Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.

Abstract: A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).

Abstract: The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.

Abstract: A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).

Abstract: A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the test pin is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested. The test pin has a hard stop edge which engages a hard stop wall which limits its rotation movement. The bottom of the pin has a shallow convex curvature preferably with a flat region and the tip of the test pin has a chisel edge.

Abstract: A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper (30) and lower (32) section and a hinge (44/46) in between which allow flex of both upper and lower contact (24/26) which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pins 230 by use of a modified hinge 244a.

Abstract: Articles are transferred from an article supply conveyor to an article receiving conveyor while the transferring articles are selectively reoriented. When the conveyors are in parallel, a travelling article reorienting turret seeks articles following an article absence or hole on the supply conveyor and transfers the following article to a next-in-line position on the receiving conveyor to cure or avoid holes of articles on the receiving conveyor.

Abstract: Articles are transferred from an article supply conveyor to an article receiving conveyor while the transferring articles are selectively reoriented. When the conveyors are in parallel, a travelling article reorienting turret seeks articles following an article absence or hole on the supply conveyor and transfers the following article to a next-in-line position on the receiving conveyor to cure or avoid holes of articles on the receiving conveyor.

Abstract: A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).

Abstract: A guide for use with a saw includes an attachment mechanism and a guide pin. The attachment mechanism removably attaches the guide to a back edge of a baseplate of the saw. The guide attaches to the baseplate proximate a cut made in the material when the saw is operated to make a cut in material. The guide is removable from the baseplate when not in use. The guide pin is movably or removably affixed to the attachment feature and extends into an area under the plane of the baseplate when the attachment feature of the guide is attached to the baseplate of the saw. The guide pin is configured to be in a plane of the blade and extend at least partially into the cut in the material made by the blade of the saw.

Abstract: A method for making electronic cigarette cartridges. The method includes a step of making the cartridges along a dedicated production line. The step of making the cartridges includes a step of making a casing by assembling one or more components along a first stretch of the production line and a step of making an electric module by assembling one or more electronic elements along a second stretch of the production line. The steps of making the casing and the electric module are steps which are synchronized and independent relative to one another. Once the steps of making the casing and the electric module are complete, the method includes a step of assembling the casing with a respective electric module to obtain the finished cartridge along a shared third stretch of the production line.

Abstract: The present invention relates to a method that may be used in a digital data communication system comprising a communication network constituted of a plurality of nodes, and a plurality of subscriber equipment units each connected to a node, includes: a transmission phase (P1) including the steps of limiting of the size of each frame to be transmitted, adding identification-authentication credentials, and transmitting the frames with a predetermined transmission interval; and a transmission phase (P2) including the steps of monitoring-checking for compliance with the input conditions; removal of each frame that is non-compliant, replicating each frame that is compliant, monitoring-checking for compliance with the output conditions, removing each frame that is non-compliant, transmitting each frame that is compliant, and recording and storing of the identification-authentication credential for each frame transmitted.

Abstract: The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: The present embodiments relate generally to applicators of on-skin sensor assemblies for measuring an analyte in a host, as well as their method of use and manufacture. In some aspects, an applicator for applying an on-skin sensor assembly to a skin of a host is provided. The applicator includes an applicator housing, a needle carrier assembly comprising an insertion element configured to insert a sensor of the on-skin sensor assembly into the skin of the host, a holder releasably coupled to the needle carrier assembly and configured to guide the on-skin sensor assembly while coupled to the needle carrier assembly, and a drive assembly configured to drive the insertion element from a proximal starting position to a distal insertion position, and from the distal insertion position to a proximal retraction position.

Abstract: This disclosure relates to a method of fabrication contact pins 24 used in testing circuit components, typically integrated circuits and the contact pins themselves. It is desirable to selectively radius certain portions of each pin to achieve desired performance of the entire pin. The portion to be radiused is cut to the desire shaped from a blank material. The portion which is not to be radiused is not cut to its final shape from the blank but to a larger shape which includes the material for the final shape. The entire cut portion is then treated to shape or round all exposed edges. Then the remaining portion of the pin is cut out from the larger blank area which was previously retained, leaving those portions with non-radiused edged.

Abstract: The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

Abstract: Articles are transferred from an article supply conveyor to an article receiving conveyor while the transferring articles are selectively reoriented. When the conveyors are in parallel, a travelling article reorienting turret seeks articles following an article absence or hole on the supply conveyor and transfers the following article to a next-in-line position on the receiving conveyor to cure or avoid holes of articles on the receiving conveyor.