Abstract: The present invention relates to a method of inducing neuro-regeneration comprising administering a MEK 1/2 inhibitor to a patient in need thereof. In the present invention, the MEK1/2 inhibitor induces neuro-regeneration by differentiating neural stem cells into neurons, by protecting neural stem cells and neurons against cytotoxicity of amyloid-betas, or by both of the above. Also, the present invention relates to a method of protecting neurons against neuronal loss or damage comprising administering a MEK1/2 inhibitor. In addition, this invention relates to a method of preventing or treating neurodegenerative disease due to neuronal loss or damage for patients in need thereof comprising administering a MEK 1/2 inhibitor.

Abstract: A modularization of a circulator and a directional coupler used in a wireless communication system comprises: a circulator; and a signal coupler, where the signal coupler does not have directivity by itself, and directivity of the circulator module is controlled by isolation characteristics of the circulator to improve electrical characteristics of a wireless communication system and miniaturize the wireless communication system by applying the electrical characteristics in common with a circulator to modularize the wireless communication system without implementation of a circuit of a directional coupler capable of sampling high-frequency signals.

Abstract: Provided are biphenyl derivatives having the structure of Formula 1: stereoisomers thereof, and pharmaceutically acceptable salts thereof, wherein R1 is hydrogen, halogen, hydroxy, substituted or unsubstituted C1-C6 alkyl, or C1-C6 alkoxy; R2, R3 and R4 are each independently hydrogen, halogen, substituted or unsubstituted amino, nitro, cyano, hydroxy, substituted or unsubstituted C1-C6 alkyl, substituted or unsubstituted C1-C6 alkoxy, or —C(O)R6; R5 is hydrogen or C1-C6 alkyl; n is 0 or 1; and R6 is hydrogen or amino, methods for preparing the same, and a pharmaceutical composition containing the same.

Abstract: Disclosed is a composition for inducing the differentiation of neural stem cells into dopaminergic neurons. The composition includes the compound represented by Formula 1 (“AS703026”) as a MEK 1/2 inhibitor. Also disclosed is a method for inducing the differentiation of neural stem cells into dopaminergic neurons by using the composition. Dopaminergic neurons whose differentiation from neural stem cells is induced by the composition and method can be applied to cell replacement therapies and gene therapies for the treatment of neurodegenerative diseases, such as Parkinson's disease, or can be widely used as materials for the examination of drug effects or numerous studies in the development of new drugs.

Abstract: The present invention relates to a novel tricyclic benzoxaborole derivative, a preparation method thereof, and use of antibiotics pharmaceutical composition including the same as an active ingredient.

Abstract: Disclosed is a composition for inducing the differentiation of neural stem cells into dopaminergic neurons. The composition includes the compound represented by Formula 1 (“AS703026”) as a MEK 1/2 inhibitor. Also disclosed is a method for inducing the differentiation of neural stem cells into dopaminergic neurons by using the composition. Dopaminergic neurons whose differentiation from neural stem cells is induced by the composition and method can be applied to cell replacement therapies and gene therapies for the treatment of neurodegenerative diseases, such as Parkinson's disease, or can be widely used as materials for the examination of drug effects or numerous studies in the development of new drugs.

Abstract: The present invention provides novel biphenyl derivatives, isomers thereof, or pharmaceutically acceptable salts thereof, methods for preparing the same, and a pharmaceutical composition containing the same. The novel biphenyl derivatives, isomers thereof, or pharmaceutically acceptable salts thereof, as disclosed in the present invention, act as muscarinic M3 receptor antagonists, and thus are useful for the prevention or treatment of a disease selected from the group consisting of chronic obstructive pulmonary disease, asthma, irritable bowel syndrome, urinary incontinence, rhinitis, spasmodic colitis, chronic cystitis, Alzheimer's disease, senile dementia, glaucoma, schizophrenia, gastroesophageal reflux disease, cardiac arrhythmia, and hyper-salivation syndromes.

Abstract: The present invention relates to a novel tricyclic benzoxaborole derivative, a preparation method thereof, and use of antibiotics pharmaceutical composition including the same as an active ingredient.

Abstract: The present invention provides a novel benzamide derivative or a pharmaceutically acceptable salt thereof, a method for preparing the same, and a 5-HT4 receptor agonist containing the same as an active ingredient. Benzamide derivatives of the present invention have a superior affinity for 5-HT4 receptors, a capability to reduce a gastric emptying time and a low toxicity, and consequently are therapeutically effective for the treatment of a variety of diseases associated with 5-HT4 receptors.

Abstract: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

Abstract: A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.

Abstract: Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

Abstract: A stack type semiconductor package and a method of fabricating the stack type semiconductor package. The stack type semiconductor package includes: a lower semiconductor package including a circuit board, a semiconductor chip which is disposed on an upper surface of the circuit board, via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and an encapsulation layer which encapsulates the upper surface of the circuit board and has via-holes through which the via-pads are exposed; and an upper semiconductor package which is stacked on the encapsulation layer, is electrically connected to the lower semiconductor package, and comprises internal connection terminals which are formed on a lower surface of the upper semiconductor package.

Abstract: A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.

Abstract: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

Abstract: Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

Abstract: A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.

Abstract: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

Abstract: Provided is a method of forming a package-on-package. An encapsulation is formed to cover a wafer using a wafer level molding process. The wafer includes a plurality of semiconductor chips and a plurality of through silicon vias (TSVs) passing through the semiconductor chips. The encapsulant may have openings aligned with the TSVs. The encapsulant and the semiconductor chips are divided to form a plurality of semiconductor packages. Another semiconductor package is stacked on one selected from the semiconductor packages. The other semiconductor package is electrically connected to the TSVs.

Abstract: A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform.