Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Abstract: A sintering material having metallic structural particles which are provided with an organic coating. Non-organically coated, metallic and/or ceramic auxiliary particles are provided that do not outgas during the sintering process. A sintered bond, as well as a method for producing a sintered bond.

Abstract: An electrical or electronic composite component is described as having a first joining partner and at least one second joining partner. According to the present system, it is provided that a sintered compact having open porosity is accommodated between the first and the second joining partner, the sintered compact is connected fixedly to the first and to the second joining partner.

Abstract: The invention relates to a hand grenade (1) with an active body (3) containing an active charge (2), and with an ignition device (4) that acts on a detonator (12) to ignite the active charge (2). In order to achieve this feature, after the hand grenade (1) has been thrown the ignition can be triggered without delay if the tactical situation requires it, and no danger arises for the shooter if the hand grenade (1) with the safety device released is dropped accidentally. The invention pertains to an electronic ignition system composed of an ignition trigger (6) and a fuze (8) used as the ignition device (4), whereby the ignition trigger (6) remains with the shooter when the hand grenade (1) is thrown and the hand grenade (1) can be ignited by wireless only when the shooter activates an ignition trigger element (11) of the ignition trigger (6).

Abstract: An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

Abstract: A multicolour LED, in which layers for generating light of different colours are arranged one above the other, is used as the light source in a projector.

Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

Abstract: Embodiments of an X-ray source for a mobile X-ray diagnostic unit with a C-arm include a generator vessel that may be mounted to a hollow frame of the C-arm. The generator vessel may have a first subregion with a high-voltage generator and a second subregion with an X-ray source. In some embodiments, the first subregion, the second subregion, or both subregions may be at least partially inside a portion of the hollow frame of the C-arm. The generator vessel may be at least partially filled with insulating oil for cooling the high-voltage generator and/or the X-ray source.

Abstract: In a luminescence diode chip having a radiation exit area (1) and a contact structure (2, 3, 4) which is arranged on the radiation exit area (1) and comprises a bonding pad (4) and a plurality of contact webs (2, 3) which are provided for current expansion and are electrically conductively connected to the bonding pad (4), the bonding pad (4) is arranged in an edge region of the radiation exit area (1). The luminescence diode chip has reduced absorption of the emitted radiation (23) in the contact structure (2, 3, 4).

Abstract: A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.

Abstract: An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.

Abstract: The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

Abstract: The invention discloses a method for manufacturing an organic electro-luminescent display device, the method comprising the steps of: providing a light-permeable substrate; arranging a plurality of transparent electrodes in a stripe-like manner on the light-permeable substrate, the transparent electrodes being made of a light-permeable conductive film; forming at least one organic layer on the subassembly, the at least one organic layer being made of an organic electro-luminescent medium so that the at least one organic layer covers the electrodes; forming a conductive film all over the at least one organic layer; and removing at least one portion of the conductive film so as to create stripe-like electrodes being electrical isolated to each other and extending in a direction perpendicular to the transparent electrodes using a radiation method.

Abstract: Embodiments of an X-ray source for a mobile X-ray diagnostic unit with a C-arm include a generator vessel that may be mounted to a hollow frame of the C-arm. The generator vessel may have a first subregion with a high-voltage generator and a second subregion with an X-ray source. In some embodiments, the first subregion, the second subregion, or both subregions may be at least partially inside a portion of the hollow frame of the C-arm. The generator vessel may be at least partially filled with insulating oil for cooling the high-voltage generator and/or the X-ray source.

Abstract: Disclosed is a light-emitting diode chip comprising a semiconductor layer sequence suitable for emitting primary electromagnetic radiation and further comprising a converter layer that is applied to at least one main face of the semiconductor layer sequence and comprises at least one phosphor suitable for converting a portion of the primary radiation into secondary radiation, at least a portion of the secondary radiation and at least a portion of the unconverted primary radiation overlapping to form a mixed radiation with a resulting color space. The converter layer is purposefully structured to adjust a dependence of the resulting color space on viewing angle. Also disclosed is a method of making a light-emitting diode chip in which a converter layer is purposefully structured.

Abstract: A method for encapsulating at least one organic light-emitting (OLED) device is disclosed. The method includes the step of forming a concave region on a plate by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate including at least one active region such that the concave region of the plate spans over the active region.

Abstract: An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.

Abstract: An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

Abstract: An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.

Abstract: The invention concerns an LED arrangement with at least one LED chip (11) comprising a radiation decoupling surface (12) through which the bulk of the electromagnetic radiation generated in the LED chip (11) is decoupled. Arranged on the radiation decoupling surface (12) is at least one phosphor layer (13) for converting the electromagnetic radiation generated in the LED chip. A housing (17) envelops portions of the LED chip (11) and the phosphor layer (13).