Patents by Inventor Meng Tzu

Meng Tzu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11733219
    Abstract: Detection reagent is formed by reacting a catalyst and xanthydrol. The catalyst includes an active component loaded on a support, wherein the active component includes Pt, Ru, Rh, or a combination thereof, and the support includes carbon material, silica, alumina, or calcium carbonate. The detection reagent can be used to detect the primary amide compound.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: August 22, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jie-Bi Hu, Chin-Ping Huang, Meng-Tzu Lai, Hsiao-Mei Wu, Pei-Hua Yeh, Tzu-Chia Lai, Jhih-Yun Lin
  • Publication number: 20230250829
    Abstract: A ceiling fan includes at least one rotary shaft that has a seat being semi-circular and a guiding portion being semi-spherical and having a guiding surface. A lower sealing ring of the ceiling fan has at least one protrusion. The guiding portion is mounted through the lower sealing ring and the guiding surface abuts against the at least one protrusion. With the seat of the rotary shaft being semi-circular and the guiding portion being semi-spherical, when the rotary shaft is rotated, the guiding surface and the at least one protrusion coordinate with each other to rotate. The rotary shaft has reduced volume. Accordingly, the ceiling fan having the rotary shaft is lightweight, has reduced power consumption and manufacturing cost, and is easy for installation.
    Type: Application
    Filed: January 11, 2023
    Publication date: August 10, 2023
    Inventors: Meng-Tzu WU, Sheng-Pu LEE
  • Publication number: 20210293765
    Abstract: Detection reagent is formed by reacting a catalyst and xanthydrol. The catalyst includes an active component loaded on a support, wherein the active component includes Pt, Ru, Rh, or a combination thereof, and the support includes carbon material, silica, alumina, or calcium carbonate. The detection reagent can be used to detect the primary amide compound.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 23, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jie-Bi HU, Chin-Ping HUANG, Meng-Tzu LAI, Hsiao-Mei WU, Pei-Hua YEH, Tzu-Chia LAI, Jhih-Yun LIN
  • Publication number: 20170183470
    Abstract: An amino-containing silica particle is provided. The amino-containing silica particle is obtained by hydrolysis-condensation reaction of an alkoxy silane represented by formula (I), an alkoxy silane represented by formula (II) and a catalyst: Si(OR1)4??formula (I) (NH2—Y)m—Si(OR2)4-m??formula (II) wherein in formula (I), R1 is a C1-C10 alkyl group, and in formula (II), Y is a C1-C10 alkyl group or a C2-C10 alkenyl group, R2 is a C1-C10 alkyl group, and m is an integer of 1 to 3.
    Type: Application
    Filed: February 24, 2016
    Publication date: June 29, 2017
    Inventors: Shang-Chih Chou, Meng-Tzu Hsiao
  • Publication number: 20130203033
    Abstract: An educational gaming device for learning evolutionism comprises a display device, a storage device and an operation unit. The storage device stores at least one scene and a plurality of corresponding representative creatures. The storage device and the display device are coupled to the operation unit. The operation unit selects at least two creatures from the representative creatures to respectively function as at least one player character and at least one non-player character. The operation unit drives the display device to show the process of interactivity and evolution of the player character and the non-player character in the scene. The game of the present invention features clear rules, instant feedbacks and competitions, and has much more interaction with the users than common instructional activities or common educational animations.
    Type: Application
    Filed: April 5, 2012
    Publication date: August 8, 2013
    Inventors: Meng-Tzu Cheng, Yu-Wen Lin, Hsiao-Ching She
  • Patent number: 7575045
    Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: August 18, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7327575
    Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: February 5, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Patent number: 7269010
    Abstract: A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: September 11, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7180746
    Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: February 20, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Patent number: 7131485
    Abstract: A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to the fasteners, and engage with the heat sink to thereby attach the fan to the heat sink.
    Type: Grant
    Filed: December 17, 2004
    Date of Patent: November 7, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Publication number: 20060133038
    Abstract: A retaining device (20) for mounting a heat sink (30) to an electronic device (40) includes an unitary metal wire clip (22), a locking device (26) and a camming member (24). The clip includes a pair of spaced apart pressing beams (221), at least one latching beam (223) and a crossbeam (225). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam (242) being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.
    Type: Application
    Filed: December 17, 2004
    Publication date: June 22, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Patent number: 7063136
    Abstract: A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: June 20, 2006
    Assignee: HON HAI Precision Industry Co., LTD
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060120044
    Abstract: A heat dissipating apparatus includes a heat sink (20) having a base plate (22) for contacting an electronic component (10). A number of main fins (24) extend from the base plate. A cooling fan (30) is mounted on the heat sink. A center of the cooling fan offsets in a first direction from a center of the electronic component, so that a portion of the cooling fan that generates more and stronger airflows than the center of the cooling fan does is aligned with the center of the electronic component.
    Type: Application
    Filed: October 3, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology Co., Ltd
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Jun Luo
  • Publication number: 20060120046
    Abstract: A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.
    Type: Application
    Filed: August 15, 2005
    Publication date: June 8, 2006
    Applicant: Foxconn Technology CO., LTD.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7028758
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: April 18, 2006
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: 7025125
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: April 11, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060042787
    Abstract: A heat dissipation device includes a heat sink (10), thermal interface material (30) spread on a bottom surface (16) of the heat sink, two legs (22) of a clip (20) disposed at opposite sides of the heat sink, and a protective cap (40) enclosing the thermal interface material therein. The protective cap includes ears (48) interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member (52) on a printed circuit board (50) thereby firmly mounting the heat sink to a CPU (54) on the printed circuit board.
    Type: Application
    Filed: May 23, 2005
    Publication date: March 2, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin
  • Publication number: 20060007654
    Abstract: A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to the fasteners, and engage with the heat sink to thereby attach the fan to the heat sink.
    Type: Application
    Filed: December 17, 2004
    Publication date: January 12, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Publication number: 20050263265
    Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.
    Type: Application
    Filed: December 21, 2004
    Publication date: December 1, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Jian-Qing Sheng, Meng-Tzu Lee, Shu-Ho Lin
  • Patent number: D514529
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 7, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee