Abstract: A method for providing (Al,Ga,In)N thin films on Ga-face c-plane (Al,Ga,In)N substrates using c-plane surfaces with a miscut greater than at least 0.35 degrees toward the m-direction. Light emitting devices are formed on the smooth (Al,Ga,In)N thin films. Devices fabricated on the smooth surfaces exhibit improved performance.

Abstract: A light emitting diode, comprising a substrate, a buffer layer on the substrate, an active layer on the buffer layer and between an n-type layer and a p-type layer, a tunnel junction adjacent the p-type layer, and n-type contacts to the tunnel junction and the n-type layer, wherein the buffer layer, n-type layer, p-type layer, active region and tunnel junction comprise III-nitride material grown in a nitrogen-face (N-face) orientation. The substrate surface upon which the III-nitride material is deposited is patterned to provide embedded backside roughening. A top surface of the tunnel junction, which also the top surface of the III-nitride material, is roughened.

Abstract: A method for electrically connecting semiconductor layers using a layer less than 150 nm thick of a semiconductor material that exhibits strong piezoelectric and/or spontaneous electrical polarization to provide a tunnel junction that electrically connects the semiconductor layers. The semiconductor material that exhibits strong piezoelectric and/or spontaneous electrical polarization comprises an interface between differing (Al,In,Ga)N alloys. The tunnel junction may be between p-type and n-type semiconductor layers, or it may be between two n-type or p-type semiconductor layers. Stacked Schottky diodes or stacked photo-active junctions may be fabricated using this method.