Abstract: The present invention inter alia relates to an apparatus, comprising a detecting arrangement comprising a first and a second detecting unit, wherein the detecting arrangement is configured to at least detect a partial attaching of an attachable unit to the apparatus and a complete attaching of the attachable unit to the apparatus, wherein the attachable unit is configured to be removably attached to the apparatus, and wherein the detecting arrangement is configured to only enable at least one function of the apparatus, when a complete attaching of the attachable unit to the apparatus is detected.

Abstract: A heating and cooling system includes an evaporator, a compressor, and a condenser. A heat exchanger, which may be an outdoor heat exchanger, is configured to receive the refrigerant from the condenser, to selectively extract heat from or to add heat to the refrigerant, and to transfer the refrigerant to the evaporator. First control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the condenser to the heat exchanger in a first mode of operation. Second control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the heat exchanger to the evaporator in a second mode of operation. The system may be operated in a variety of modes by appropriate control of the valving and other system components.

Abstract: A heating and cooling system includes an evaporator, a compressor, and a condenser. A heat exchanger, which may be an outdoor heat exchanger, is configured to receive the refrigerant from the condenser, to selectively extract heat from or to add heat to the refrigerant, and to transfer the refrigerant to the evaporator. First control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the condenser to the heat exchanger in a first mode of operation. Second control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the heat exchanger to the evaporator in a second mode of operation. The system may be operated in a variety of modes by appropriate control of the valving and other system components.

Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.

Abstract: The present invention relates to the use of a compound of the formula (I), wherein X and Y independently of one another are OH, O—(C1-C6)-alkyl, NH2 or NH—(C1-C6)-alkyl, or X and Y together form a group —O— or wherein X and Y together form a further bond between the C atoms to which they are attached; R1 and R2 independently of one another are H, Cl or Br; R3 is H,(C1-C6)alkyl, C(?O)—(C1-C6)-alkyl or (C1-C6)-alkylene-NH—(C1-C6)-alkyl; R4 is H, (C1-C6)-alkyl or C(?O)—(C1-C6)-alkyl, and R5 is methyl or ethyl; or a physiologically tolerable salt of a compound of the formula (I), for the treatment and/or prophylaxis of cancer diseases, a pharmaceutical composition for the treatment and/or prophylaxis of cancer diseases comprising a compound of the formula (I), a compound of the formula (I) and a process for the preparation of the compound (I).

Abstract: A heat exchanger is provided with stacked coil sections. Each of the stacked coil sections is configured to circulate a fluid independent from the other coil section. An air moving device is used to circulate air through both of the stacked coil sections. The stacked coil sections are positioned to have the air exiting the one coil section entering the other coil section.

Abstract: A heating and cooling system includes an evaporator, a compressor, and a condenser. A heat exchanger, which may be an outdoor heat exchanger, is configured to receive the refrigerant from the condenser, to selectively extract heat from or to add heat to the refrigerant, and to transfer the refrigerant to the evaporator. First control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the condenser to the heat exchanger in a first mode of operation. Second control valving, disposed between the condenser and the heat exchanger, is configured to regulate flow of the refrigerant from the heat exchanger to the evaporator in a second mode of operation. The system may be operated in a variety of modes by appropriate control of the valving and other system components.

Abstract: The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.

Abstract: A noise control method is provided for a cooling system having at least one refrigerant circuit. The refrigerant circuit includes a compressor, a condenser, at least one condenser fan, and an evaporator. Noise control is only performed periodically in response to requirements for reduced operation at predetermined times. The request for reduced noise triggers the commencement of the noise control method. The noise control method involves reducing the operating speed of the compressor, as well as reducing the operating speed of at least one condenser fan, to within a predetermined range of allowable reduced operating speeds. The noise control method temporarily overrides the ability of the cooling system to fully respond to increased cooling or heating demands.

Abstract: A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

Abstract: Embodiments of the invention relate to a cover for a dryer. The dryer is adapted, when in operation, to heat a gas stream. The dryer includes a cover mounted to at least one section of an outer wall of the dryer, in particular a rear wall of the dryer. A passage through which the gas stream can flow is formed, at least sectionwise, by the cover. The cover can include a heating unit having at least one heating element such that the gas stream flows around the heating element when the dryer is in operation.

Abstract: A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

Abstract: A system and method for the fabrication of high reliability high performance Lange couplers (optionally including capacitors (1011), inductors (1012), multi-layer interconnects (1013), and resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed Lange coupler method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).

Abstract: The present invention relates to an electric baby food warmer for heating baby food held in a container by means of a heat transfer medium. The baby food warmer comprises a bowl where the container can be inserted for heating, and an electric heating for heating the bowl bottom. The invention further relates to a cover for an electric baby food warmer and to a process for heating baby food held in a container. In order to have an electric baby food warmer, a cover for an electric baby food warmer and a process for heating baby food held in a container, which renders the heating of baby food particularly fast, power saving and secure, according to the invention, water vapor is used as a heat transfer medium and the bowl walls together with the container and/or a cover form an essentially sealed chamber for retaining water vapor.