Abstract: A near-eye display apparatus includes a pixel island configured to emit first light, and a combined micro lens disposed at a light exit side of the pixel island. The combined micro lens includes an additional micro lens and a first micro lens. The additional micro lens is configured to diverge the first light emitted by the pixel island. The first micro lens is disposed at a side of the additional micro lens away from the pixel island, and is configured to collimate light passed through the additional micro lens. The pixel island is disposed on a focal plane of the combined micro lens.

Abstract: The various embodiments described herein include methods for testing low temperature components. In some embodiments, a cryogenic testing system includes: (1) a cryostat chamber configured to maintain a sample at temperatures below a threshold temperature, where the sample includes a two-dimensional array of components to be tested, the two-dimensional array comprising a first number (n) of columns and a second number (m) of rows; (2) a probe card including: (a) a set of n column connectors configured to couple to respective columns of the two-dimensional array; and (b) a set of m row connectors configured to couple to respective rows of the two-dimensional array; and (3) a cryogenic connector for communicatively coupling the probe card to a processing unit outside of the cryostat chamber.

Abstract: A method of treating a subject suffering from cancer comprising a step of administering an effective amount of a group of double-stranded RNA molecules to the subject, wherein the RNA molecule is isolated or derived from a bacteria of the genus Escherichia. A method of inhibiting growth or proliferation of cancer cells comprising a step of contacting said cells with said RNA molecule; and a pharmaceutical composition for treating cancer comprising said RNA molecule and a pharmaceutically tolerable excipient. Also a double-stranded RNA molecule and a recombinant vector comprising the double-stranded RNA molecule.

Abstract: A hybrid wafer bonding method includes providing a first semiconductor structure and providing a second semiconductor structure. The first semiconductor structure includes a first substrate, a first dielectric, and a first via structure. The first via structure includes a first contact via and first metal impurities doped in the first contact via. The second semiconductor structure includes a second substrate, a second dielectric layer, and a second via structure. The second via structure includes a second contact via and second metal impurities doped in the second contact via. The method further includes bonding the first semiconductor structure with the second semiconductor and forming a self-barrier layer by an alloying process. The self-barrier layer is formed by a multi-component oxide corresponding to the first and second metal impurities.

Abstract: The present application provides methods and systems for launching an unmanned aerial vehicle (UAV). An exemplary system for launching a UAV includes a detector configured to detect acceleration of the UAV in a launch mode. The exemplary system may also include a memory storing instructions and a processor configured to execute the instructions to cause the system to: obtain a signal configured to notify the UAV to enter the launch mode, determine whether the acceleration of the UAV satisfies a condition corresponding to threshold acceleration in the launch mode, and responsive to the determination that the acceleration of the UAV satisfies the condition, turn on a motor of the UAV.

Abstract: A near-eye display apparatus includes a pixel island configured to emit first light, and a combined micro lens disposed at a light exit side of the pixel island. The combined micro lens includes an additional micro lens and a first micro lens. The additional micro lens is configured to diverge the first light emitted by the pixel island. The first micro lens is disposed at a side of the additional micro lens away from the pixel island, and is configured to collimate light passed through the additional micro lens. The pixel island is disposed on a focal plane of the combined micro lens.

Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact and a first bonding alignment mark is formed above the first device layer. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact and a second bonding alignment mark is formed above the second device layer. The first bonding alignment mark is aligned with the second bonding alignment mark, such that the first bonding contact is aligned with the second bonding contact. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact at a bonding interface, and the first bonding alignment mark is in contact with the second bonding alignment mark at the bonding interface.

Abstract: Provided is a near-eye display device including: a base substrate including first and second surfaces opposite to each other, an optical element array on the first surface, and a pixel island array and a sensor array that are on the second surface and are coupled to each other. The pixel island array emits first pixel light to the optical element array, such that the first pixel light passes through the optical element array and then reaches a human eye. The sensor array receives light of the first pixel light reflected by the human eye, determines a position of a pupil center of the human eye according to an intensity distribution of the reflected light, determines pixels corresponding to the position of the pupil center in the pixel island array, and controls the pixels to emit second pixel light.

Abstract: Application of transfer RNA Molecules and their derived fragments for prevention or treatment of heart disease. The present invention provides a method of preventing or treating a subject suffering from heart diseases comprising administration of transfer RNA molecules and fragments derived from transfer RNA molecules or its functional variants or homologous to the subject, wherein the RNA molecules isolated from or derived from a plant of the genus Panax. The present invention also provides a pharmaceutical composition for the prevention or treatment of heart diseases comprising said effective amount of RNA molecule and a pharmaceutically tolerable vector, virus or excipient. The present invention provides a method for the prevention or treatment of a subject suffering from a heart disease. It is found that transfer RNA molecules from ginseng are particularly effective in the treatment of heart diseases, and also have a restorative effect on the myocardial cytoskeleton after ischemia-reperfusion injury.

Abstract: Embodiments of hybrid-bonded semiconductor structures and methods for forming a hybrid-bonded semiconductor structure are disclosed. The method can include providing a substrate and forming a base dielectric layer on the substrate. The method also includes forming first and second conductive structures in the base dielectric layer and disposing an alternating dielectric layer stack. Disposing alternating dielectric layer stack includes disposing a first dielectric layer on the base dielectric layer and the first and second conductive structures and sequentially disposing second, third, and fourth dielectric layers. The method further includes planarizing the disposed alternating dielectric layer stack and etching the alternating dielectric layer stack to form first and second openings using preset etching rates for each of the first, second, third, and fourth dielectric layers. The etching continues until at least portions of the first and second conductive structures are exposed.

Abstract: A thermoplastic starch composition acquired from compounding a mixture comprises starch-containing agricultural waste in 45 to 70% by weight of total composition that the agricultural waste contains starch content less than 50% in dry weight; thermoplastic synthetic polymer in 25 to 50% by weight of total composition; plasticizer in 1 to 10% by weight of total composition; and coupling agent in 1 to 5% by weight of total composition; wherein the compounding is performed at a first temperature which is higher than room temperature.

Abstract: Embodiments of hybrid-bonded semiconductor structures and methods for forming a hybrid-bonded semiconductor structure are disclosed. The method can include providing a substrate and forming a base dielectric layer on the substrate. The method also includes forming first and second conductive structures in the base dielectric layer and disposing an alternating dielectric layer stack. Disposing alternating dielectric layer stack includes disposing a first dielectric layer on the base dielectric layer and the first and second conductive structures and sequentially disposing second, third, and fourth dielectric layers. The method further includes planarizing the disposed alternating dielectric layer stack and etching the alternating dielectric layer stack to form first and second openings using preset etching rates for each of the first, second, third, and fourth dielectric layers. The etching continues until at least portions of the first and second conductive structures are exposed.

Abstract: A method for forming a dual damascene interconnect structure. A substrate having a conductor layer, an etch stop layer on the conductor layer, a dielectric stack on the etch stop layer, and a hard mask layer on the dielectric stack is provided. A photoresist layer having a resist opening is formed on the hard mask layer. The hard mask layer is etched through the resist opening to form a hard mask opening. The dielectric stack is etched through the hard mask opening to form a partial via hole. The photoresist layer is trimmed to form a widened resist opening above the partial via hole. The hard mask layer is etched through the widened resist opening to form a widened hard mask opening above the partial via hole. The dielectric stack is etched through the widened hard mask opening and the partial via hole to form a dual damascene via.

Abstract: A method for forming a dual damascene interconnect structure. A substrate having a conductor layer, an etch stop layer on the conductor layer, a dielectric stack on the etch stop layer, and a hard mask layer on the dielectric stack is provided. A photoresist layer having a resist opening is formed on the hard mask layer. The hard mask layer is etched through the resist opening to form a hard mask opening. The dielectric stack is etched through the hard mask opening to form a partial via hole. The photoresist layer is trimmed to form a widened resist opening above the partial via hole. The hard mask layer is etched through the widened resist opening to form a widened hard mask opening above the partial via hole. The dielectric stack is etched through the widened hard mask opening and the partial via hole to form a dual damascene via.

Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes a substrate, a first device layer disposed on the substrate, and a first bonding layer disposed above the first device layer and including a first bonding contact and a first bonding alignment mark. The second semiconductor structure includes a second device layer, and a second bonding layer disposed below the second device layer and including a second bonding contact and a second bonding alignment mark. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface.

Abstract: An intelligent illuminating system for a vehicle lamp comprises a lens, a circuit board, a plurality of LED light sources on the circuit board distributed in an array, and a hollow reflector disposed between the LED light sources and the lens. The hollow reflector has reflection cavities disposed in one-to-one correspondence with the LED light sources. The reflection cavity has an incident opening, an emergent opening, and a reflection surface extending between the incident opening and the emergent opening. The LED light source is disposed at the incident opening. The emergent opening is located on a focal plane of the lens or has a defocusing amount from the focal plane of the lens.

Abstract: A method of treating a subject suffering from cancer includes administering an effective amount of a RNA molecule to the subject, wherein the RNA molecule is isolated or derived from a plant of the genus Taxus. A method of inhibiting growth or proliferation of cancer cells includes contacting cancer cells with the RNA molecule; and a pharmaceutical composition for treating cancer includes the RNA molecule and a pharmaceutically tolerable excipient. Also a double-stranded RNA molecule and a recombinant vector include the double-stranded RNA molecule.

Abstract: A vehicle lamp illuminating apparatus with ability for implementing various illuminating light patterns is constructed by a lens, a circuit board, a plurality of light emitting diode (LED) light sources disposed on the circuit board and distributed in an array, and a reflection structure disposed between the plurality of LED light sources and the lens. The LED light sources are transversely arranged in an upper row and a lower row. The reflection structure has a plurality of reflection mirror sets each disposed in one-to-one correspondence with two LED light sources that are vertically opposite to each other. Luminance of one or more local areas of an illuminating light pattern can be adjusted, thus implementing various illuminating light patterns and meeting a self-adaptive requirement of a headlamp.

Abstract: The present invention relates to the technical field of vehicle lamps, and in particular, to a vehicle lamp illuminating apparatus, a vehicle lamp assembly comprising the vehicle lamp illuminating apparatus, and a vehicle comprising the vehicle lamp assembly. The vehicle lamp illuminating apparatus comprises a lens, a reflection structure, a plurality of light emitting diode (LED) light sources distributed in an array and arranged in an upper row and a lower row along a transverse direction, and a circuit board connected to the plurality of LED light sources, wherein the reflection structure comprises a plurality of reflection mirror sets each disposed in one-to-one correspondence with two LED light sources that are vertically opposite to each other, the reflection mirror set comprises an upper reflection mirror corresponding to the LED light source in the upper row and a lower reflection mirror corresponding to the LED light source in the lower row.