Abstract: A system and method for dental ventilation is provided including a fan mount assembly wherein a fan unit having a perimeter fan ring is engaged with the fan mount assembly by engaging a locking ring to the fan mount assembly over the perimeter fan ring. The fan unit is connected to an air intake using a duct hose. The air intake includes a light receptacle receiving a light to illuminate a patient and a battery holder receiving a battery to electrically power the light.

Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.

Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.

Abstract: An integrated circuit includes a first and a second die positioned on a lead frame of a package. The lead frame includes a plurality of bond fingers. The integrated circuit includes a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through first and second bond fingers of the lead frame. The package may be a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame.

Abstract: An integrated circuit (IC) package, such as a Quad Flat Pack (QFP), has at least one lead with a tip that extends substantially perpendicular to the ends of two or more bondwires, so that there is room for more than one bondwire to be attached to it along its length. Thus, bondwires leading from die bondpads that are not adjacent to one another can be efficiently connected to the same lead in a bus-like manner.

Abstract: An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.

Abstract: Optics are utilized in an input device such as a mouse or keyboard, for example, to detect a condition of one or more selection indicators, such as whether a key or button has been depressed or a scroll wheel has been rotated. Depressing a key, clicking a button and/or rotating a scroll wheel cause one or more optical signals to be reflected from the corresponding selection indicator onto an optical detector. The optical detector generates electrical signals in response to the light received by the optical detector. A computational device of the input device processes the electrical signals to determine whether a key or button has been depressed, whether a scroll wheel has been rotated, etc. The corresponding information is then input to a computer that is interfaced with the input device.

Abstract: A printer device includes a printer engine controller in communication with a print mechanism and a printer formatter. The printer formatter includes a quad flat pack (QFP) package having an application specific integrated circuit (ASIC) mounted and a memory device mounted therein. The printer device further includes a substrate having the QFP package and the printer engine controller mounted thereon.

Abstract: A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.

Abstract: An integrated circuit including a copper interconnection layer includes an aluminum distribution layer overlying the copper interconnection layer to distribute external electrical signals such as power, ground, and clock signals throughout the die of the device. The distribution layer overlies the copper interconnection layer in a grid pattern which connects to the copper interconnection layer through a plurality of vias. The distribution layer further includes a plurality of wire bond pads to permit wire bonding between the distribution layer and bonding pads of the integrated circuit package.