Abstract: A reaction frame structure for isolating the vibrations induced by reaction forces from stage motions, such as for a guideless stage. The reaction frame supports the driving motors in a manner whereby the reaction frame is structurally decoupled from the stage (e.g., by a slidable coupling) at least with respect to reaction forces in one direction of motion. In one embodiment, the fixed portion of the drive devices for effecting stage motion in a first direction is coupled to the reaction frame by a slidable coupling. The reaction frame is coupled to ground. The rest of the system including the stage is isolated from ground by deploying a vibration isolation system. A spring damper absorbs the reaction forces of the drive devices in the first direction. In another embodiment, the reaction frame is slidably supported on the same base as the stage. Dampers may be provided to the reaction frame along the first direction and/or a second orthogonal direction.

Abstract: A high accuracy stage supported in six degrees of freedom by electromagnetic bearings. Movements in the horizontal plane of the stage are controlled by variable reluctance actuators which are mounted between the high accuracy stage and a coarse stage so as not to distort the high accuracy stage during movements thereof. The high accuracy stage is supported in three vertical degrees of freedom by electromagnetic actuators disposed between the coarse stage and the high accuracy stage and aided by a supplemental vertical support disposed adjacent to the actuators. Preferably, the high accuracy stage is suspended from a bar supported by the supplemental vertical support, which is preferably air bellows.

Abstract: A stage assembly for an exposure apparatus is disclosed. The stage assembly comprises a guide assembly. The guide assembly includes a guide bar, a stage, a first actuator component, and a second actuator component. The guide bar is movable in a first direction and has a center of gravity and a guiding portion. The stage is movable along the guiding portion of the guide bar in a second direction substantially perpendicular to the first direction and exerts a reaction force on the guide bar. The stage has a center of gravity spaced apart from the center of gravity of the guide bar in the first direction. The first actuator component is positioned on the guide bar. The first actuator component is aligned with the center of gravity of the stage in the second direction to apply a compensating force on the guide bar to cancel the reaction force exerted by the stage. The second actuator component is positioned on the guide bar.

Abstract: An apparatus and method precisely position a table or stage with respect to a frame in six degrees of freedom. The system includes a plurality of actuators between the stage and the frame which adjust the position of the frame in three degrees of freedom. The stage is also attached to at least one block assembly. Adjustment of the block assemblies adjusts the position of the stage with respect to the frame in an additional three degrees of freedom. In the context of photolithographic semiconductor processing, a wafer stage can thereby be precisely positioned with respect to a frame or reticle.

Abstract: Apparatus and methods are disclosed for detecting and measuring a tool-induced shift in a microlithography apparatus (“stepper”). The apparatus and methods are set forth in the context of microlithography apparatus that include a wafer stage and a holding member to which the wafer is mounted for exposure. The holding member can include, for example, a wafer table and wafer chuck, wherein the wafer table desirably includes a respective movable mirror for each of X- and Y-directions of movement. The holding member is rotatable, relative to the wafer stage, from a first rotational position to a second rotational position, which can be angularly displaced, e.g., 90° and/or 180° from each other. At each of the first and second rotational positions, a respective location of an alignment feature on the holding member (e.g., on the substrate, wafer chuck, or wafer table) is determined.

Abstract: A wafer stage device and control system are provided to stabilize a wafer stage and a wafer table in a wafer manufacturing process. The wafer table supports the semiconductor wafer, while the wafer stage is accelerated in response to a wafer manufacturing control system to position the wafer table. The wafer stage device includes a set of flexures connecting the wafer table to the wafer stage. The flexures are positioned in a plane which is substantially in alignment with an upper surface of the wafer. The flexure's configuration causes a rotational error, such as pitching or rolling, of the wafer table as the wafer stage moves. The wafer stage device further includes a plurality of actuators to control the rotational error by exerting a stabilizing torque to the wafer table. The control system determines the stabilizing torque necessary to correct the pitching or rolling error of the wafer table.

Abstract: In a stage device of an exposure apparatus, a first stage is driven in the X-axis direction by a first X-axis motor while being supported at one side by a first guide bar, and a second stage is driven in the X-axis direction by a second X-axis motor while being supported at one side by a second guide bar. The first guide bar and the second guide bar are independently driven in the Y-axis direction by a Y-axis linear motor. In a state in which the first guide bar and the second guide bar are closest to each other, the end of the first stage opposite from the side supported by the first guide bar is placed above the second guide bar, and the end of the second stage opposite from the side supported by the second guide bar is placed above the first guide bar. First and second substrate tables are supported above the first and second stages, respectively, via first and second minutely driving devices.

Abstract: A connection assembly is provided to connect a part positioned inside a chamber assembly to a stationary surface. The chamber assembly provides a controlled atmospheric condition therein to isolate semiconductor substrates, a wafer stage device, and the process of making semiconductor substrates from the atmospheric condition so that the resulted substrates have an improved quality and meet certain wafer manufacturing specifications. The connection assembly includes a vibration isolation connection assembly and a bellows assembly. The vibration isolation connection assembly is removably connected to a part positioned in the chamber assembly via a link. The bellows assembly encases the vibration isolation connection assembly to maintain a controlled condition of the chamber assembly. The bellows assembly has a first end removably connected to a panel of the chamber assembly, and a second end connected to a stationary surface.

Abstract: A base assembly is provided to support a wafer stage chamber assembly of a wafer manufacturing system. The wafer stage chamber assembly isolates semiconductor substrates from the atmosphere so that the resulted wafers have an improved quality and meet certain wafer manufacturing specifications. The base assembly includes a stage base to support the stage device, a base frame to support the stage base, and a plurality of support members to attach the base frame to an apparatus frame of the semiconductor substrate manufacturing apparatus. The base assembly also includes at least one mover base positioned adjacent the stage base to support at least one mover assembly. In addition, the base assembly is provided with an accessory channel to store accessories, such as cables, hoses, and wires, away from various moving parts in the wafer stage chamber assembly.

Abstract: A device and method are provided to remove a wafer stage carrier carrying a wafer stage assembly from an exposure apparatus. The wafer stage carrier may be removably fastened to the apparatus frame of the exposure apparatus by any types of mechanical fasteners. The removal assembly includes a set of expandable supports and a set of removal supports. When the apparatus frame supports the wafer stage carrier, the wafer stage carrier hangs above a stationary surface, such as the ground. To remove the wafer stage carrier, the set of expandable supports is expanded until it reaches the ground and is capable of supporting the weight of the wafer stage carrier. At this juncture, the mechanical fasteners may be removed to allow the weight of the wafer stage carrier to transfer from the apparatus frame to the expandable supports.

Abstract: A planar electric motor comprising a magnet array having a plurality of magnets with magnetic fields of alternating polarity and a coil array positioned adjacent to the magnet array and operable to interact with said magnetic fields to generate an electromagnetic force between the coil array and the magnet array. The coil array includes a first linear coil array having a plurality of polygonal shaped coils extending longitudinally in a first direction, and a second linear coil array having a plurality of oval shaped coils extending longitudinally in a second direction generally orthogonal to said first direction. The motor is for use in moving a stage within an exposure apparatus having an optical system for imaging a pattern formed in a reticle onto an article supported by the stage.

Abstract: A planar electric motor comprising a magnet array having a plurality of magnets with magnetic fields of alternating polarity and a coil array positioned adjacent to the magnet array and operable to interact with the magnetic fields to generate an electromagnetic force between the coil array and the magnet array. The coil array comprises a first linear coil array having a plurality of oval shaped coils extending longitudinally in a first direction, and a second linear coil array having a plurality of oval shaped coils extending longitudinally in a second direction generally orthogonal to the first direction. The motor is for use in moving a stage within an exposure apparatus having an optical system for imaging a pattern formed in a reticle onto an article supported by the stage.

Abstract: A wafer stage assembly is provided to be used in combination with a projection lens assembly, such as in a semiconductor wafer manufacturing process. The wafer stage assembly includes a wafer table supported and positioned by a wafer stage and a wafer stage base for carrying a semiconductor wafer. The wafer stage assembly also includes a plurality of sets of sensors to determine a position and a rotation of the wafer table in six degrees of freedom relative to the projection lens assembly. A first set of sensors determines a position and a rotation of the wafer table relative to the projection lens assembly in at least one of the six degrees of freedom, while a second set of sensors determines a position and a rotation of the wafer table relative to the wafer stage base in the remaining of the six degrees of freedom.

Abstract: A stage assembly and support system are provided to stabilize a stage base, such as a wafer stage base or a reticle stage base, minimizing forces transmitted from the stage assembly to a stationary surface, such as the ground, and thereby preventing vibration of other parts or systems in a wafer manufacturing process. Depending of the applicable photolithography system, a reticle stage and/or a wafer stage are accelerated in response to a wafer manufacturing control system to position the semiconductor substrates. The jerking motions of the reticle stage and/or wafer stage cause reaction forces acting on the reticle stage base and/or wafer stage base. The reaction forces induce vibration to the stationary surface and surrounding parts of the photolithography system. The wafer stage assembly and support system according to this invention allow the reticle stage base and/or wafer stage base to move relative the stationary surface.

Abstract: A chamber seal device is provided to seal a wafer stage chamber assembly to isolate semiconductor substrates, a wafer stage device, and the process of making semiconductor wafers from an atmospheric condition, so that the resulted wafers have an improved quality and meet certain wafer manufacturing specifications. The wafer stage chamber assembly includes a wafer stage chamber, a top wall and a base frame. The wafer stage chamber assembly is supported by an apparatus frame of an exposure apparatus via a plurality of body supports. Due to the limited access around the exposure apparatus, the chamber seal device of this invention provides a simple and quick mechanism to seal the wafer stage chamber assembly. The chamber seal device includes one or more o-ring seals positioned in between and surrounding the perimeter of the wafer stage chamber and the top wall, or the wafer stage chamber and the base frame to seal the wafer stage chamber assembly.

Abstract: A wafer stage chamber assembly is provided to isolate semiconductor substrates, a wafer stage device, and the process of making semiconductor wafers from the atmosphere so that the resulted wafers have an improved quality and meet certain wafer manufacturing specifications. The wafer stage chamber assembly includes a wafer stage chamber for sealing a wafer stage device from the atmosphere outside the wafer stage chamber, and at least one loader port for loading and unloading substrates into the wafer stage chamber. The wafer stage chamber is constructed of a chamber frame to enclose the wafer stage device, and a plurality of chamber walls including a front panel having the at least one loader port for loading and unloading a plurality of semiconductor substrates into the wafer stage chamber. The wafer stage chamber assembly also includes a top wall and a base frame.