Patents by Inventor Michael Cusack

Michael Cusack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070045809
    Abstract: A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.
    Type: Application
    Filed: September 1, 2005
    Publication date: March 1, 2007
    Inventors: Thomas Wheless, Randall Briggs, Michael Cusack
  • Publication number: 20050082675
    Abstract: An integrated circuit including a copper interconnection layer includes an aluminum distribution layer overlying the copper interconnection layer to distribute external electrical signals such as power, ground, and clock signals throughout the die of the device. The distribution layer overlies the copper interconnection layer in a grid pattern which connects to the copper interconnection layer through a plurality of vias. The distribution layer further includes a plurality of wire bond pads to permit wire bonding between the distribution layer and bonding pads of the integrated circuit package.
    Type: Application
    Filed: October 3, 2003
    Publication date: April 21, 2005
    Inventors: Salvador Salcido, Michael Kelly, Michael Cusack, Ravindhar Kaw