Abstract: A container for a refrigerated fluid having an external container and an internal container between which an evacuated intermediate space is situated, which contains a superinsulator formed by several, separated layers of foil provided with a metal layer, is used as a storing device for electric energy. The foils act as foil capacitors and are electrically contacted so that an electric voltage can be applied to corresponding electric terminals on the exterior side of the container. In the container, a metal layer can be provided on both surfaces of the foil(s), and the foil(s) may consist of a material with a semiconductor characteristic. The foil capacitors are electrically connectable in series or parallel, and the electrical contacting of the foil metal surfaces can take place via a suspension structure of the internal container in the external container.

Abstract: An assembly press for producing an insulating glass element with two panes includes: two press elements arranged opposite each other with a working chamber defined by a spacing therebetween, the spacing being adjustable in a first direction to press together the panes; and a conveying device to transport the panes into and out of the working chamber in a second direction perpendicular to the first direction, at least one of the press elements being adjustable in a third direction perpendicular to the first and second directions. The conveying device comprises first and second drivable conveying elements respectively including first and second support mechanisms to respectively support lower faces of the two panes during transport in a first and second transport planes. The first and second conveying elements are adjustable independently of each other such that the transport planes are located at different positions in the third direction.

Abstract: A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die. The second semiconductor chip has a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer. The method further includes attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier.

Abstract: A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material.

Abstract: A piston housing unit comprises a housing with a longitudinal axis, a piston rod that is displaceable, in particular along the and/or around the longitudinal axis, a guide/damping unit for guiding and damping the displacement of the piston rod.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less than 10 atomic parts per million.

Abstract: A switchable damper comprises a housing having a longitudinal axis, a plunger displaceable along the longitudinal axis, a piston arranged between the housing and the plunger, a friction lining arranged on the piston and a switching unit, which is switchable between a blocking arrangement, in which the piston is blocked with respect to a displacement along the longitudinal axis, and a free-moving arrangement, in which the piston is released with respect to a displacement along the longitudinal axis.

Abstract: The invention relates to a nanostructured delivery system comprising at least one polymer and/or at least one lipid and at least one polymethine dye, wherein the at least one polymethine dye acting as a targeting unit brings about the targeted transport of the nanostructured delivery system into a target issue. The invention also relates to a pharmaceutical composition and the uses of the nanostructured delivery system for transporting said system and, optionally, a pharmaceutical active ingredient into the target tissue, as well for treating liver and/or kidney diseases.

Abstract: The present invention relates to protease variants and methods for obtaining protease variants. The present invention also relates to polynucleotides encoding the variants; nucleic acid constructs, vectors, and host cells comprising the polynucleotides; and methods of using the variants.

Abstract: A method is described for determining an opening delay of a fuel injector in which by activating a solenoid with the aid of an armature, a valve needle may be opened wherein a mathematical model is used which includes an activation duration of the solenoid as an input variable and a respective opening delay as an output variable.

Abstract: A method of operating an electric system of a motor vehicle, consisting of a fuel cell system, an accumulator and an electric driving motor is provided. Without implementing an electric voltage conversion and therefore without an electric voltage converter, as a function of the level of the electric voltage made available by the fuel cell system and by the accumulator and the electric power demanded by the electric motor, a first switching element in the connection between the fuel cell system and a node point electrically connected with the accumulator and the electric motor, as well as a second switching element in the connection between the accumulator and this node point are opened or closed as needed. This is done such that the power requirement of the electric motor is met primarily from the fuel cell system, and in an auxiliary fashion, additionally from the accumulator.

Abstract: The invention relates to a method for acquiring data in order to determine organ function, in particular the liver or kidney function, comprising one or more polymethine fluorescent dyes having a fluorescence emission maximum, measured in ethanol, of less than or equal to 820 nm, and to the use of dyes as markers for acquiring data in order to determine the organ function. The invention further relates to a kit for determining an organ function with a marker dye, and to a device for acquiring data in the method.

Abstract: A method for operating an engine system is provided. The method includes during a first condition, flowing exhaust gas from a first exhaust gas conduit to a first turbine inlet of a turbine and flowing exhaust gas from a second exhaust gas conduit to a turbine bypass conduit and during a second condition, flowing exhaust gas from the first exhaust gas conduit to the first turbine inlet and exhaust gas from the second exhaust gas conduit to a second turbine inlet.

Abstract: In a motor vehicle having a fuel cell, an air compressor provides input air under pressure at the fuel cell and an electric drive motor for driving the motor vehicle, which drive motor can be supplied with electric current by the fuel cell for that purpose, wherein the air compressor is driven by the drive motor.

Abstract: A chip arrangement includes semiconductor chips coupled to opposing sides of an insulating layer. The arrangement includes a first semiconductor chip having a first chip surface presenting a first chip conductive region. An electrically insulating layer includes a first layer surface presenting a first layer conductive region, and a second, opposing surface presenting a second layer conductive region. The electrically insulating layer is coupled to the first semiconductor chip by applying the first layer conductive region to the first chip conductive region. The electrically insulating layer is then coupled to the second chip conductive region by applying the second layer conductive region to the second chip conductive region.

Abstract: A method for fabricating semiconductor packages includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a first insulating material and encapsulating the semiconductor chip with a second insulating material to create a first encapsulation body.

Abstract: The invention relates to a photovoltaic element including an optically functional surface layer for improving a conversion of the incident light. The functioning of the layer involves absorbing incident sunlight having a low wavelength and emitting it again as light radiation having a higher wavelength, so that this light spectrum becomes usable for solar cells. In order to solve the currently unsolved problem of embedding such a layer into a thin-film solar cell with a substrate arranged on the front side, while ensuring high weathering resistance, it is proposed to arrange the optical functional layer in an additional encapsulation element on the front side and thus to construct the photovoltaic element as a double- or multiple composite assembly.

Abstract: Methods and systems are provided for flowing a first coolant and a second coolant to a charge air cooler. In one example, a method may include flowing only a first coolant, flowing only a second coolant, or flowing a mixture of the first and the second coolants to the charge air cooler based on engine operating conditions. Further, the method may include adjusting additional engine operating parameters based on a ratio of the first coolant to second coolant flowing to the charge air cooler.