-shape feeding portion is electrically connected between the second main portion and the second signal input/output port. The short-circuit stubs are electrically connected to coupling segments of the step impedance resonator. The open-circuit stubs are electrically connected to the first U-shape feeding portion and the second U-shape feeding portion.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: The present invention provides an artificial dressing and a use of the artificial dressing for promoting wound healing. The artificial dressing includes a gelatin and a fungal extract.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.

Abstract: A method for UE route selection policy (URSP) rule matching is proposed. URSP is used by a UE to determine if a detected application can be associated to an established PDU session, can be offload to non-3GPP access outside a PDU session, or can trigger the establishment of a new PDU session. The UE first finds a non-default URSP rule with a matching traffic descriptor to the application. When the UE fails to find existing PDU session or setup new PDU session with any or the route selection descriptors of the non-default URSP rule, the UE moves to another non-default URSP rule, if any, and try the matching. If all non-default URSP rules cannot be matched with the application, then the UE tries the default URSP rule, which includes a match-all traffic descriptor.

Abstract: A thermal radiation heat dissipation device includes a radiation heat transfer pile including a plurality of polar dielectric material units of high energy gap, the polar dielectric material units each including at least one light scattering unit and a thermal radiation unit. The light scattering unit interacts with solar radiation to generate scattering of light. The thermal radiation unit interacts with thermal radiation to increase strength of thermal radiation.

Abstract: A method for UE route selection policy (URSP) rule matching is proposed. URSP is used by a UE to determine if a detected application can be associated to an established PDU session, can be offload to non-3GPP access outside a PDU session, or can trigger the establishment of a new PDU session. The UE first finds a non-default URSP rule with a matching traffic descriptor to the application. When the UE fails to find existing PDU session or setup new PDU session with any or the route selection descriptors of the non-default URSP rule, the UE moves to another non-default URSP rule, if any, and try the matching. If all non-default URSP rules cannot be matched with the application, then the UE tries the default URSP rule, which includes a match-all traffic descriptor.

Abstract: A method for UE route selection policy (URSP) rule matching is proposed. URSP is used by a UE to determine if a detected application can be associated to an established PDU session, can be offload to non-3GPP access outside a PDU session, or can trigger the establishment of a new PDU session. The UE first finds a non-default URSP rule with a matching traffic descriptor to the application. When the UE fails to find existing PDU session or setup new PDU session with any or the route selection descriptors of the non-default URSP rule, the UE moves to another non-default URSP rule, if any, and try the matching. If all non-default URSP rules cannot be matched with the application, then the UE tries the default URSP rule, which includes a match-all traffic descriptor.

Abstract: A lithium ion battery silicon carbon electrode material and a preparation method thereof are provided. The lithium ion battery silicon carbon electrode material includes a graphite particle and a resin carbon layer. The resin carbon layer is smoothly coated on a surface of the graphite particle, and silicon or a silicon compound and a conductive material are coated in the resin carbon layer.

Abstract: A method for UE route selection policy (URSP) rule matching is proposed. URSP is used by a UE to determine if a detected application can be associated to an established PDU session, can be offload to non-3GPP access outside a PDU session, or can trigger the establishment of a new PDU session. The UE first finds a non-default URSP rule with a matching traffic descriptor to the application. When the UE fails to find existing PDU session or setup new PDU session with any or the route selection descriptors of the non-default URSP rule, the UE moves to another non-default URSP rule, if any, and try the matching. If all non-default URSP rules cannot be matched with the application, then the UE tries the default URSP rule, which includes a match-all traffic descriptor.

Abstract: Digital controlled delay lines are provided. A digital controlled delay line includes a plurality of delay cells coupled in a chain forming a propagation path to propagate an input signal and to delay the input signal by a delay time. The propagation path is formed when a single delay cell is operated in a feedback mode, the delay cells previous to the single delay cell in the chain are operated in a propagation mode, a subsequent delay cell following the single delay cell in the chain is operated in a standby mode, and the delay cells following the first subsequent delay cell in the chain are operated in an idle mode.

Abstract: Digital controlled delay lines are provided. A digital controlled delay line includes a plurality of delay cells coupled in a chain forming a propagation path to propagate an input signal and to delay the input signal by a delay time. The propagation path is formed when a single delay cell is operated in a feedback mode, the delay cells previous to the single delay cell in the chain are operated in a propagation mode, a subsequent delay cell following the single delay cell in the chain is operated in a standby mode, and the delay cells following the first subsequent delay cell in the chain are operated in an idle mode.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.

Abstract: A LED package structure including a carrier substrate, a flip-chip LED and a molding compound is provided. The carrier substrate includes a main body and a patterned conductive layer embedded in the main body. The main body is composed of polymer material. The main body has a cavity, and a bottom surface of the cavity is aligned with an upper surface of the patterned conductive layer. A difference in coefficient of thermal expansion between the main body in a rubbery state and the patterned conductive layer is smaller than 30 ppm/° C. The flip-chip LED is disposed inside the cavity and electrically connected to the patterned conductive layer. The molding compound is disposed inside the cavity and encapsulates the flip-chip LED. A vertical distance between a top surface of the molding compound and the bottom surface of the cavity is smaller than or equal to a depth of the cavity.

Abstract: A circuit board for driving a flip-chip light emitting chip is disclosed. The circuit board includes a metal substrate having a first surface and a second surface, the first surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area for providing a first voltage; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area for providing a second voltage; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the first surface; wherein the heat conduction area is exposed from the solder resist layer.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.