Abstract: A lead finger of a lead frame in a lead package system for a semiconductor die includes a tread on a surface of the lead finger for increasing adhesion between the finger and an adhesive tape, the tape communicating between the tread and the die. The tread substantially minimizes lead finger bounce upon wire bonding the lead finger with the die. The tread is patterned to provide optimum surface area for adhesion with the adhesive tape. The tread includes a groove and/or cavity stamped or etched on the surface of the lead finger.

Abstract: A multichip module includes: a) a multichip module substrate; b) a first chip, the first chip having opposed base and bonding faces, the base face being adhered to the multichip module substrate, the first chip bonding face including a central area and a plurality of bonding pads peripheral to the central area; c) a second chip, the second chip having opposed base and bonding faces, the second chip bonding face including a central area and a plurality of peripheral bonding pads; d) a first/second adhesive layer interposed between and connecting the first chip bonding face and the second chip base face, the first/second adhesive layer having a thickness and a perimeter, the perimeter being positioned within the central area inside of the peripheral bonding pads; e) a plurality of first loop bonding wires bonded to and between the respective first chip bonding pads and the multichip module substrate, the respective first bonding wires having outwardly projecting loops of a defined loop height, the thickness of

Abstract: A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking is made possible by a low-loop-profile wire-bonding operation and thin-adhesive layer between the stacked dies.