Patents by Inventor Michael H. Bunyan
Michael H. Bunyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9635790Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.Type: GrantFiled: March 12, 2013Date of Patent: April 25, 2017Assignee: Parker-Hannifin CorporationInventors: Stephen J. Coppola, Michael H. Bunyan, George R. Watchko
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Publication number: 20150382479Abstract: A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically-conductive adhesive composition is disclosed. The adhesive composition is fluent and form-stable, and comprises a silicone adhesive, a compatible silane and electrically-conductive particles or fibers. The adhesive is conveniently pre-applied to the thermoplastic sheet and shipped to the customer for attachment to the integrated circuit board.Type: ApplicationFiled: March 13, 2014Publication date: December 31, 2015Applicant: Parker-Hannifin Corporation("Parker")Inventors: Michael H. BUNYAN, Peter Z. TOROK, George R. WATCHKO, Jeffrey CZARNECKI
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Patent number: 8923961Abstract: A contact electrode assembly for delivering at least one therapeutic agent into ocular tissue of a subject includes a flexible dielectric layer, a first electrode portion, and a second electrode portion. The flexible dielectric includes oppositely disposed first and second surfaces. The first electrode portion is disposed on the first surface of the dielectric layer. The second electrode portion is disposed on a portion of the second surface of the dielectric layer. The second electrode portion includes an interdigitated electrode having a first comb-shaped portion defining a first plurality of fingers and a second comb-shaped portion defining a second plurality of fingers. Each of the first electrode portion, the first comb-shaped portion, and the second comb-shaped portion is electrically connectable to a signal source.Type: GrantFiled: May 13, 2011Date of Patent: December 30, 2014Assignee: The Cleveland Clinic FoundationInventors: Rishi P. Singh, William G. Lionetta, Marc E. Larosee, George R. Watchko, John Wrisley, Steven L. Thornton, Lawrence R. Moschini, David P. Hill, Michael H. Bunyan, Chi Hang Wu
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Publication number: 20140360772Abstract: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched sealing element extending above and below the gasket assembly for contacting the adjacent surfaces. The branched sealing element is deformable and can be used on external aircraft electronic components.Type: ApplicationFiled: March 12, 2013Publication date: December 11, 2014Applicant: Parker-Hannifin CorporationInventors: Stephen J. Coppola, Michael H. Bunyan, George R. Watchko
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Patent number: 8766108Abstract: A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.Type: GrantFiled: May 9, 2011Date of Patent: July 1, 2014Assignee: Parker Hannifin CorporationInventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Patent number: 8759692Abstract: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.Type: GrantFiled: December 7, 2012Date of Patent: June 24, 2014Assignee: Parker-Hannifin CorporationInventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Patent number: 8633402Abstract: An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.Type: GrantFiled: May 10, 2011Date of Patent: January 21, 2014Assignee: Parker Hannifin CorporationInventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Publication number: 20130092410Abstract: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, protection against lightning strikes and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.Type: ApplicationFiled: December 7, 2012Publication date: April 18, 2013Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Publication number: 20130068519Abstract: An EMI shielding gasket having enhanced corrosion protection and force deflection is provided. The gasket has a body formed from an electrically conductive material with outwardly extending projections from one or both surface portions thereof. A non-conductive polymer gel is applied to the spaces between the projections for protection against corrosion. The gasket is particularly adapted for use in external aluminum aircraft surfaces which are exposed to harsh environmental conditions.Type: ApplicationFiled: May 10, 2011Publication date: March 21, 2013Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Publication number: 20120133072Abstract: Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An amount of the compound is dispensed from a nozzle, screen, stencil, or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.Type: ApplicationFiled: August 10, 2010Publication date: May 31, 2012Applicant: PARKER-HANNIFIN CORPORATIONInventors: Michael H. Bunyan, Victoria Santa Fe, Jonathan Bergin
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Publication number: 20120048612Abstract: A composite gasket for sealing and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance, and a higher EMI shielding capability. A second elastomer can be used around the edge portions of the gasket for improved abrasion resistance and increased tensile strength. A fiberglass sheet can be incorporated in the mesh for added reinforcement and support. The gaskets of the invention can be used on external aircraft components, such as external aircraft antenna mounts.Type: ApplicationFiled: May 9, 2011Publication date: March 1, 2012Inventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Patent number: 8119191Abstract: The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component.Type: GrantFiled: March 28, 2007Date of Patent: February 21, 2012Assignee: Parker-Hannifin CorporationInventors: Michael H. Bunyan, Phillip Blazdell
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Publication number: 20110308781Abstract: A conformable, thermally-conductive gel pack is provided having a thermal gel encapsulated by a compliant packaging material formed from a dielectric polymer. The gel pack is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board.Type: ApplicationFiled: September 24, 2009Publication date: December 22, 2011Applicant: PARKER HANNIFIN CORPORATIONInventors: Eoin O'Riordan, Philip Blazdell, Gary Wood, Michael H. Bunyan, Harish Rutti
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Publication number: 20110275981Abstract: A contact electrode assembly for delivering at least one therapeutic agent into ocular tissue of a subject includes a flexible dielectric layer, a first electrode portion, and a second electrode portion. The flexible dielectric includes oppositely disposed first and second surfaces. The first electrode portion is disposed on the first surface of the dielectric layer. The second electrode portion is disposed on a portion of the second surface of the dielectric layer. The second electrode portion includes an interdigitated electrode having a first comb-shaped portion defining a first plurality of fingers and a second comb-shaped portion defining a second plurality of fingers. Each of the first electrode portion, the first comb-shaped portion, and the second comb-shaped portion is electrically connectable to a signal source.Type: ApplicationFiled: May 13, 2011Publication date: November 10, 2011Inventors: RISHI P. SINGH, WILLIAM G. LIONETTA, MARC E. LAROSEE, GEORGE R. WATCHKO, JOHN WRISLEY, STEVEN L. THORNTON, LAWRENCE R. MOSCHINI, DAVID P. HILL, MICHAEL H. BUNYAN, CHI HANG WU
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Publication number: 20110162879Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a resilient layer of a thermoformable, electrically-conductive foam, the layer having first surface and a second surface defining a thickness dimension therebetween, and the layer having an interior portion surrounded by a perimeter portion. The interior portion of the layer is compressed through the thickness dimension thereof to form a top wall portion of the shield, with the thickness dimension of the perimeter portion extending downwardly from the top wall portion to form a side wall portion of the shield which together with the top wall portion defines at least a portion of the compartment.Type: ApplicationFiled: September 18, 2009Publication date: July 7, 2011Applicant: Parker-Hannifin CorporationInventors: Michael H. Bunyan, George R. Watchko, William G. Lionetta
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Patent number: 7897264Abstract: A reactive foil assembly for the packaging and presenting of a reactive foil. The reactive foil assembly comprising a reactive foil, a film, a flex circuit and an adhesive. The reactive foil is placed above the film such that a portion of the reactive foil does not overlap with the film. The flex circuit is also placed above the film such that the flex circuit is operably coupled to the reactive foil. The reactive foil assembly is placed over a surface such that the film adheres to the surface with the help of the adhesive. The reactive foil is ignited by an energy pulse provided by the power source and delivered by the flex circuit coupled to the power source. An exothermic reaction of the reactive foil is initiated, which provides a molten foil available for joining of two objects.Type: GrantFiled: March 23, 2007Date of Patent: March 1, 2011Assignee: Parker-Hannifin CorporationInventor: Michael H. Bunyan
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Patent number: 7682690Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.Type: GrantFiled: October 21, 2002Date of Patent: March 23, 2010Assignee: Parker-Hannifin CorporationInventors: Michael H. Bunyan, Kent M. Young
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Publication number: 20080012103Abstract: A thermally conductive gap filling material for the absorption of electromagnetic (EM) radiation emitted from an electronic device is provided. The gap filling material facilitates conduction of excessive heat generated by the electronic device to a heat dissipater. The heat dissipater further dissipates the excessive heat to the surrounding environment. The gap filling material comprises a binder material and magnetic filler. The magnetic filler is dispersed in binder material. The magnetic filler absorbs EM radiation and causes the gap filling material to be thermally conductive.Type: ApplicationFiled: July 13, 2007Publication date: January 17, 2008Inventors: Robert H. Foster, Michael H. Bunyan
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Publication number: 20070230131Abstract: The present invention discloses methods, materials and devices for facilitating electromagnetic/radiofrequency interference (EMI/RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and/or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and/or electrically conductive (or thermally conductive and/or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or/and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component.Type: ApplicationFiled: March 28, 2007Publication date: October 4, 2007Inventors: Michael H. Bunyan, Phillip Blazdell
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Patent number: RE41576Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.Type: GrantFiled: November 16, 2000Date of Patent: August 24, 2010Assignee: Parker-Hannifin CorporationInventors: Michael H. Bunyan, Miksa deSorgo