Abstract: Fluid feed paths having enhanced wettability characteristics are disclosed. An example printhead includes a nozzle to expel fluid therefrom, and a fluid feed path to fluidly couple a fluid source and the nozzle. Fluid feed path walls are composed of a first material having a first wettability characteristic and a second material having a second wettability characteristic. The second wettability characteristic differing from the first wettability characteristic. A coating is formed on at least a portion of the fluid feed path defined by the first material and the second material of the substrate. The coating to harmonize the first wettability characteristic and the second wettability characteristic.

Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract: An example system includes a flexible carrier and a printhead flow structure. The printhead flow structure includes a flex circuit including a carrier wafer and at least one printhead die electrically coupled to the flex circuit. The carrier wafer is bonded to the flexible carrier with thermal release tape, the thermal release tape to debond substantially completely from the flex circuit at a debonding temperature via bending of the flexible carrier.

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Abstract: The present disclosure includes a flexible carrier along with a system and a method including the flexible carrier.

Abstract: In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

Abstract: An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.

Abstract: In one embodiment, a display element includes a first electrode; a dielectric layer having recessed regions therein over the first electrode; a second electrode disposed on the dielectric layer; and a fluid with colorant particles within the display element, wherein a voltage signal applied to the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a first optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a second optical state by spreading the colorant particles in the fluid.

Abstract: An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.

Abstract: One embodiment is an electronic display that includes plural reservoirs, two spaced electrodes, and a plural colorant disposed between the two spaced electrodes. Colorants in the plural colorant move between the two spaced electrodes and into the plural reservoirs when subject to an electric field.

Abstract: In one embodiment, a display element includes a first electrode; a dielectric layer having recessed regions therein over the first electrode; a second electrode disposed on the dielectric layer; and a fluid with colorant particles within the display element, wherein a voltage signal applied to the first electrode and the second electrode controls movement of the colorant particles such that a first voltage signal provides a first optical state by compacting the colorant particles into the recessed regions and a second voltage signal provides a second optical state by spreading the colorant particles in the fluid.

Abstract: Electro-optical display systems are disclosed. An electro-optical display system may include a plurality of electrodes; a display volume containing a fluid having a plurality of colorant particles; a layer adjacent to or part of at least one electrode of the plurality of electrodes and configured to at least one of (i) reflect at least one wavelength of light and (ii) absorb at least one wavelength of light; and recessed regions configured to contain the plurality of colorant particles, wherein the plurality of electrodes are configured to selectively move the plurality of colorant particles between a compacted position in which all or nearly all of the plurality of colorant particles are in the recessed regions, and a spread position in which the plurality of colorant particles are spread across the display volume.

Abstract: Electro-optical display systems are disclosed. An electro-optical display system may include a plurality of electrodes; a display volume containing a fluid having a plurality of colorant particles; a layer adjacent to or part of at least one electrode of the plurality of electrodes and configured to at least one of (i) reflect at least one wavelength of light and (ii) absorb at least one wavelength of light; and recessed regions configured to contain the plurality of colorant particles, wherein the plurality of electrodes are configured to selectively move the plurality of colorant particles between a compacted position in which all or nearly all of the plurality of colorant particles are in the recessed regions, and a spread position in which the plurality of colorant particles are spread across the display volume.

Abstract: An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

Abstract: An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

Abstract: A poly-p-xylylene coating has been found to demonstrate superior properties as a thermal ink-jet adhesive material in combination with resistor assemblies employed in thermal ink-jet printheads. This material evidences better adhesion for securing the orifice plate to the barrier material used to form the ink firing chambers within the printhead and superior corrosion resistance to thermal ink-jet inks, compared to other coating materials.