Abstract: Application of an extremely low K material by the application of a laminate onto a wafer. The laminate preferably contains alternating layers of low K material and etch stop layers, and could be applied by rolling the laminate onto the wafer. An anneal process can be utilized to bond the film to the wafer. Conventional photo masking and etching techniques are then used to open vias and line areas in the film, and to deposit the next copper layer on the wafer. Electro polishing can be used to planarize or remove residual copper. Thereafter, an etch step can be performed to remove the excess material between the copper lines to leave an ultra low K region between the copper lines. The next layer of low K film can then be deposited, and the process repeated for all subsequent metal layering.

Abstract: A mask for use in a photolithographic process. The mask includes a plate or substrate having first and second opposite surfaces, a first image on the first surface of the substrate and a second image on the second surface of the substrate. When the mask is used in a photolithographic process, energy is reflected by the first image prior to entering the substrate and energy is reflected by the second image after passing through the substrate.

Abstract: A conductive type of seed or process film is used to cover the front side, the side, and at least a portion of the back side of a semiconductor wafer. The portion of the film which is on the back side of the wafer acts as contact for the electro-plating or electro-polishing process, thereby obviating the need for any front side contact. During the electro-process, the wafer can be positioned on a backing plate which supports the wafer as well as contacts which engage at least a portion of the conductive layer on the back side of the wafer. In depositing the conductive seed or process film, the wafer is positioned on a pedestal which has a diameter that is smaller than a diameter of the wafer. The difference in the pedestal and wafer diameters then becomes the area where the conductive seed or process film covers the back side of the wafer. The conductive film can be easily removed during subsequent wafer processing.

Abstract: A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.

Abstract: A method and apparatus for adding slurry using a moveable outlet, such as one or more moveable arms, in a semiconductor wafer polishing system. The end of the slurry arm could be set to fan out the slurry as the slurry is dispensed onto the pad. Preferably, the arm is set so that the distance and centering of the arm is controlled by the setup of the process. The arm could be set to move in an arc, or to move in and out on a set track. Regardless, the slurry is preferably sprayed onto the pad in the location needed to place the slurry on the pad, but only in the areas that are needed. This increases the control of the uniformity of the process, and preferably reduces the total amount of slurry that is used in the process.

Abstract: A method of electro-polishing a copper plated wafer. The method includes providing an opening which is at least as long as the copper plated wafer. The method includes dispensing an electrolyte through the opening such that the electrolyte contacts the copper plated wafer, and while dispensing the electrolyte through the opening, relative movement is effected between the opening and the copper plated wafer. The opening can have a uniform width, be convex, concave, or take any other shape depending on the application. The copper plated wafer can be moved linearly across the opening and can also be rotated. The electrolyte can be delivered to a process tank having a containment device thereon which provides the opening. As such, the opening functions an overflow weir.

Abstract: Application of an extremely low K material by the application of a laminate onto a wafer. The laminate preferably contains alternating layers of low K material and etch stop layers, and could be applied by rolling the laminate onto the wafer. An anneal process can be utilized to bond the film to the wafer. Conventional photo masking and etching techniques are then used to open vias and line areas in the film, and to deposit the next copper layer on the wafer. Electro polishing can be used to planarize or remove residual copper. Thereafter, an etch step can be performed to remove the excess material between the copper lines to leave an ultra low K region between the copper lines. The next layer of low K film can then be deposited, and the process repeated for all subsequent metal layering.

Abstract: A method and control system for controlling the delivery of a source chemical by a carrier gas. The carrier gas is delivered to a vessel containing the source chemical, and a flow of source chemical and carrier gas is carried from the vessel along a flow line. A sensor is used to detect light absorption of the flow, and the flow is adjusted based on what is detected. The sensor provides that light is directed transversely through the flow line and that the intensity of the light which passes through the flow line is detected by a detector. The detector forwards an output signal to a signal processing unit which thereafter adjusts the flow based on what was detected. The light may be filtered. The flow line includes at least a portion which provides an optical window for allowing light to pass therethrough.

Abstract: This invention discloses an apparatus for measuring the weight of a fetus in utero including an ultrasonic imager providing at least one ultrasonic image, a volume determiner operative to employ the at least one ultrasonic image to provide volume information relating to at least part of the volume of the fetus in utero, and a weight determiner operative to employ said volume information relating to at least part of the volume of the fetus and density information relating to the at least part of the volume of the fetus for providing an output indication representing the weight of the fetus in utero. A method for measuring the weight of a fetus in is also disclosed.

Abstract: This invention discloses a system for providing an image of at least a portion of a fetus in utero including an imager providing image data for a volume including at least a portion of a fetus in utero, an at least partially computer controlled image processing algorithm based segmenter for defining geometrical boundaries of various objects in the volume including at least a portion of a fetus in utero, and a sculpting tool, utilizing the geometrical boundaries of at least some of the various objects defined by the segmenter, for selectably removing image data relating to at least portions of the objects in order to provide a desired non-occluded image of at least a portion of the fetus in utero based on the image data. A method for providing an image of at least a portion of a fetus in utero is also disclosed.

Abstract: An in vivo source of mechanical energy is provided in close proximity to its load. In the disclosed embodiments, the mechanical energy source is a miniaturized motor (“micromotor”) and the load is a miniaturized perfusion pump located at the distal end of a transluminal catheter. The motor is powerful enough to provide the electrical energy needed by the perfusion pump to fluid, and yet small enough to fit inside a body vessel. A position sensor may be provided for automatically controlling the motor's driving current so that it is corresponds to the applied load. An embodiment of the perfusion pump is also provided in which an external energy source is used. Another embodiment is provided wherein a balloon/pump/miniaturized-motor configuration is provided on a distal end of a catheter.

Abstract: This invention discloses an apparatus for fetal weight determination including an ultrasonic imager operative to image a fetus in utero and to provide output image data in respect thereof, an image processor operative automatically to measure at least one dimension of at least one fetal body part based on the output image data and to provide output body part dimension data, and an automatic fetal weight calculator operative to calculate fetal weight automatically based on the output body part dimension data. A method for determining fetal weight is also disclosed.

Abstract: An ultrasonic imaging system including a probe containing at least one ultrasonic transducer and at least one inertial sensor as well as electronic circuitry connected to the probe for causing the at least one ultrasonic transducer to transmit ultrasonic energy into a region and to receive reflected ultrasonic energy therefrom, creating a plurality of generally two-dimensional images whose geometrical relationship is indicated by outputs from the at least one inertial sensor.

Abstract: An in vivo source of mechanical energy is provided in close proximity to its load. In the disclosed embodiments, the mechanical energy source is a miniaturized motor ("micromotor") and the load is a miniaturized perfusion pump located at the distal end of a transluminal catheter. The motor is powerful enough to provide the electrical energy needed by the perfusion pump to fluid, and yet small enough to fit inside a body vessel. A position sensor may be provided for automatically controlling the motor's driving current so that it is corresponds to the applied load. An embodiment of the perfusion pump is also provided in which an external energy source is used. Another embodiment is provided wherein a balloon/pump/miniaturized-motor configuration is provided on a distal end of a catheter.

Abstract: An in vivo source of mechanical energy is provided in close proximity to its load. In the disclosed embodiments, the mechanical energy source is a miniaturized motor ("micromotor") and the load is a miniaturized perfusion pump located at the distal end of a transluminal catheter. The motor is powerful enough to provide the electrical energy needed by the perfusion pump to fluid, and yet small enough to fit inside a body vessel. A position sensor may be provided for automatically controlling the motor's driving current so that it is corresponds to the applied load. An embodiment of the perfusion pump is also provided in which an external energy source is used. Another embodiment is provided wherein a balloon/pump/miniaturized-motor configuration is provided on a distal end of a catheter.

Abstract: An in vivo source of mechanical energy is provided in close proximity to its load. In the disclosed embodiments, the mechanical energy source is a miniaturized motor ("micromotor") and the load is a miniaturized perfusion pump located at the distal end of a transluminal catheter. The motor is powerful enough to provide the electrical energy needed by the perfusion pump to fluid, and yet small enough to fit inside a body vessel. A position sensor may be provided for automatically controlling the motor's driving current so that it is corresponds to the applied load. An embodiment of the perfusion pump is also provided in which an external energy source is used. Another embodiment is provided wherein a balloon/pump/miniaturized-motor configuration is provided on a distal end of a catheter.

Abstract: A method and apparatus for producing plastic products from waste materials by: cutting into pieces a thermoplastic material having a loss factor higher than 0.005 such as to have a high absorbence of radio-frequency radiation, mixing the pieces with at least one other particulate material, depositing the mixture on a supporting surface; applying radio-frequency radiation to the mixture sufficient to soften mainly the outer surfaces of the pieces of thermoplastic material by dielectric heating, while applying pressure to the mixture to bond the mixture together by sintering; and removing the sintered mixture from the supporting surface.

Abstract: A contact-free, optical measurement system for determining the precision with which an article rotates. A reflective surface is secured to a rotating surface and a light source, such as a laser, is disposed thereabove. A target is likewise secured in association with the light source to receive the reflected light from the spinning surface. In this manner, any dynamic angular misalignment, or wobble, in the spinning surface will be manifested in movement of the reflected light upon the target. The degree of wobble of the spinning surface may then be readily ascertained.