Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

Abstract: Antenna-on-printed circuit board assembly has a printed circuit board with at least one mounting edge segment and an antenna module. One or more individual antenna elements are laid out on an antenna module substrate having at least one overhang segment. The antenna module is suspended from the printed circuit board with the at least one overhang segment overlapping with and fixed to a corresponding one of the at least one mounting edge segment.

Abstract: A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ?2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.

Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ?2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.

Abstract: In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: An antenna apparatus in a packaged electronic device includes: an antenna assembly with a conductive antenna, and an insulator; a conductive feed line extending on or in a substrate; a conductive layer with an aperture on or in the substrate between the conductive feed line and an exposed portion of the conductive antenna; and a support structure mounted to a portion of the substrate and to a portion of the antenna assembly to support the antenna assembly and to provide an air gap between the exposed portion of the conductive antenna and the aperture.

Abstract: A millimeter or mm-wave system includes transmission of a millimeter wave (mm-wave) radar signal by a transmitter to an object. The transmitted mm-wave radar signal may include at least two signal orientations, and in response to each signal orientation, the object reflects corresponding signal reflections. The signal reflections are detected and a determination is made as to location of the object.

Abstract: A dual-polarized, dual band antenna has first-band horizontal patches that are on a first layer with pairs of the first horizontal patches defining first electric dipoles for a first operating band. At least each subset of first-band vias are connected to a given one of the first-band horizontal patches and to the antenna ground layer to define first magnetic dipoles for the first operating band. First-band probes excite first magneto-electric dipoles. Second-band horizontal patches may be on a third layer with pairs of the second-band horizontal patches defining second electrical dipoles for a second operating band. At least each subset of the second-band vias are connected to a given one of the second-band horizontal patches and to the antenna ground layer to define second magnetic dipoles for the second operating band. Second-band probes excite the second magneto-electric dipoles as defined by the second electric dipoles and the second magnetic dipoles.

Abstract: A dual/tri-band array antenna for multiple frequency bands has one or more shared aperture unit cells, and a plurality of dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas configured for signals of the high band(s). A given set of the dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas are positioned on a given one of the shared aperture unit cells in a spaced apart relationship. The array antenna has one or more dual-polarized crossed dipole patch antennas configured for the low band. A given one of the dual-polarized crossed dipole patch antennas are centered on the given one of the shared aperture unit cells and spaced apart from the dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas.

Abstract: A method of installing an antenna array module on a window includes adhering the antenna array module to the window and connecting the antenna array module to an external module via a cable. The cable may extend from one side of the window to the other. The antenna array module may include a substrate (e.g., a transparent substrate) and a plurality of antenna elements (e.g., meshed patches) on one or more layers of the substrate. Beamformer(s) and splitter/combiner(s) operably connected to the plurality of antenna elements may be embodied in the external module or in the antenna array module (e.g., in whole or in part in one or more integrated circuits on a surface of the substrate). The external module may output digital data derived from mm-wave, intermediate frequency (IF) and/or baseband signal(s) received from the antenna array module.

Abstract: A dual/tri-band array antenna for multiple frequency bands has one or more shared aperture unit cells, and a plurality of dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas configured for signals of the high band(s). A given set of the dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas are positioned on a given one of the shared aperture unit cells in a spaced apart relationship. The array antenna has one or more dual-polarized crossed dipole patch antennas configured for the low band. A given one of the dual-polarized crossed dipole patch antennas are centered on the given one of the shared aperture unit cells and spaced apart from the dual-polarized magneto-electric dipole antennas or aperture-fed stacked patch antennas.

Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

Abstract: An antenna apparatus in a packaged electronic device includes: an antenna assembly with a conductive antenna, and an insulator; a conductive feed line extending on or in a substrate; a conductive layer with an aperture on or in the substrate between the conductive feed line and an exposed portion of the conductive antenna; and a support structure mounted to a portion of the substrate and to a portion of the antenna assembly to support the antenna assembly and to provide an air gap between the exposed portion of the conductive antenna and the aperture.

Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.

Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.

Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.

Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.