Patents by Inventor Meysam Moallem
Meysam Moallem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11196146Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.Type: GrantFiled: April 21, 2020Date of Patent: December 7, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Meysam Moallem, Brian P. Ginsburg
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Publication number: 20210050652Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.Type: ApplicationFiled: November 4, 2020Publication date: February 18, 2021Inventors: Meysam MOALLEM, Guor-Chaur JUNG, Brian P. GINSBURG
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Publication number: 20200408893Abstract: A millimeter or mm-wave system includes transmission of a millimeter wave (mm-wave) radar signal by a transmitter to an object. The transmitted mm-wave radar signal may include at least two signal orientations, and in response to each signal orientation, the object reflects corresponding signal reflections. The signal reflections are detected and a determination is made as to location of the object.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Inventors: Dan Wang, Meysam Moallem, Brian Ginsburg
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Patent number: 10862192Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.Type: GrantFiled: April 11, 2019Date of Patent: December 8, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Meysam Moallem, Guor-Chaur Jung, Brian P. Ginsburg
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Publication number: 20200365971Abstract: A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.Type: ApplicationFiled: April 21, 2020Publication date: November 19, 2020Inventors: Meysam MOALLEM, Brian P. GINSBURG
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Patent number: 10782394Abstract: A millimeter or mm-wave system includes transmission of a millimeter wave (mm-wave) radar signal by a transmitter to an object. The transmitted mm-wave radar signal may include at least two signal orientations, and in response to each signal orientation, the object reflects corresponding signal reflections. The signal reflections are detected and a determination is made as to location of the object.Type: GrantFiled: September 8, 2017Date of Patent: September 22, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dan Wang, Meysam Moallem, Brian Ginsburg
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Publication number: 20200259239Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes a plurality of dielectric layers, a plurality of conductor layers interspersed with the plurality of dielectric layers, and an integrated circuit die disposed on a first side of the plurality of dielectric layers. The plurality of conductor layers includes a first layer disposed on a second side of the plurality of dielectric layers that includes a set of antennas. In some such examples, the integrated circuit die includes radar processing circuitry, and the AOP integrated circuit package is configured for radar applications.Type: ApplicationFiled: September 3, 2019Publication date: August 13, 2020Inventors: Meysam MOALLEM, Ross Allan KULAK
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Publication number: 20200259240Abstract: An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes an integrated circuit die and an antenna substrate coupled to the integrated circuit die. The antenna substrate includes a conductor layer and a first dielectric layer disposed between the conductor layer and the integrated circuit die. The conductor layer includes antennas electrically coupled to the integrated circuit die. The integrated circuit package further includes an I/O substrate coupled to the integrated circuit die opposite the antenna substrate. In some such examples, the I/O substrate includes interconnect connectors and a second dielectric layer disposed between the interconnect connectors and the integrated circuit die. In some such examples, the integrated circuit package includes interconnect connectors extending between the antenna substrate and the I/O substrate.Type: ApplicationFiled: September 3, 2019Publication date: August 13, 2020Inventor: Meysam MOALLEM
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Publication number: 20200212536Abstract: In a described example, a wireless communication device includes an antenna substrate having an antenna on an antenna side surface; a semiconductor die on an device side surface of the antenna substrate, opposite the antenna side surface; and an antenna protection layer covering the antenna and a portion of the antenna side surface of the antenna substrate having a uniform predetermined thickness across the antenna side surface of the antenna substrate within +/?10%.Type: ApplicationFiled: May 7, 2019Publication date: July 2, 2020Inventors: Vikas Gupta, Sadia Naseem, Meysam Moallem
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Publication number: 20200194871Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.Type: ApplicationFiled: April 11, 2019Publication date: June 18, 2020Inventors: Meysam MOALLEM, Guor-Chaur JUNG, Brian P. GINSBURG
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Publication number: 20200118949Abstract: A package includes a substrate, a conductive layer on a first surface of the substrate forming a set of antennas, and a semiconductor die forming communication channels for the antennas, each of the communication channels being electrically coupled to the antennas by way of a redistribution layer that includes the substrate, the semiconductor die being mounted on either the first surface or an opposing second surface of the substrate. The package further includes a set of electrical contacts on the second surface of the substrate, the redistribution layer further coupling the set of electrical contacts to the semiconductor die. The package further includes a stiffening layer over the first surface of the substrate, the stiffening layer forming gaps over the antennas such that the antennas are on an outer surface of the package.Type: ApplicationFiled: October 10, 2019Publication date: April 16, 2020Inventors: Meysam Moallem, Michael Paul Pierce
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Publication number: 20190393581Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.Type: ApplicationFiled: September 3, 2019Publication date: December 26, 2019Inventor: Meysam Moallem
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Publication number: 20190348746Abstract: A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ?2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.Type: ApplicationFiled: October 4, 2018Publication date: November 14, 2019Inventors: VIKAS GUPTA, MEYSAM MOALLEM, SADIA NASEEM
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Patent number: 10403954Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.Type: GrantFiled: December 30, 2017Date of Patent: September 3, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Meysam Moallem
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Publication number: 20190207286Abstract: In described examples, an integrated waveguide transition includes a substrate with a waveguide side and an opposing waveguide termination side. A first layer of metal covers a portion of the waveguide side, a second layer of metal is separated from the first layer of metal by a first layer of dielectric, and a third layer of metal covers a portion of the waveguide termination side and is separated from the second layer of metal by a second layer of dielectric. A substrate waveguide perpendicular to a plane of the substrate extends from the waveguide side to the waveguide termination side; and a length and a width of the substrate waveguide is defined by a fence of ground-stitching vias that short the first layer of metal and the second layer of metal to a plate of the third layer of metal that forms a back short.Type: ApplicationFiled: December 30, 2017Publication date: July 4, 2019Inventor: Meysam Moallem
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Publication number: 20180224536Abstract: A millimeter or mm-wave system includes transmission of a millimeter wave (mm-wave) radar signal by a transmitter to an object. The transmitted mm-wave radar signal may include at least two signal orientations, and in response to each signal orientation, the object reflects corresponding signal reflections. The signal reflections are detected and a determination is made as to location of the object.Type: ApplicationFiled: September 8, 2017Publication date: August 9, 2018Applicant: Texas Instruments IncorporatedInventors: Dan Wang, Meysam Moallem, Brian Ginsburg
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Non-contact on-wafer S-parameter measurements of devices at millimeter-wave to terahertz frequencies
Patent number: 9941560Abstract: A broadband fully micromachined transition from rectangular waveguide to cavity-backed coplanar waveguide line for submillimeter-wave and terahertz application is presented. The cavity-backed coplanar waveguide line is a planar transmission line that is designed and optimized for minimum loss while providing 50 Ohm characteristic impedance. This line is shown to provide less than 0.12 dB/mm loss over the entire J-band. The transition from cavity-backed coplanar waveguide to a reduced-height waveguide is realized in three steps to achieve a broadband response with a topology amenable to silicon micromachining. A novel waveguide probe measurement setup is also introduced and utilized to evaluate the performance of the transitions.Type: GrantFiled: December 22, 2015Date of Patent: April 10, 2018Assignee: The Regents of The University of MichiganInventors: Kamal Sarabandi, Meysam Moallem, Armin Jam -
Non-Contact On-Wafer S-Parameter Measurements of Devices at Millimeter-Wave to Terahertz Frequencies
Publication number: 20160181681Abstract: A broadband fully micromachined transition from rectangular waveguide to cavity-backed coplanar waveguide line for submillimeter-wave and terahertz application is presented. The cavity-backed coplanar waveguide line is a planar transmission line that is designed and optimized for minimum loss while providing 50 Ohm characteristic impedance. This line is shown to provide less than 0.12 dB/mm loss over the entire J-band. The transition from cavity-backed coplanar waveguide to a reduced-height waveguide is realized in three steps to achieve a broadband response with a topology amenable to silicon micromachining. A novel waveguide probe measurement setup is also introduced and utilized to evaluate the performance of the transitions.Type: ApplicationFiled: December 22, 2015Publication date: June 23, 2016Inventors: Kamal Sarabandi, Meysam Moallem, Armin Jam -
Patent number: 9287614Abstract: A frequency scanning traveling wave antenna array is presented for Y-band application. This antenna is a fast wave leaky structure based on rectangular waveguides in which slots cut on the broad wall of the waveguide serve as radiating elements. A series of aperture-coupled patch arrays are fed by these slots. This antenna offers 2° and 30° beam widths in azimuth and elevation direction, respectively, and is capable of ±25° beam scanning with frequency around the broadside direction. The waveguide can be fed through a membrane-supported cavity-backed CPW which is the output of a frequency multiplier providing 230˜245 GHz FMCW signal. This structure can be planar and compatible with micromachining application and can be fabricated using DRIE of silicon.Type: GrantFiled: August 31, 2012Date of Patent: March 15, 2016Assignee: The Regents Of The University of MichiganInventors: Mehrnoosh Vahidpour, Kamal Sarabandi, Jack East, Meysam Moallem
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Publication number: 20150263429Abstract: A frequency scanning traveling wave antenna array is presented for Y-band application. This antenna is a fast wave leaky structure based on rectangular waveguides in which slots cut on the broad wall of the waveguide serve as radiating elements. A series of aperture-coupled patch arrays are fed by these slots. This antenna offers 2° and 30° beam widths in azimuth and elevation direction, respectively, and is capable of ±25° beam scanning with frequency around the broadside direction. The waveguide can be fed through a membrane-supported cavity-backed CPW which is the output of a frequency multiplier providing 230˜245 GHz FMCW signal. This structure can be planar and compatible with micromachining application and can be fabricated using DRIE of silicon.Type: ApplicationFiled: August 31, 2012Publication date: September 17, 2015Inventors: Mehrnoosh Vahidpour, Kamal Sarabandi, Jack East, Meysam Moallem