Patents by Inventor Michael H. Bunyan

Michael H. Bunyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9635790
    Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 25, 2017
    Assignee: Parker-Hannifin Corporation
    Inventors: Stephen J. Coppola, Michael H. Bunyan, George R. Watchko
  • Publication number: 20150382479
    Abstract: A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically-conductive adhesive composition is disclosed. The adhesive composition is fluent and form-stable, and comprises a silicone adhesive, a compatible silane and electrically-conductive particles or fibers. The adhesive is conveniently pre-applied to the thermoplastic sheet and shipped to the customer for attachment to the integrated circuit board.
    Type: Application
    Filed: March 13, 2014
    Publication date: December 31, 2015
    Applicant: Parker-Hannifin Corporation("Parker")
    Inventors: Michael H. BUNYAN, Peter Z. TOROK, George R. WATCHKO, Jeffrey CZARNECKI
  • Patent number: 8923961
    Abstract: A contact electrode assembly for delivering at least one therapeutic agent into ocular tissue of a subject includes a flexible dielectric layer, a first electrode portion, and a second electrode portion. The flexible dielectric includes oppositely disposed first and second surfaces. The first electrode portion is disposed on the first surface of the dielectric layer. The second electrode portion is disposed on a portion of the second surface of the dielectric layer. The second electrode portion includes an interdigitated electrode having a first comb-shaped portion defining a first plurality of fingers and a second comb-shaped portion defining a second plurality of fingers. Each of the first electrode portion, the first comb-shaped portion, and the second comb-shaped portion is electrically connectable to a signal source.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: December 30, 2014
    Assignee: The Cleveland Clinic Foundation
    Inventors: Rishi P. Singh, William G. Lionetta, Marc E. Larosee, George R. Watchko, John Wrisley, Steven L. Thornton, Lawrence R. Moschini, David P. Hill, Michael H. Bunyan, Chi Hang Wu
  • Publication number: 20140360772
    Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.
    Type: Application
    Filed: March 12, 2013
    Publication date: December 11, 2014
    Applicant: Parker-Hannifin Corporation
    Inventors: Stephen J. Coppola, Michael H. Bunyan, George R. Watchko
  • Patent number: 8766108
    Abstract: A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: July 1, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Patent number: 8759692
    Abstract: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: June 24, 2014
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Patent number: 8633402
    Abstract: An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: January 21, 2014
    Assignee: Parker Hannifin Corporation
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Publication number: 20130092410
    Abstract: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.
    Type: Application
    Filed: December 7, 2012
    Publication date: April 18, 2013
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Publication number: 20130068519
    Abstract: An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.
    Type: Application
    Filed: May 10, 2011
    Publication date: March 21, 2013
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Publication number: 20120133072
    Abstract: Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An amount of the compound is dispensed from a nozzle, screen, stencil, or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
    Type: Application
    Filed: August 10, 2010
    Publication date: May 31, 2012
    Applicant: PARKER-HANNIFIN CORPORATION
    Inventors: Michael H. Bunyan, Victoria Santa Fe, Jonathan Bergin
  • Publication number: 20120048612
    Abstract: A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.
    Type: Application
    Filed: May 9, 2011
    Publication date: March 1, 2012
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Patent number: 8119191
    Abstract: The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: February 21, 2012
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, Phillip Blazdell
  • Publication number: 20110308781
    Abstract: A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board.
    Type: Application
    Filed: September 24, 2009
    Publication date: December 22, 2011
    Applicant: PARKER HANNIFIN CORPORATION
    Inventors: Eoin O'Riordan, Philip Blazdell, Gary Wood, Michael H. Bunyan, Harish Rutti
  • Publication number: 20110275981
    Abstract: A contact electrode assembly for delivering at least one therapeutic agent into ocular tissue of a subject includes a flexible dielectric layer, a first electrode portion, and a second electrode portion. The flexible dielectric includes oppositely disposed first and second surfaces. The first electrode portion is disposed on the first surface of the dielectric layer. The second electrode portion is disposed on a portion of the second surface of the dielectric layer. The second electrode portion includes an interdigitated electrode having a first comb-shaped portion defining a first plurality of fingers and a second comb-shaped portion defining a second plurality of fingers. Each of the first electrode portion, the first comb-shaped portion, and the second comb-shaped portion is electrically connectable to a signal source.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 10, 2011
    Inventors: RISHI P. SINGH, WILLIAM G. LIONETTA, MARC E. LAROSEE, GEORGE R. WATCHKO, JOHN WRISLEY, STEVEN L. THORNTON, LAWRENCE R. MOSCHINI, DAVID P. HILL, MICHAEL H. BUNYAN, CHI HANG WU
  • Publication number: 20110162879
    Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion. The interior portion of the layer is compressed through the thickness dimension thereof to form a top wall portion of the shield, with the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment.
    Type: Application
    Filed: September 18, 2009
    Publication date: July 7, 2011
    Applicant: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
  • Patent number: 7897264
    Abstract: A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: March 1, 2011
    Assignee: Parker-Hannifin Corporation
    Inventor: Michael H. Bunyan
  • Patent number: 7682690
    Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: March 23, 2010
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, Kent M. Young
  • Publication number: 20080012103
    Abstract: A thermally conductive gap filling material for the absorption of electromagnetic (EM) radiation emitted from an electronic device is provided. The gap filling material facilitates conduction of excessive heat generated by the electronic device to a heat dissipater. The heat dissipater further dissipates the excessive heat to the surrounding environment. The gap filling material comprises a binder material and magnetic filler. The magnetic filler is dispersed in binder material. The magnetic filler absorbs EM radiation and causes the gap filling material to be thermally conductive.
    Type: Application
    Filed: July 13, 2007
    Publication date: January 17, 2008
    Inventors: Robert H. Foster, Michael H. Bunyan
  • Publication number: 20070230131
    Abstract: The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component.
    Type: Application
    Filed: March 28, 2007
    Publication date: October 4, 2007
    Inventors: Michael H. Bunyan, Phillip Blazdell
  • Patent number: RE41576
    Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: August 24, 2010
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, Miksa deSorgo