Abstract: A robot control method, a robot, and a computer-readable storage medium. The method includes obtaining a first joint state of a robotic arm of a robot at a first moment, and an environmental image collected by the robot at the first moment for a current environment; determining a first joint feature between the environmental image and the first joint state, and obtaining a second joint state by predicting a joint state of the robotic arm at a second moment based on the first joint feature; determining an adversarial feedback detail, and obtaining a third joint state by adjusting the second joint state based on the adversarial feedback detail; and controlling the robotic arm to swing to the third joint state in response to being at the second moment. In this manner, the control accuracy of the robot can be improved.

Abstract: A robot control method, and a computer-readable storage medium and a wheel-legged biped robot using the same are provided. The method includes: determining a kinetic model of the wheel-legged biped robot; determining, using the kinetic model, a sliding surface of the wheel-legged biped robot; determining, according to the sliding surface, a double power reaching law and a sliding mode control law of the wheel-legged biped robot; and controlling, according to the sliding surface, the double power reaching law and the sliding mode control law, the wheel-legged biped robot. Through the above-mentioned method, the adaptability of the wheel-legged biped robot to uncertain external disturbances can be enhanced, thereby improving its robustness to effectively maintain its balance even in the environment with complex terrain.

Abstract: A semiconductor structure includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes a first via structure in a first dielectric layer, the first via structure including a first contact via surface. At least a portion of the first via structure is in direct contact with the first dielectric layer. The second semiconductor structure includes a second via structure in a second dielectric layer, the second via structure including a second contact via surface. At least a portion of the second via structure is in direct contact with the second dielectric layer. The first contact via surface is bonded with the second contact via surface. The second contact via surface and the first contact via surface have an overlapping interface in the vertical direction. A first barrier layer is formed at a non-overlapping interface in the first contact via surface and the second contact via surface. The first barrier layer contains a multi-component oxide.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a bonded structure includes a first bonding layer including a first bonding contact and a first bonding alignment mark, a second bonding layer including a second bonding contact and a second bonding alignment mark, and a bonding interface between the first bonding layer and the second bonding layer. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface. The first bonding alignment mark includes a plurality of first repetitive patterns. The second bonding alignment mark includes a plurality of second repetitive patterns different from the plurality of first repetitive patterns.

Abstract: The present disclosure discloses a three-dimensional (3D) memory, which includes a peripheral wafer and an array wafer. The peripheral wafer includes a first peripheral structure and a second peripheral structure. The array wafer includes a substrate, a structure to be tested and multiple interconnecting portions. The substrate includes a first well region and a second well region. The array wafer includes the structure to be tested which has a first connecting portion, a second connecting portion, and multiple interconnecting portions. The first peripheral structure is connected to the first well region and the first connecting portion of the structure to be tested by the first interconnecting portion and the second interconnecting portion respectively. The second peripheral structure is connected to the second well region and the second connecting portion of the structure to be tested by the third interconnecting portion and the fourth interconnecting portion respectively.

Abstract: The present disclosure relates to a tape-guided pin insertion feeding mechanism. The mechanism includes: a pin tape material tray configured to store a pin tape; a feeding mechanism configured to drive the pin tape to move horizontally towards a cutting mechanism to feed material; and a pickup mechanism rotatably disposed on one side of the cutting mechanism. The cutting mechanism is configured to cut a single insertion pin from the pin tape.

Abstract: A stirring and separating device for high-value components of a waste PCB and a control method thereof are disclosed. The stirring and separating device comprises an insulated outer tank for accommodating a desoldering flux. The insulated outer tank is provided with a stirring mechanism. The stirring mechanism includes a main rotation shaft. A plurality of spaced cross beams are mounted at a bottom of the main rotation shaft. Each of the cross beams is provided with a secondary rotation shaft. A bottom of each of the secondary rotation shafts is rotationally connected with a stirring wheel through at least two connecting rods. At least two connection points are formed between each of the at least two connecting rods and the stirring wheel. When any one or more of the at least two connection points are disconnected, the stirring wheel rotates to a different angle.

Abstract: The present disclosure provides a media processing method, a device, an apparatus, and a medium, a specific embodiment of the method includes: obtaining a base image, and determining luminance of a pixel in the base image; determining visual stretching information based on the luminance of the pixel, wherein the visual stretching information includes stretching amount of the pixel at a plurality of different time points, and at a same time point, stretching amount of the pixel is associated with the luminance of the pixel; and based on the visual stretching information and the base image, obtaining a plurality of frames of target images for generating dynamic media.

Abstract: The present disclosure relates to metal material casting-rolling forming technology, and specifically to a casting-rolling method and apparatus based on a multi-layer heterogeneous composite roll sleeve. By alternately arranging a plurality of metal components on the composite roll sleeve and adjusting distribution of the metal components in the composite roll sleeve according to structural parameters and process parameters of the monometallic metals and layered metal composite materials, a layer thickness of the metal components at different radial positions of the composite roll sleeve is determined based on the solidification range of monometallic metals and the offset of the solidification point position in the heat transfer process of layered metal composite materials. This can significantly improve forming quality of strips.

Abstract: The present disclosure discloses a three-dimensional (3D) memory, which includes a peripheral wafer and an array wafer. The peripheral wafer includes a first peripheral structure and a second peripheral structure. The array wafer includes a substrate, a structure to be tested and multiple interconnecting portions. The substrate includes a first well region and a second well region. The array wafer includes the structure to be tested which has a first connecting portion, a second connecting portion, and multiple interconnecting portions. The first peripheral structure is connected to the first well region and the first connecting portion of the structure to be tested by the first interconnecting portion and the second interconnecting portion respectively. The second peripheral structure is connected to the second well region and the second connecting portion of the structure to be tested by the third interconnecting portion and the fourth interconnecting portion respectively.

Abstract: A hybrid wafer bonding method includes providing a first semiconductor structure and providing a second semiconductor structure. The first semiconductor structure includes a first via structure in a first dielectric layer, the first via structure including a first contact via surface. The second semiconductor structure includes a second via structure in a second dielectric layer, the second via structure including a second contact via surface. The first contact via surface is bonded with the second contact via surface. A barrier structure is formed surrounding the second contact via surface along a lateral direction and extending into each of the first contact via surface and the second dielectric layer in a vertical direction. The first via structure includes first metal impurities doped in a bulk region of the first via structure, and the second via structure includes second metal impurities doped in a bulk region of the second via structure.

Abstract: A semiconductor structure includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes a first via structure in a first dielectric layer, the first via structure including a first contact via surface. At least a portion of the first via structure is in direct contact with the first dielectric layer. The second semiconductor structure includes a second via structure in a second dielectric layer, the second via structure including a second contact via surface. At least a portion of the second via structure is in direct contact with the second dielectric layer. The first contact via surface is bonded with the second contact via surface. The second contact via surface and the first contact via surface have an overlapping interface in the vertical direction. A first barrier layer is formed at a non-overlapping interface in the first contact via surface and the second contact via surface. The first barrier layer contains a multi-component oxide.

Abstract: Embodiments of the present disclosure disclose a method for creating an application shortcut, an electronic device, and a system, to resolve a problem of creating an application shortcut in a user interface of a host operating system for an application program in a guest operating system. The system provided in embodiments may include: an application information encapsulating module, an application information sending module, an application information parsing module, an application shortcut creating module, a virtual application process module, an application program startup processing module, an application program display module, and an application window mirror display module.

Abstract: The present disclosure relates to a tape-guided pin insertion feeding mechanism and an operating method thereof. The operating method is performed by the mechanism. The mechanism includes: a pin tape material tray configured to store a pin tape; a feeding mechanism configured to drive the pin tape to move horizontally towards a cutting mechanism to feed material; and a pickup mechanism rotatably disposed on one side of the cutting mechanism. The cutting mechanism is configured to cut a single insertion pin from the pin tape.

Abstract: A high-pressure air carbon adsorption and desorption integrated device applied to an intelligent greenhouse is provided, including a first air compressor, a first adsorption column, a second adsorption column, and a vortex blower exhaust pump connected sequentially. A second air compressor is connected to bottoms of the first adsorption column and the second adsorption column. A plurality of groups of adsorption assemblies are arranged at intervals within each of the first adsorption column and the second adsorption column, each group of the plurality groups of adsorption assemblies includes two adsorbent placement plates, a heater is arranged between the two adsorbent placement plates, each group of the plurality groups of adsorption assemblies is provided with a plurality of through-holes, and each of the plurality of through-holes is arranged with an openable and closeable variable pressure blade.

Abstract: The embodiments of the present disclosure provide a stirring and separating device for high-value components of a waste PCB and a control method thereof. The stirring and separating device comprises an insulated outer tank for accommodating a desoldering flux. The insulated outer tank is provided with a stirring mechanism. The stirring mechanism includes a main rotation shaft. A plurality of spaced cross beams are mounted at a bottom of the main rotation shaft. Each of the cross beams is provided with a secondary rotation shaft. A bottom of each of the secondary rotation shafts is rotationally connected with a stirring wheel through at least two connecting rods. At least two connection points are formed between each of the at least two connecting rods and the stirring wheel. When any one or more of the at least two connection points are disconnected, the stirring wheel rotates to a different angle.

Abstract: A robot control method, and a computer-readable storage medium and a wheel-legged biped robot using the same are provided. The method includes: determining a kinetic model of the wheel-legged biped robot; determining, using the kinetic model, a sliding surface of the wheel-legged biped robot; determining, according to the sliding surface, a double power reaching law and a sliding mode control law of the wheel-legged biped robot; and controlling, according to the sliding surface, the double power reaching law and the sliding mode control law, the wheel-legged biped robot. Through the above-mentioned method, the adaptability of the wheel-legged biped robot to uncertain external disturbances can be enhanced, thereby improving its robustness to effectively maintain its balance even in the environment with complex terrain.

Abstract: A robot control method, a computer-readable storage medium, and a robot are provided. The method includes: obtaining first motion data, where the first motion data is human arm end motion data collected by a virtual reality device; obtaining second motion data by mapping the first motion data to a working space of an end of a robotic arm of the robot; obtaining a state of each joint of the robotic arm of the robot, and obtaining control data of the joint by performing a quadratic programming solving on the second motion data and the state of the joint; and controlling, by a motion controller of the robot, the robotic arm of the robot to move according to the obtained control data of each joint of the robot by transmitting the control data of the joint to the motion controller, so that the control method is relatively more natural, intuitive, and flexible.

Abstract: A display substrate (910), including a flexible substrate body, a thickness adjustment layer (71), and a micro-lens layer (72). The flexible substrate body includes: a plurality of island-shaped display regions (100) spaced apart from each other, a hollow region (300) disposed between adjacent island-shaped display regions (100), and a connection region (200) for connecting the adjacent island-shaped display regions (100). The thickness adjustment layer (71) is disposed on light exit sides of the plurality of island-shaped display regions (100) of the flexible substrate body. The micro-lens layer (72) is disposed on the side of the thickness adjustment layer (71) away from the flexible substrate body.

Abstract: A robot stability control method includes: obtaining a desired zero moment point (ZMP) and a fed-back actual ZMP of a robot at a current moment; based on a ZMP tracking control model, the desired ZMP and the actual ZMP, calculating a desired value of a motion state of a center of mass of the robot at the current moment, wherein the desired value of the motion state of the center of mass comprises a correction amount of the position of the center of mass; based on a spring-mass-damping-acceleration model and the desired value of the motion state of the center of mass, calculating a lead control input amount for the correction amount of the position of the center of mass; and controlling motion of the robot according to the lead control input amount and a planned value of the position of the center of mass at the current moment.