Abstract: A reconfigurable patch panel and a method of reconfiguring a patch panel comprising a support member supporting at least one adapter, where the at least one adapter comprises a plurality of ports for coupling to electric signal bearing cables. A pivot, associated with each of the at least one adapters, couples the at least one adapter to the support member. The at least one adapter selectively rotates about the pivot to a selected position relative to the support member. A retainer, associated with each of the at least one adapters, couples the support member to the at least one adapter and retains the at least one adapter in the selected position.

Abstract: A reconfigurable patch panel and a method of reconfiguring a patch panel comprising a support member supporting at least one adapter, where the at least one adapter comprises a plurality of ports for coupling to electric signal bearing cables. A pivot, associated with each of the at least one adapters, couples the at least one adapter to the support member. The at least one adapter selectively rotates about the pivot to a selected position relative to the support member. A retainer, associated with each of the at least one adapters, couples the support member to the at least one adapter and retains the at least one adapter in the selected position.

Abstract: A circuit board assembly includes a circuit board, and a connector supported by the circuit board. The connector is configured to electrically connect with a pluggable transceiver module having a retention post. The circuit board assembly further includes a cage supported by the circuit board. The cage includes a cage body defining (i) a circuit board side which faces the circuit board, (ii) an opposing side which faces away from the circuit board, and (iii) a cavity within which the module substantially resides during module operation. The connector is substantially disposed within the cavity. The cage further includes a tab is configured to engage the retention post of the module when the module substantially resides within the cavity defined by the cage body. The tab resides on the opposing side defined by the cage body. Such an assembly enables installation of the module with its belly side up.

Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

Abstract: A circuit board assembly includes a motherboard defining a motherboard plane, and a daughter board defining a daughter board plane which is substantially parallel to the motherboard plane. The motherboard and the daughter board electrically connect to each other through a set of circuit board connectors. The circuit board assembly further includes a set of edge clips. Each edge clip extends outwardly from the daughter board along the daughter board plane and is configured to operate as a mounting platform through which to physically secure the daughter board to the motherboard.

Abstract: A control assembly controls removal of a circuit board from a chassis. The control assembly includes a support member configured to fasten to the circuit board, and a handle pivotally attached to the support member. The handle is configured to swing from an opened position to a closed position relative to the support member during installation of the circuit board within the chassis, and from the closed position to the opened position during removal of the circuit board from the chassis. The control assembly further includes a button configured to move between a biased position and a depressed position relative to the support member. The button is further configured to (i) inhibit removal of the circuit board from the chassis when the button is in the biased position, and (ii) enable removal of the circuit board from the chassis when the button is in the depressed position.

Abstract: A control assembly controls removal of a circuit board from a chassis. The control assembly includes a support member configured to fasten to the circuit board, and a handle pivotally attached to the support member. The handle is configured to swing from an opened position to a closed position relative to the support member during installation of the circuit board within the chassis, and from the closed position to the opened position during removal of the circuit board from the chassis. The control assembly further includes a button configured to move between a biased position and a depressed position relative to the support member. The button is further configured to (i) inhibit removal of the circuit board from the chassis when the button is in the biased position, and (ii) enable removal of the circuit board from the chassis when the button is in the depressed position.

Abstract: A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between a first location proximate to the component and a second location distal to the component. The heat sink assembly further includes a first rail member coupled to the base member along the first edge of the base member, a second rail member coupled to the base member along the second edge of the base member, and an actuation mechanism coupled to the base member. The actuation mechanism is configured to move portions of the members toward each other when the base member resides at the first location to fasten the base member to the component.

Abstract: A heat sink attachment mechanism includes a fastener having an associated compressible member. The fastener defines a flange that, as the fastener secures a heat sink to a circuit board component, is configured to contact a circuit board surface associated with the circuit board component. Contact between the flange and the circuit board minimizes the travel of the fastener relative to the circuit board component and limits the stress generated on the circuit board component or on the solder balls of a ball grid array associated with the circuit boards component by the heat sink. Also, as the fastener secures the heat sink to the circuit board component, the fastener compresses the compressible member against the heat sink, thereby causing the compressible member to expand. Expansion of the compressible member allows the compressible member to absorb changes in the stress applied by the fastener to the heat sink and circuit board component over time.

Abstract: An improved heatsink attachment assembly includes a first anchor configured to secure to a first location of the circuit board, and a second anchor configured to secure to a second location of the circuit board. Each anchor includes legs having looped end portions configured to contact the circuit board. The heatsink attachment assembly further includes a heatsink clip configured to concurrently (i) fasten to the anchors when the anchors secure to the circuit board, and (ii) hold a heatsink to against a circuit board component of the circuit board. The looped end portions of the legs prevent the legs from completely passing through holes defined in the circuit board. In some situations, the looped end portions define extended coils (e.g., double loops) for a robust interference fit with the circuit board as well as for enhanced strength and stability.

Abstract: A retainer directly attaches to a circuit board component and to a heat sink and secures the circuit board component to the heat sink. The retainer provides a mechanical attachment between the heat sink and the circuit board component. Such mechanical attachment maintains thermal communication between the heat sink and the circuit board component in the absence of a thermally conductive adhesive between the heat sink and the circuit board component for the operational life of the circuit board component. Furthermore, because the retainer attaches directly to the circuit board component and to the heat sink, the retainer minimizes the necessity for use of mounting holes in the circuit board associated with the circuit board component to secure the heat sink to the circuit board component.

Abstract: A motherboard assembly includes a motherboard, a circuit board, and an ejector assembly. The motherboard has a motherboard connector extending from a planar surface of the motherboard. The circuit board has a circuit board connector extending from a planar surface of the circuit board and coupled to the motherboard connector of the motherboard such that the planar surface of the circuit board orients substantially parallel to the planar surface of the motherboard. The ejector assembly orients between the motherboard and the circuit board. During an ejection procedure, the ejector assembly separates the motherboard connector and the circuit board connector while minimizing bending of either the circuit board or the motherboard. By limiting bending of either the circuit board or the motherboard, the ejector assembly minimizes damage to electrical traces or components carried by either the circuit board or the motherboard during the separation process.

Abstract: A guide device receives and engages a cutout in a distal pin-bearing edge of a printed circuit board for aligning pins with pin sockets. The alignment device includes a web, sized and shaped to be received in a circuit board cutout and a shelf surface for engaging a part of a major surface of the circuit board, to provide for biaxial guidance during board insertion. By positioning guide devices and circuit board cutouts in different locations, for different circuit boards, insertion of circuit boards in an incorrect slot or location is avoided.

Abstract: A power rectifier having low on resistance, mass recovery times and low forward voltage drop. In a preferred embodiment, the present invention provides a power rectifier device employing a vertical device structure, i.e., with current flow between the major surfaces of the discrete device. The device employs a large number of parallel connected cells, each comprising a MOSFET structure with a gate to drain short via a common metallization. This provides a low Vf path through the channel regions of the MOSFET cells to the source region on the other side of the integrated circuit. A thin gate structure is formed annularly around the pedestal regions on the upper surface of the device and a precisely controlled body implant defines the channel region and allows controllable device characteristics, including gate threshold voltage and Vf. A parallel Schottky diode is also provided which increases the switching speed of the MOSFET cells.

Abstract: A power rectifier having low on resistance, mass recovery times and low forward voltage drop. In a preferred embodiment, the present invention provides a power rectifier device employing a vertical device structure, i.e., with current flow between the major surfaces of the discrete device. The device employs a large number of parallel connected cells, each comprising a MOSFET structure with a gate to drain short via a common metallization. This provides a low Vf path through the channel regions of the MOSFET cells to the source region on the other side of the integrated circuit. A thin gate structure is formed annularly around the pedestal regions on the upper surface of the device and a precisely controlled body implant defines the channel region and allows controllable device characteristics, including gate threshold voltage and Vf. A parallel Schottky diode is also provided which increases the switching speed of the MOSFET cells.

Abstract: A power rectifier having low on resistance, fast recovery times and very low forward voltage drop. In a preferred embodiment, the present invention provides a power rectifier device employing a vertical device structure, i.e., with current flow between the major surfaces of the discrete device. The device employs a large number of parallel connected cells, each comprising a MOSFET structure with a gate to drain short via a common metallization. A self aligned body implant and a shallow silicide drain contact region integrated with a metal silicide drain contact define a narrow channel region and allow very high cell density. This provides a low Vf path through the channel regions of the MOSFET cells to the contact on the other side of the integrated circuit. The present invention further provides a method for manufacturing a rectifier device which provides the above desirable device characteristics in a repeatable manner. Also, only two masking steps are required, reducing processing costs.