Abstract: A detection device for measuring an antenna is disclosed, wherein the detection device is provided with a probe seat made of a reflected wave absorbent material; a front end of the probe seat is provided with an extending front arm for connecting to a probe; and a rear end of the probe seat is provided with a connector, of which one end is for connecting to a detection instrument and the other end is electrically connected to the probe through the front arm, thereby when measuring an antenna, the probe seat can absorb reflected waves from the antenna to measure the quality of the antenna pattern.

Abstract: A detection device for measuring an antenna is disclosed, wherein it is provided with a probe seat made of a metal material; a front end of the probe seat is provided with an extending front arm for connecting to a probe; and a rear end of the probe seat is provided with a connector, of which one end is for connecting to a detection instrument and the other end is electrically connected to the probe through the front arm; the detection device is characterized in that an outer surface of the probe seat is covered by a wave absorbent material capable of absorbing reflected waves, thereby when measuring an antenna, the probe seat can absorb reflected waves from the antenna to measure the quality of the antenna pattern.

Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.

Abstract: A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.

Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.

Abstract: A method is provided for forming copper material over a substrate. The method includes forming a barrier layer over a substrate. Then, a depositing-soaking-treatment (DST) process is performed over the barrier layer. A copper layer is formed on the cobalt layer. The DST process includes depositing a cobalt layer on the barrier layer. Then, the cobalt layer is soaked with H2 gas at a first pressure. The cobalt layer is treated with a H2 plasma at a second pressure. The second pressure is lower than the first pressure.

Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: An insole structure includes a supporting layer, a buffer layer and a surface layer orderly superposed together. The supporting layer is provided thereon with an intermediate bulgy block, an arch bulgy block and a heel bulgy block. The buffer layer is disposed with an intermediate buffer portion, an arch buffer portion and a heel buffer portion at locations respectively corresponding with the intermediate bulgy block, the arch bulgy block and the heel bulgy block of the supporting layer. By so designing, the insole structure of this invention is able to rectify a user's foot shape and comfortable in wearing and to produce the insole structure, only need to have the buffer layer directly stuck to the supporting layer, able to greatly simplify manufacturing procedures, shortening labor hours and lower producing cost.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: The present invention discloses a method for fabricating a copper nanowire with high density twins, which comprises steps: providing a template having a top surface, a bottom surface and a plurality of through-holes penetrating the top surface and the bottom surface and having a diameter of smaller than 55 nm; placing the template in a copper-containing electrolyte at a low temperature lower than ambient temperature and applying a pulse current to perform an electrodeposition process to form a copper nanowire with twin structures in each through-hole. The pulse current increases the probability of stacking faults in the deposited copper ions. The low temperature operation favors formation of nucleation sites of twins. Therefore, the copper nanowire has higher density of twins. Thereby is effectively inhibited electromigration of the copper nanowire.

Abstract: A computer-implemented method for obtaining the rendering co-ordinates of visible text elements on a web page is disclosed. The web page is represented by an input data structure comprising a plurality of text nodes, each of which represents a text element on the web page. The method comprises the following steps: a) using a computer device, wrapping each of the plurality of text nodes in a pair of mark-up language tags; b) using said computer device, obtaining the co-ordinates of a bounding rectangle for each text node using the mark-up language tags; c) using said computer device, attaching an attribute specifying the co-ordinates of the bounding rectangle to each text node; and d) using said computer device, determining whether each text node is invisible, and if it is, excluding it from an output data structure comprising the plurality of text nodes and attached attributes.

Abstract: A machining method of a pipe welding type mixing faucet, which has a transverse connecting tube, two switch control valve seats, two screwed pipes, a discharge pipe coupling seat, a discharge pipe and a housing made of stainless steel. Reduced abutting ring surfaces are separately fabricated into the discharge hole and bottom port of two switch control valve seats as well as the discharge through-hole of the transverse connecting tube, allowing for abutting of the transverse connecting tube, screwed pipe and discharge pipe coupling seat. The mating points are welded securely. With these machining methods, the pipe welding type mixing faucet allows for water flow through a stainless steel structure, thus improving sanitary quality and safety of potable water.

Abstract: Disclosed is a method and apparatus for searching electronic documents. The 5 apparatus comprises first and second data repositories storing tags for representing content of an electronic document. The first data repository is adapted to store structured tags and their respective association with an electronic document, a structured tag comprising information representing its relationship to at least one other tag. The second data repository is adapted to 10 store free tags and their respective association with an electronic document, a free tag not comprising information representing its relationship to any other tags. Electronic documents can be searched by accessing the first and second data repositories, and matching a search query with one or more tags in the first and second data repositories. For each matched tag, an electronic document 15 associated with the tag can then be retrieved and a ranking for the electronic document determined based on attributes of the document and its associated tag.

Abstract: Embodiments of the present invention generally relate to processing of peptides in urea solutions and substantial prevention of carbamylation of the peptide.