Patents by Inventor Michael H. Bunyan

Michael H. Bunyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7208192
    Abstract: Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: April 24, 2007
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, Miksa de Sorgo
  • Patent number: 7147041
    Abstract: A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. The body portion is joined to the second surface of the base portion and is formed of a stack of corrugated sheets of one or more metal foils arranged to form a cellular, honeycomb-like structure.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: December 12, 2006
    Assignee: Parker-Hannifin Corporation
    Inventors: Jonathan E. Mitchell, Michael H. Bunyan
  • Patent number: 7141155
    Abstract: A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: November 28, 2006
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, Thomas A. Clement, John J. Hannafin, Marc E. LaRosee, Kent M. Young
  • Patent number: 6956739
    Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: October 18, 2005
    Assignee: Parker-Hannifin Corporation
    Inventor: Michael H. Bunyan
  • Patent number: 6946190
    Abstract: A thermally-conductive compound for forming a layer which is conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The compound is an admixture of a thermal grease component and a dispersed constituent forming discrete domains within the grease component, the domains being form-stable at normal room temperature in a first phase and conformable between the first and second heat transfer surface in a second phase, and the domains having a domain transition temperature above normal room temperature from the first phase to the second phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: September 20, 2005
    Assignee: Parker-Hannifin Corporation
    Inventor: Michael H. Bunyan
  • Patent number: 6835453
    Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: December 28, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: Alfred W. Greenwood, Michael H. Bunyan, Kent M. Young, Deanna J. Wright
  • Publication number: 20040159558
    Abstract: A polishing pad or other shaped article for the electrochemical mechanical polishing (ECMP) of a workpiece. The article includes an electrically-conductive compound which is formed into a layer. The compound is formulated as an admixture which includes a polymeric component forming a continuous phase in the layer, and an electrically-conductive filler component forming a discrete phase within the continuous phase. With the workpiece and the layer being electrically connected and with an electrical bias being applied between the workpiece and the layer, the bias being capable of activating an electrochemical reaction, the compound exhibits an overpotential for the activation of the reaction greater than the bias.
    Type: Application
    Filed: January 21, 2004
    Publication date: August 19, 2004
    Inventors: Michael H. Bunyan, Thomas A. Clement, John J. Hannafin, Marc E. LaRosee, Kent M. Young
  • Patent number: 6777095
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: August 17, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, William I. Flanders
  • Publication number: 20040142616
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Application
    Filed: January 7, 2004
    Publication date: July 22, 2004
    Inventors: Michael H. Bunyan, William I. Flanders
  • Publication number: 20040081843
    Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a liquid resin constituent; and (b) a particulate filler constituent. The liquid resin constituent may be an ethylene-propylene copolymer (EPM) or a terpolymer (EPDM) of ethylene and propylene and a diene which may be ethylidene norbornene (ENB) or dicyclopentadiene (DCPD).
    Type: Application
    Filed: May 7, 2003
    Publication date: April 29, 2004
    Inventor: Michael H. Bunyan
  • Patent number: 6716536
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: April 6, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, William I. Flanders
  • Publication number: 20030222249
    Abstract: Application of a thermally and/or electrically conductive compound to fill a thermal and/or EMI shielding gap between a first and a second surface. A supply of a fluent, form-stable compound is provided as an admixture of a cured polymer gel component, and a particulate filler component. An of the compound is dispensed from a nozzle or other orifice under an applied pressure onto one of the surfaces which, when opposed, form the gap, or into the gap formed between the surfaces. The gap is at least partially filled by at least a portion of the dispensed compound.
    Type: Application
    Filed: January 16, 2003
    Publication date: December 4, 2003
    Inventors: Michael H. Bunyan, Miksa de Sorgo
  • Publication number: 20030207064
    Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
    Type: Application
    Filed: April 16, 2003
    Publication date: November 6, 2003
    Inventors: Michael H. Bunyan, Miksa de Sorgo
  • Patent number: 6635354
    Abstract: A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: October 21, 2003
    Assignee: Parker-Hannifin Corporation
    Inventors: Michael H. Bunyan, John P. Kalinoski
  • Publication number: 20030152764
    Abstract: A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween. The interface includes a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface. The compound is an admixture of: (a) a polymeric constituent forming a continuous matrix in the layer; and (b) a dispersed constituent forming discrete domains within the matrix, the domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and the domains having a domain transition temperature above normal room temperature from the first domain phase to the second domain phase. The dispersed constituent may be a fusible, i.e., low temperature melting, metal or metal alloy.
    Type: Application
    Filed: October 21, 2002
    Publication date: August 14, 2003
    Inventors: Michael H. Bunyan, Kent M. Young
  • Publication number: 20030124934
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Application
    Filed: December 11, 2002
    Publication date: July 3, 2003
    Inventors: Michael H. Bunyan, William I. Flanders
  • Patent number: 6521348
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: February 18, 2003
    Assignee: Parker-Hannifin Corp.
    Inventors: Michael H. Bunyan, William I. Flanders
  • Publication number: 20020135984
    Abstract: A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
    Type: Application
    Filed: January 14, 2002
    Publication date: September 26, 2002
    Inventors: Alfred W. Greenwood, Michael H. Bunyan, Kent M. Young, Deanna J. Wright
  • Publication number: 20020125026
    Abstract: A flame retardant, electromagnetic interference (EMI) shielding gasket construction. The construction includes a resilient core member formed of a foamed elastomeric material, an electrically-conductive fabric member surrounding the outer surface of the core member, and a flame retardant layer coating at least a portion of the interior surface of the fabric member. The flame retardant layer is effective to afford the gasket construction with a flame class rating of V-0 under Underwriter's Laboratories (UL) Standard No. 94.
    Type: Application
    Filed: May 9, 2002
    Publication date: September 12, 2002
    Inventors: Michael H. Bunyan, William I. Flanders
  • Patent number: 6432497
    Abstract: A thermally conductive interface, which may be in the form of a double-sided, pressure sensitive adhesive tape, disposable intermediate a heat-generating source having a first heat transfer surface formed of a first material having a low surface energy, and a thermal dissipation member having a second heat transfer surface which is formed of a second material having a surface energy substantially higher than the surface energy of the first material, and which is disposable opposite the first heat transfer surface of the heat-generating source in a spaced-apart, heat transfer adjacency therewith. The interface includes a first pressure sensitive adhesive (PSA) surface which is bondable under pressure to at least a portion of the first heat transfer surface of the heat-generating source, and an opposing second pressure sensitive adhesive (PSA) surface bondable under pressure to at least a portion of the second heat transfer surface of the heat-generating source.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: August 13, 2002
    Assignee: Parker-Hannifin Corporation
    Inventor: Michael H. Bunyan