Abstract: In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Abstract: A method for installing a prestressing element in an anchor block, in which the prestressing element is attached to a holder, includes the holder being moved to the anchor block, the prestressing element being introduced into a through-opening of the anchor block, and the prestressing element being fixed to the anchor block. The holder can be attached to the prestressing element at a distance which is selected so that the length of the projection of the prestressing element on the side of the holder facing the anchor block is greater than the length of a portion of the prestressing element, which is required for introducing the prestressing element into the through-opening and fixing the prestressing element to the anchor block.

Abstract: An apparatus is configured to de-ice a surface of a casing tube of a tendon that is exposed to weather influences, or to guard the case tube against ice forming on the case tube, where the tendon is anchored to a structure by an anchoring device. The apparatus includes a power device, one end of which is directly or indirectly in force transmitting engagement with the anchoring device and the other end is directly or indirectly in force transmitting engagement with the casing tube. The power device is configured to move the casing tube relative to the anchoring device in the circumferential, radial and/or axial direction in relation to the longitudinal extension direction of the casing tube.

Abstract: An arrangement for the individualized in-vitro patient blood analysis includes a holography module, a Raman spectroscopy module, a biomarker module and a flow controller which are connected in a data and information transmitting manner to a central control and computer unit, which has an information transmitting connection to a database, wherein the modules are fluidically connected to a common blood sample supply and supplies for fluid other than blood via the flow controller.

Abstract: A switchable damper comprises a housing having a longitudinal axis, a plunger displaceable along the longitudinal axis, a piston arranged between the housing and the plunger, a friction lining arranged on the piston and a switching unit, which is switchable between a blocking arrangement, in which the piston is blocked with respect to a displacement along the longitudinal axis, and a free-moving arrangement, in which the piston is released with respect to a displacement along the longitudinal axis.

Abstract: A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

Abstract: A support bracket for holding interior components of a vehicle includes a base plate and an add-on module, which are engageable with each other to facilitate replacement and maintenance.

Abstract: Crosslinkable silicone compositions with improved electrical properties are prepared by crosslinking an at least three component composition crosslinkable by hydrosilylation, each component containing siloxy units with 1 or 2 3,3,3-trifluoropropyl substituents.

Abstract: A damper includes a housing with at least one axially offset longitudinally extending guide channel for receiving a plunger of a piston assembly. The plunger is axially offset from a control rod extending through the housing and the piston assembly. A coil spring surrounds the housing and extends between a hemispherical cap of the housing and the piston. The plunger includes a friction pad which engages the guide channel of the housing to provide frictional inter-engagement for the damper. In one embodiment, the housing includes a pair of axially offset guide channels and the piston assembly includes a pair of axially offset plungers which extend within a pair of guides of the housing. One of the plungers includes a linear sensor which provides signal information for use by a washer control circuit.

Abstract: The present invention relates to protease variants and methods for obtaining protease variants. The present invention also relates to polynucleotides encoding the variants; nucleic acid constructs, vectors, and host cells comprising the polynucleotides; and methods of using the variants.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

Abstract: A cabin arrangement for an aircraft, includes a galley monument, which has at least one projection surface, and a projector device by which graphical information can be projected onto the at least one projection surface. Furthermore, an aircraft is described which has at least one such cabin arrangement with the galley monument.

Abstract: A galley monument for an aircraft has a shelf structure, a pull-out member supported on the shelf structure so as to be able to be moved between an insertion position and a deployment position and has a carrier plate, and a display device supported on the pull-out member and having a display. A first surface of the carrier plate in the deployment position of the pull-out member is located in a deployment plane and protrudes with respect to the shelf structure and is located in the insertion position at least partially inside the shelf structure. The display device in the deployment position of the pull-out member can be pivoted about a centre of rotation between a storage position, in which the display device extends parallel with the deployment plane, and a position for use, in which the display device extends transversely relative to the deployment plane.

Abstract: A method for manipulating ions contained in an encapsulation material for a semiconductor device is provided. The method includes processing the encapsulation material and applying an electric field to the encapsulation material before the encapsulation material is finally cured. The ions contained in the encapsulation material have a mobility that decreases as the encapsulation material cures. By applying the electric field to the encapsulation material before the encapsulation material is finally cured, the amount of ions contained in the encapsulation material is reduced and/or the ions contained are concentrated in one or more regions of the encapsulation material. Corresponding apparatuses and semiconductor packages manufactured by the method are also described.

Abstract: A method for manipulating ions contained in an encapsulation material for a semiconductor device is provided. The method includes processing the encapsulation material and applying an electric field to the encapsulation material before the encapsulation material is finally cured. The ions contained in the encapsulation material have a mobility that decreases as the encapsulation material cures. By applying the electric field to the encapsulation material before the encapsulation material is finally cured, the amount of ions contained in the encapsulation material is reduced and/or the ions contained are concentrated in one or more regions of the encapsulation material. Corresponding apparatuses and semiconductor packages manufactured by the method are also described.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Abstract: A carrier component for a vehicle application, formed by two half-shells that are welded to one another at contact sides. When assembling the two half-shells for joining same at the contact sides, in a position in which the two half-shells are arranged above one another, the point of contact of the lower half-shell protrudes in relation to the external closed side of the other half-shell. The point of contact of one of the two half-shells protrudes inward in relation to the internal closed side of the other half-shell. A method for producing a carrier component from two half-shells is also disclosed.

Abstract: The present invention relates to novel subtilase variants exhibiting increased stability and optionally on par or improved wash performance. The variants of the invention are suitable for use in e.g. cleaning or detergent compositions, such as laundry detergent compositions and dish wash compositions, including automatic dish wash compositions. The present invention also relates to isolated DNA sequences encoding the variants, expression vectors, host cells, and methods for producing and using the variants of the invention.

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

Abstract: A method for installing a prestressing element in an anchor block, in which the prestressing element is attached to a holder, includes the holder being moved to the anchor block, the prestressing element being introduced into a through-opening of the anchor block, and the prestressing element being fixed to the anchor block. The holder can be attached to the prestressing element at a distance which is selected so that the length of the projection of the prestressing element on the side of the holder facing the anchor block is greater than the length of a portion of the prestressing element, which is required for introducing the prestressing element into the through-opening and fixing the prestressing element to the anchor block. A holder for carrying out the method is also disclosed.