Patents by Inventor Meng Yang

Meng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10705058
    Abstract: A sensing optical fiber acoustic emission integrated sensing system and method for monitoring the safety of a structure which comprises a sensing optical fiber temperature interference removal device and a sensing optical fiber acoustic emission demodulation device. A sensing optical fiber (206) successively passes through the sensing optical fiber temperature interference removal device and the sensing optical fiber acoustic emission demodulation device. A distributed sensing optical fiber acoustic emission regulation and control device for sensing the degradation of structure performance is integrated with a sensing optical fiber acoustic emission sensing system with multiple complex devices, multiple functional modules and multiple interconnection components.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: July 7, 2020
    Assignee: HOHAI UNIVERSITY
    Inventors: Huaizhi Su, Meng Yang, Chongshi Gu
  • Publication number: 20200212261
    Abstract: A light-emitting device is provided, which includes a first semiconductor structure, an active structure, a second semiconductor structure, and a first blocking layer. The first semiconductor structure has a first conductivity type. The active structure is on the first semiconductor structure. The second semiconductor structure is on the active structure and has a second conductivity type different from the first conductivity type. The first blocking layer is between the second semiconductor structure and the active structure. The first blocking layer substantially does not contain aluminum.
    Type: Application
    Filed: December 23, 2019
    Publication date: July 2, 2020
    Inventors: Shih-Chang LEE, Meng-Yang CHEN
  • Publication number: 20200212259
    Abstract: The present disclosure provides a semiconductor stack, a semiconductor device and a method for manufacturing the same. The semiconductor device includes a first semiconductor layer and a light-emitting structure. The first semiconductor layer includes a first III-V semiconductor material, a first dopant, and a second dopant. The light-emitting structure is on the first semiconductor layer and includes an active structure. In the first semiconductor layer, a concentration of the second dopant is higher than a concentration of the first dopant. The first dopant is carbon, and the second dopant is hydrogen.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: Meng-Yang CHEN, Jung-Jen LI
  • Publication number: 20200212257
    Abstract: The present disclosure provides a semiconductor device which includes a base layer and a buffer structure. The base layer includes a first semiconductor compound having a first lattice constant and including a plurality of elements, and an atomic radius of one of the plurality of elements which has the largest atomic radius is defined as a first atomic radius. The buffer structure includes a second semiconductor compound and a first additive. The second semiconductor compound has a second lattice constant and the first additive has a second atomic radius. The second lattice constant is larger than the first lattice constant, and the second atomic radius is larger than the first atomic radius.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: MENG-YANG CHEN, JUNG-JEN LI
  • Publication number: 20200203570
    Abstract: A semiconductor device includes a first type semiconductor structure, an active structure, and a contact layer. The first type semiconductor structure includes a first lattice constant, a first side and a second side opposite to the first side. The active structure is on the first side of the first type semiconductor structure and emits a radiation, and the radiation has a peak wavelength between 1000 nm and 2000 nm. The contact layer is on the second side of the first type semiconductor structure and includes a second lattice constant. A difference between the first lattice constant and the second lattice constant is at least 0.5%.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 25, 2020
    Inventors: Meng-Yang CHEN, Jung-Jen LI
  • Publication number: 20200152830
    Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure and a light-emitting structure. The light-emitting structure is located between the first semiconductor structure and the second semiconductor structure. The light-emitting structure includes a multiple quantum well structure. The multiple quantum well structure contains aluminum and includes a plurality of semiconductor stacks. Each of the semiconductor stacks is stacked by a well layer and a barrier layer. In each semiconductor stack, the well layer has a thickness larger than a thickness of the barrier layer.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventor: Meng-Yang CHEN
  • Patent number: 10571359
    Abstract: A hydraulic structure seepage property distributed optical fiber sensing integrated system includes a special optical fiber for seepage measurement, an optical fiber calibration device, an optical fiber laying device, and a seepage property identification device. After the optical fiber calibration device calibrates the special optical fiber for seepage measurement on site, the special optical fiber for seepage measurement is laid and tested with the aid of the optical fiber laying device, and is connected to the seepage property identification device for information collection, processing and analysis after the test is successful.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: February 25, 2020
    Assignee: HOHAI UNIVERSITY
    Inventors: Huaizhi Su, Meng Yang, Chongshi Gu
  • Patent number: 10564772
    Abstract: The present disclosure provides an array substrate, its driving method and manufacturing method, and a display device. The array substrate includes a transistor layer arranged on a base, and a first transparent conductive layer, a first insulation layer, a second transparent conductive layer, a second insulation layer and a third transparent conductive layer sequentially arranged on the transistor layer. The first transparent conductive layer covers the transistor layer at a display area, the second transparent conductive layer includes a pattern of touch electrodes, and the third transparent conductive layer includes a pattern of pixel electrodes. Within any pixel area of the display area, the pixel electrode is connected to a pixel electrode connection end of the transistor layer through a via-hole in the first insulation layer and the second insulation layer, and the first transparent conductive layer is provided with an opening at a position corresponding to the via-hole.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: February 18, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
    Inventors: Chaochao Sun, Huafeng Liu, Shengwei Zhao, Kai Zhang, Lei Yang, Lulu Ye, Jingping Lv, Chao Wang, Chongliang Hu, Meng Yang, Duolong Ding, Bule Shun, Lin Xie, Yao Li, Shimin Sun
  • Patent number: 10527587
    Abstract: A distributed sensing fiber acoustic emission apparatus and method for monitoring a hydraulic engineering safety behavior includes a fiber-carrying laying module and a fiber acoustic emission module. The fiber-carrying laying module includes an inner supporter, mesh modules and fiber-carrying modules, the inner supporter, the mesh modules and the fiber-carrying modules form a cylindrical shape. The cross section of the inner supporter is in a quadrangle inner-concave shape with the four edges concaved, the four surfaces of the inner supporter are concaved, the mesh modules having a plurality of meshes are respectively disposed in the four concave surfaces of the inner supporter, and the fiber-carrying module is arranged between every two adjacent mesh modules.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: January 7, 2020
    Assignee: HOHAI UNIVERSITY
    Inventors: Huaizhi Su, Meng Yang
  • Patent number: 10520475
    Abstract: A fiber acoustic emission sensing apparatus and method including a laying device and an acoustic emission source; the laying device comprises base plate, first side plate and second side plate, the top portion of the first side plate connected with the top portion of the second side plate through an arc-shaped fiber-carrying channel, a main cavity formed by the first side plate and the second side plate; top portions of the first and second side plates respectively hinged with first and second arc-shaped covers, the lower end surface of the first arc-shaped cover fixedly connected with a first arc-shaped pressing body, the lower end surface of the second arc-shaped cover fixedly provided with a second arc-shaped pressing body, a first sensing fiber arranged under the first arc-shaped pressing body, and a second sensing fiber arranged under the second arc-shaped pressing body.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: December 31, 2019
    Assignee: Hohai University
    Inventors: Huaizhi Su, Meng Yang, Chongshi Gu, Wei Xie
  • Patent number: 10520473
    Abstract: A distributed sensing fiber acoustic emission fusion sensing system includes a sensing fiber temperature-sensitive compensation device and a sensing fiber acoustic emission demodulation device. A sensing fiber in the sensing fiber temperature-sensitive compensation device after being compensated enters the sensing fiber acoustic emission demodulation device.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: December 31, 2019
    Assignee: HOHAI UNIVERSITY
    Inventors: Huaizhi Su, Meng Yang, Chongshi Gu
  • Publication number: 20190393380
    Abstract: A semiconductor substrate is provided in the present disclosure. The semiconductor substrate includes a first semiconductor layer and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer has a first lattice constant (L1) and the second semiconductor layer has a second lattice constant (L2). A ratio of a difference (L2-L1) between the second lattice constant (L2) and the first lattice constant (L1) to the first lattice constant (L1) is greater than 0.036.
    Type: Application
    Filed: June 25, 2019
    Publication date: December 26, 2019
    Inventors: Meng-Yang CHEN, Rong-Ren LEE
  • Patent number: 10472180
    Abstract: Disclosed is a conveying and positioning system and method, which is applied in the technical field of conveyance in the automotive industry and comprises a roller machine, a conveying trolley and an intelligent variable-frequency controller, wherein the conveying trolley is provided with a reflector; the roller machine is provided with a driving mechanism and a distance sensor; and, the driving mechanism comprises a driving motor controlled by the intelligent variable-frequency controller and a rotary encoder capable of feeding back rotation speed information of the driving motor to the intelligent variable-frequency controller.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: November 12, 2019
    Assignees: Guangzhou MINO Automotive Equipment Co., Ltd., Mino Automotive Equipment (Shanghai) Co., Ltd.
    Inventors: Junhui Li, Meng Yang, Hongchen Zhang, Zhencheng Chen, Qing Li
  • Patent number: 10473517
    Abstract: An acoustic emission source expansion apparatus integrated hydraulic engineering construction behavior fiber sensing device includes a base plate, a first side plate and a second side plate fixedly connected with two sides of the base plate, the top portion of the first side plate is connected with the top portion of the second side plate through an arc-shaped fiber-carrying channel, and a main common cavity is formed by the base plate, the first side plate, the second side plate and the arc-shaped fiber-carrying channel; a pair of sensing fibers is arranged in the arc-shaped fiber-carrying channel, the sensing fibers are tightly pressed in the arc-shaped fiber-carrying channel through a pressing block, the pressing block is provided with a plurality of springs, the springs tightly press the pressing block through a cover plate, and the cover plate is arranged on the first side plate and the second side plate.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 12, 2019
    Assignee: Hohai University
    Inventors: Huaizhi Su, Meng Yang, Chongshi Gu, Hezhi Liu, Hong Luo
  • Publication number: 20190318769
    Abstract: An input/output multiplexer is provided and coupled to a memory array through bit lines. The input/output multiplexer includes a bit-line amplifier, a level-raising circuit, and a sensing amplifier. The bit-line amplifier amplifies a voltage difference between voltage levels of first and second bit lines in a read mode. In a first selection period of the read mode, according to the amplified voltage difference, a voltage level of a first local-data terminal of the bit-line amplifier is initially at an initial level, and a voltage level of a second local-data terminal thereof decreases from the initial level toward that of a low supply voltage. The level-raising circuit raises the voltage level of the first local-data terminal from the initial level in the first selection period. The sensing amplifier generates readout data according to the raised voltage level of the first local-data terminal and the voltage level of the second local-data terminal.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 17, 2019
    Inventor: Shu-Meng YANG
  • Patent number: 10416085
    Abstract: A distributed optical fiber identification system and method for seepage conditions of a hydraulic structure and a base thereof including a single-mode optical fiber having an automatic control heat source produced for seepage measurement, an optical path coupler and a synchronous controller, the synchronous controller is connected to a mode locked laser, a polarization beam splitter, an isolator, a grating pair, a diffraction grating, a reflector, a beam splitter, a nonlinear crystal, a spectrometer and a Michelson interferometer, the output end of the Michelson interferometer is connected to the optical path coupler, the output end of the optical path coupler is connected to a detector and a second optical splitter respectively, the detector is connected to a digital signal processor, the second optical splitter is connected to the digital signal processor through an amplifying circuit, and the digital signal processor is connected to the synchronous controller and a collector respectively.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: September 17, 2019
    Assignee: Hohai University
    Inventors: Huaizhi Su, Meng Yang
  • Publication number: 20190234910
    Abstract: A sensing optical fiber acoustic emission integrated sensing system and method for monitoring the safety of a structure which comprises a sensing optical fiber temperature interference removal device and a sensing optical fiber acoustic emission demodulation device. A sensing optical fiber (206) successively passes through the sensing optical fiber temperature interference removal device and the sensing optical fiber acoustic emission demodulation device. A distributed sensing optical fiber acoustic emission regulation and control device for sensing the degradation of structure performance is integrated with a sensing optical fiber acoustic emission sensing system with multiple complex devices, multiple functional modules and multiple interconnection components.
    Type: Application
    Filed: January 16, 2017
    Publication date: August 1, 2019
    Inventors: Huaizhi SU, Meng YANG, Chongshi GU
  • Patent number: 10351558
    Abstract: The present invention provides a compound of Formula I and pharmaceutical compositions comprising one or more said compounds, and methods for using said compounds for treating or preventing unstable angina, refractory angina, myocardial infarction, transient ischemic attacks, atrial fibrillation, thrombotic stroke, embolic stroke, deep vein thrombosis, disseminated intravascular coagulation, ocular build up of fibrin, and reocclusion or restenosis of recanalized vessels. The compounds are selective Factor IXa inhibitors.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: July 16, 2019
    Assignee: Merck Sharp & Dohme Corp.
    Inventors: Dongfang Meng, Hong Li, Meng Yang, Manuel de Lera Ruiz, Sunita V. Dewnani, Tianying Jian, Dann L. Parker, Jr., Ting Zhang, Louis-Charles Campeau, Harold B. Wood, Jiayi Xu, Richard Berger, Jane Yang Wu, Robert K. Orr, Shawn P. Walsh, Bart Harper
  • Publication number: 20190212224
    Abstract: The present invention discloses a dynamic diagnosis system and method for concrete damage based on a distributed sensing optical fiber.
    Type: Application
    Filed: April 26, 2017
    Publication date: July 11, 2019
    Applicant: HOHAI UNIVERSITY
    Inventors: Huaizhi SU, Meng YANG, Hong LUO
  • Publication number: 20190204277
    Abstract: The apparatus comprises a bottom plate, a first side plate (304), and a second side plate (305). The top of the first side plate is connected to the top of the second side plate by an arc-shaped fiber carrying channel (310, 311). A first arc-shaped cover (300) and a second arc-shaped cover (301) are hinged to the tops of the first side plate and the second side plate, respectively. A first arc-shaped pressing body (308) and a second arc-shaped pressing body (309) are fixedly connected to the lower end surfaces. A first sensing optical fiber (312) and a second sensing optical fiber (313) located in the arc-shaped fiber carrying channel are disposed below the first arc-shaped pressing body and the second arc-shaped pressing body respectively. The first arc-shaped cover is connected to the second arc-shaped cover by a locking apparatus.
    Type: Application
    Filed: January 16, 2017
    Publication date: July 4, 2019
    Applicant: Hohai University
    Inventors: Huaizhi SU, Meng YANG, Qiangqiang JIA