Abstract: An integrated circuit die is disclosed including a temperature detection circuit and a memory configured to store calibration data. The temperature detection circuit is operatively coupled to the memory, and receives an input signal. The temperature detection circuit is configured to produce an output signal dependent upon the input signal and indicative of whether a temperature of the integrated circuit die is greater than a selected temperature. During a normal operating mode of the integrated circuit die the input signal comprises the calibration data. A system and methods for calibrating the temperature detection circuit are also described.

Abstract: The present invention provides a temperature sensitive ring oscillator (TSRO) in an integrated circuit. A temperature measuring device, such as a thermal resistor, is proximate the TSRO, which shares a substantially similar temperature. A memory is employable for storing data that is a function of the output of the TSRO and the temperature measuring device.

Abstract: The present invention provides for supporting an on chip-timer facility and, more particularly, to the generation of a constant time incremental increase while changing core mesh-clock frequency. A latch is coupled to the output of a first free-running clock. An inverter is coupled to the output of the first latch. At least one other secondary latch is coupled to the output of the first latch. An edge detector is coupled to the output of the secondary latch. An incrementer or decrementer is coupled to the output of the edge detector. A memory is coupled to the output of the incrementer or decrementer.

Abstract: Disclosed is an apparatus incorporating hardware based logic and a predetermined default list of software affecting responses to be taken in connection with temperatures sensed by thermal sensors checking the temperature of portions of computer logic. At the time application software is loaded, the software can modify the default response list. The list of responses to be taken and the over temperature conditions at which they are to be activated are stored in hardware directly accessible by hardware based thermal sensor monitoring logic for direct control of the hardware. The control can alter conditions such as clock frequency, stopping use of application software, interrupting OS functionality, removing power from components and so forth.

Abstract: The present invention provides an integrated circuit VLSI temperature system for the calibration of threshold temperatures. A temperature sensitive ring oscillator (TSRO) generates a TSRO calibration parameter. A memory is employable to store the TSRO calibration parameter. A module is employable to determine a threshold TSRO oscillation frequency from the TSRO calibration parameter. A memory is employable for storing at least one threshold TSRO oscillation frequency.

Abstract: An apparatus, system and method of automatically computing power consumption estimation of a chip are provided. The apparatus, system and method include determining all circuit blocks or macros embedded in the chip and retrieving from a file, into which pre-generated power consumption values of the macros are stored, the power consumption value of each macro. After doing so, the power consumption value of the chip is automatically computed. The apparatus, system and method also compute a desired power consumption estimation of the chip as well as a plurality of power densities. A desired power consumption estimation is based on a desired voltage and a desired frequency while a power density is power used in a certain area. Further, the apparatus, system and method reproduces the floorplan of the chip and represents each area within the chip by a different color to illustrate hot spots and cool spots.

Abstract: The present invention provides for calibrating a TSRO with two tests, wherein generating a first or second calibration value does not substantially alter the temperature performed within the first or second test. The first calibration value is generated during a first test at a first temperature. The first test can be a wafer test, a module test, a burn-in test, and so on. The first calibration value is stored with an e-fuse in the integrated circuit. A second calibration value is generated during a second integrated circuit test of the integrated circuit at a second temperature. The second test can be a test that is performed at a temperature other than the first test. The second calibration value is stored with an e-fuse in the integrated circuit.

Abstract: Disclosed is an apparatus incorporating hardware based logic and a predetermined default list of software affecting responses to be taken in connection with temperatures sensed by thermal sensors checking the temperature of portions of computer logic. At the time application software is loaded, the software can modify the default response list. The list of responses to be taken and the over temperature conditions at which they are to be activated are stored in hardware directly accessible by hardware based thermal sensor monitoring logic for direct control of the hardware. The control can alter conditions such as clock frequency, stopping use of application software, interrupting OS functionality, removing power from components and so forth.

Abstract: The present invention provides an integrated circuit VLSI temperature system for the calibration of threshold temperatures. A temperature sensitive ring oscillator (TSRO) generates a TSRO calibration parameter. A memory is employable to store the TSRO calibration parameter. A module is employable to determine a threshold TSRO oscillation frequency from the TSRO calibration parameter. A memory is employable for storing at least one threshold TSRO oscillation frequency.

Abstract: The present invention provides a temperature sensitive ring oscillator (TSRO) in an integrated circuit. A temperature measuring device, such as a thermal resistor, is proximate the TSRO, which shares a substantially similar temperature. A memory is employable for storing data that is a function of the output of the TSRO and the temperature measuring device.

Abstract: An apparatus, system and method of automatically computing power consumption estimation of a chip are provided. The apparatus, system and method include determining all circuit blocks or macros embedded in the chip and retrieving from a file, into which pre-generated power consumption values of the macros are stored, the power consumption value of each macro. After doing so, the power consumption value of the chip is automatically computed. The apparatus, system and method also compute a desired power consumption estimation of the chip as well as a plurality of power densities. A desired power consumption estimation is based on a desired voltage and a desired frequency while a power density is power used in a certain area. Further, the apparatus, system and method reproduces the floorplan of the chip and represents each area within the chip by a different color to illustrate hot spots and cool spots.