Abstract: A fluid-ejection die cartridge includes a cartridge body. The fluid-ejection die cartridge includes a fluid-ejection die fluidically attached to the cartridge body. The fluid-ejection die is to eject fluid. The fluid-ejection die cartridge includes a stamped nanoceramic layer on an exposed fluid-ejection nozzle plate of the fluid-ejection die attached to the cartridge body.

Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: A fluid ejection device can include a nozzle plate incorporating a non-coplanar surface. The non-coplanar surface can include a hydrophilic region of a hydrophilic material having a water contact angle from about 50° to about 90° and a hydrophobic coating including a hydrophobic material having a water contact angle from about 91° to about 160°.

Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings. The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings. The remaining layer of the material on the surface is thus formed with a uniform thickness.

Abstract: A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.

Abstract: Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

Abstract: A fluid ejection head may include a fluid ejection face through which fluid ejection orifices extend. A coating is selectively coated over first portions of the fluid ejection face. Second portions of the fluid ejection face omit the coating.

Abstract: A fluid ejection head may include an integrated chamber-orifice layer forming an ejection chamber and an ejection orifice, a fluid actuator to eject fluid within the chamber through the ejection orifice, an orifice shield and an adhesive layer bonding the orifice shield to the integrated chamber-orifice layer.

Abstract: Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings The remaining layer of the material on the surface is thus formed with a uniform thickness.

Abstract: A fluid ejection system may include a fluid ejection head having a fluid ejection face through which fluid ejection orifices extend, a media supply to supply a medium for receiving fluid ejected through the fluid ejection orifices and a service station. The service station may include a substrate, an applicator to coat the substrate with a non-wetting layer having a controlled thickness and an actuator to move the substrate with the non-wetting layer into contact with the fluid ejection face without wiping the fluid ejection face.

Abstract: An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten ?m to two hundred ?m, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.

Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: A fluid ejection device can include a nozzle plate incorporating a non-coplanar surface. The non-coplanar surface can include a hydrophilic region of a hydrophilic material having a water contact angle from about 50° to about 90° and a hydrophobic coating including a hydrophobic material having a water contact angle from about 91° to about 160°.

Abstract: Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.