Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.

Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: This document describes apparatus and methods for supplying electrical operating power to a thin form-factor display device, such as a flat panel video display device. In an illustrative example, components of a power supply for a flat panel video display are arranged to be substantially coplanar and adjacent to a display screen. The display screen and the power supply components may share a common housing. The power supply may provide appropriate electrical operating voltages to operate the display device. In some embodiments, an external thermally conductive panel of the display device is thermally coupled to components of the power supply through a low thermal impedance interface.

Abstract: This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.

Abstract: Power conversion apparatus can include a circuit board with power conversion circuitry and a package. The package may be formed by encapsulating areas of the circuit board assembly either before or after the interface contacts are attached to the circuit board. A method for encapsulating two sides of a substrate can include providing a mold that fills a larger first cavity to create a sealing force on a smaller second cavity. The encapsulant flows through the first cavity into the second cavity. A thermal extender can include a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors may mate with contacts on the heat dissipating power converter and with conductive regions on the external circuit board. A heat sink may be thermally coupled to remove heat generated by the power converter.

Abstract: Power conversion apparatus includes a circuit board with power conversion circuitry and a package having an upper portion and a lower portion that respectively enclose circuitry on a top surface and a bottom surface of the circuit board. The lower portion encloses a smaller region than that enclosed by the upper portion. The regions are arranged to define an overhang region on the bottom surface of the circuit board. Interface contacts are provided on the bottom surface in the overhang region for making electrical connections to the circuit board. A thermal extender includes a surface for mounting a heat dissipating power converter and a surface for mating with an external circuit board. Interface conductors mate with contacts on the power converter and with conductive regions on the external circuit board. A heat sink is thermally coupled to remove heat generated by the power converter.

Abstract: A power converter includes electrical contacts arranged on a first surface and a connection device. The converter has a top surface above the first surface and a bottom surface below the first surface. A border of the bottom surface is inset from a border of the second surface. The connection device includes a pair of conductive legs, each leg comprising a first end and a second end. The pair of legs lie opposite each other in a pair of evenly spaced planes that intersect the first surface. The first ends are adapted to connect to one or more of the contacts on the first surface and the second ends are adapted to connect to one or more conductive pads on a surface of a substrate. The connection device is adapted to enable the first ends of the two legs to connect to the contacts from below the first surface.

Abstract: Power conversion apparatus includes a circuit board with power conversion circuitry and a package. The package includes an upper portion that encloses circuitry on a top surface of the circuit board and a lower portion that encloses circuitry on a bottom surface of the circuit board. The lower portion encloses a region on the circuit board that is smaller than the region enclosed by the upper portion and is arranged to define an overhang region on the bottom surface of the circuit board. The overhang region preferably extends along two or more sides of the periphery of the bottom surface. Interface contacts are provided on the bottom surface in the overhang region for making electrical connections to the circuit board. The power conversion apparatus may be mounted in an aperture in an external circuit board or may be mounted horizontally or vertically to the external board using an interconnect extender.

Abstract: This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.