Abstract: A cooling apparatus for dissipating heat from an electronic component, includes a body and two lids. The body is integrally formed by extruding a claviform aluminum stuff and includes a hollow tube with two open ends on opposite ends thereof and a plurality of fins integrally extending from the periphery of the tube. The two lids respectively seal the two open ends of the tube and form a chamber in the body. A wicking structure is installed on the inner peripheral surface of the tube. Heat-conductive evaporable working medium is contained in the chamber for transmitting heat absorbed by one of the lids contacting with the electronic component.

Abstract: A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe is U-shaped and includes an evaporative section attached to the heat receiver, a pair of condesative sections received in the holes of the fins, and a pair of curved sections connected between opposite ends of the evaporative section and the condensative sections respectively and received in the enlarged openings.

Abstract: A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.

Abstract: A locking device (10) for securing a heat sink (20) to a heat generating component (30) includes a pair of operating members (14) and a pair of locking members (16). Each operating member includes a pivot shaft (142) defining an axis and an operation handle (144) extending from the pivot shaft along a first direction. The pivot shaft has an offset section (146) offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.

Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (10), a plurality of heat-dissipating fins (30) and at least one heat pipe (20). The base defines at least a groove (13) thereon. The heat pipe comprises an evaporating portion (22) received in the groove and a condensing portion (21) extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.

Abstract: A heat sink fastener (10) includes a pressing beam (20), a clamping beam (30), and an operating lever (40). The pressing beam includes a first pivot portion (26) at one end thereof, and a hook (242) at an opposite end thereof. The clamping beam has a second pivot portion (32) at a top end thereof, and a hook (34) at a bottom end thereof. The operating lever is pivotally engaged with each of the first and second pivot portions. The operating lever includes a pair of parallel pivot plates (44), each forming a protrusion (446) on an internal face thereof. In use of the fastener, the fastener is unlocked when the protrusions and the clamping beam are disposed at a same side of the first pivot portion. The fastener is locked when the protrusions and the clamping beam are disposed at opposite sides of the first pivot portion.

Abstract: A heat sink fastener (10) includes a pressing beam (20), a clamping beam (30), and an operating lever (40). The pressing beam includes a first pivot portion (26) at one end thereof, and a hook (242) at an opposite end thereof. The clamping beam has a second pivot portion (32) at a top end thereof, and a hook (34) at a bottom end thereof. The operating lever is pivotally engaged with each of the first and second pivot portions. The operating lever includes a pair of parallel pivot plates (44), each forming a protrusion (446) on an internal face thereof. In use of the fastener, the fastener is unlocked when the protrusions and the clamping beam are disposed at a same side of the first pivot portion. The fastener is locked when the protrusions and the clamping beam are disposed at opposite sides of the first pivot portion.

Abstract: A method for controlling the overflow of roaming users in a public or private mobile communication system. When the number of roaming users is greater than the number of the roaming numbers in a specific region, a newly arriving roaming user is assigned the roaming number of an inactive roaming user already registered in the network, who becomes then an overflow roaming user. Should an overflow roaming user require the use of the mobile communication functions, for example to make or receive a call, the overflow roaming user is in turn assigned the roaming number of another inactive user, who then becomes an overflow user. By this method, a number of roaming numbers can be shuffled between a larger number of roaming users and roaming users arriving into a network with an overflow of roaming users are still able to access the mobile communication functions.

Abstract: A method and apparatus are provided for providing characterization data for semiconductor devices. A first data set containing measured results obtained from wafer electrical tests performed on the semiconductor device during the fabrication process is compared to a second data set containing values corresponding to design characteristics for the semiconductor device. Based on this comparison, semiconductor devices having valid and invalid performance characteristics are identified. The characterization results data are subsequently generated for the identified semiconductor devices.