Patents by Inventor Michael Hodge

Michael Hodge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12607252
    Abstract: A limited slip differential for a vehicle includes a differential gear case, and first and second side gears supported by the differential gear case. The first and second side gears are engaged with each other along an interface, and the interface a non-flat profile, such as a conical or frustoconical profile. Depending on the angle of the conical or frustoconical profile, a torque bias ratio (TBR) of the limited slip differential can be adjusted.
    Type: Grant
    Filed: March 27, 2025
    Date of Patent: April 21, 2026
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventor: Michael Hodge
  • Patent number: 12571436
    Abstract: A differential disconnect system includes an outer differential housing, an inner differential housing, a clutch plate arranged axially adjacent to the inner differential housing, a clutch spring, and an electromagnet. The outer differential housing has a first plurality of radial notches, the inner differential housing has a first plurality of axial teeth, and the clutch plate has a first plurality of radial tabs engaged with the first plurality of radial notches and a second plurality of axial teeth arranged to selectively engage the first plurality of axial teeth. The clutch spring is arranged to urge the clutch plate towards the inner differential housing to engage the second plurality of axial teeth with the first plurality of axial teeth. The clutch plate is urged away from the inner differential housing to disengage the second plurality of axial teeth from the first plurality of axial teeth when the electromagnet is energized.
    Type: Grant
    Filed: February 5, 2025
    Date of Patent: March 10, 2026
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge, Carsten Behler
  • Publication number: 20260022741
    Abstract: A differential disconnect system includes an outer differential housing, an inner differential housing, a clutch plate arranged axially adjacent to the inner differential housing, a clutch spring, and an electromagnet. The outer differential housing has a first plurality of radial notches, the inner differential housing has a first plurality of axial teeth, and the clutch plate has a first plurality of radial tabs engaged with the first plurality of radial notches and a second plurality of axial teeth arranged to selectively engage the first plurality of axial teeth. The clutch spring is arranged to urge the clutch plate towards the inner differential housing to engage the second plurality of axial teeth with the first plurality of axial teeth. The clutch plate is urged away from the inner differential housing to disengage the second plurality of axial teeth from the first plurality of axial teeth when the electromagnet is energized.
    Type: Application
    Filed: February 5, 2025
    Publication date: January 22, 2026
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge, Carsten Behler
  • Publication number: 20260023115
    Abstract: An electronic assembly has a host wafer having a first circuit including wafer transistors and passive, non-transistor devices. Chiplets have a second circuit including at least one radio frequency (RF) transistor device. Electrical interconnects are between the chiplets and wafer. The electrical interconnects electrically connect the first circuit to the second circuits. Oscillators that have the wafer transistor, the RF transistor and the electrical interconnects produce a signal for built-in self-test circuits for testing an assembly design of the electronic assembly and speeds of the RF chiplet transistors.
    Type: Application
    Filed: February 6, 2024
    Publication date: January 22, 2026
    Inventors: James Buckwalter, Florian Herrault, Justin Kim, Michael Hodge, Daniel Green
  • Publication number: 20250391824
    Abstract: An electronic assembly heterogeneously integrates radio-frequency (RF) transistor chiplets into a host wafer, and the chiplets have interconnections to host wafer circuits. The assembly has at least one RF transistor chiplet having a chiplet circuit including a high-electron-mobility transistor (HEMT) or a heterojunction bipolar transistor (HBT). The host wafer has at least one host wafer circuit for the purpose of producing bias conditions that optimize performance of the HEMT or HBT. The host wafer circuit includes first circuitry to provide a DC bias of the HEMT or HBT; or second circuitry configured to sense radio-frequency operating conditions of the HEMT or HBT. The electrical interconnects are between the chiplet and the wafer, and electrically connect the host wafer circuit to the chiplet circuit.
    Type: Application
    Filed: January 6, 2025
    Publication date: December 25, 2025
    Inventors: James F. Buckwalter, Florian Herrault, Justin Kim, Michael Hodge, Daniel S. Green
  • Publication number: 20250391826
    Abstract: An electronic assembly heterogeneously integrates radio-frequency (RF) transistor chiplets into a wafer, and the chiplets have interconnections to wafer circuits. The assembly has at least one RF transistor chiplet having a chiplet circuit including a high-electron-mobility transistor (HEMT) or a heterojunction bipolar transistor (HBT). The wafer has at least one wafer circuit for the purpose of producing bias conditions that optimize performance of the HEMT or HBT. The wafer circuit includes first circuitry to provide a DC bias of the HEMT or HBT; or second circuitry configured to sense radio-frequency operating conditions of the HEMT or HBT. The electrical interconnects are between the chiplet and the wafer, and electrically connect the wafer circuit to the chiplet circuit.
    Type: Application
    Filed: June 17, 2025
    Publication date: December 25, 2025
    Inventors: James F. Buckwalter, Florian Herrault, Justin Kim, Michael Hodge, Daniel S. Green
  • Patent number: 12486875
    Abstract: An electromagnetic switchable clutch includes a dog clutch, a one-way clutch and a coil assembly. The dog clutch includes a dog clutch hub with a first outer spline and first pockets, a dog clutch disc with a second outer spline and a dog clutch sleeve with an inner spline, complementary to the first outer spline and the second outer spline. The inner spline is drivingly engaged with the first outer spline and axially displaceable to engage the second outer spline. The one-way clutch includes a cam ring and pawls. The cam ring includes second pockets. The pawls are disposed the first pockets or the second pockets and arranged to engage the other of the first pockets or the second pockets to rotationally lock the cam ring to the dog clutch hub in a single rotational direction. The coil assembly is arranged to axially displace the dog clutch sleeve.
    Type: Grant
    Filed: February 27, 2024
    Date of Patent: December 2, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Peter Burke, Michael Hodge, Brian Lee
  • Patent number: 12422032
    Abstract: An electronic differential disconnect clutch includes a differential unit, a first flange, a hub, a second flange, a hub sleeve and a solenoid. The differential unit has a pair of splines arranged for receiving a pair of axle shafts. The first flange has a first face spline and is fixed to the differential unit. The hub is rotatable relative to the differential unit and arranged to receive an input torque. The second flange is rotationally fixed and axially displaceable on the hub and has a second face spline arranged for engaging the first face spline. The hub sleeve is arranged to axially displace the second flange to engage the second face spline with the first face spline. The solenoid is arranged to axially displace the hub sleeve.
    Type: Grant
    Filed: February 22, 2024
    Date of Patent: September 23, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge
  • Publication number: 20250285997
    Abstract: An electronic assembly has a wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.
    Type: Application
    Filed: May 27, 2025
    Publication date: September 11, 2025
    Inventors: James BUCKWALTER, Michael HODGE, Justin KIM, Florian HERRAULT, Daniel GREEN
  • Patent number: 12337615
    Abstract: An axle shaft disconnect clutch includes a housing, an axle shaft, a stub shaft, a dog clutch and an inner race. The axle shaft includes a first outer spline and the stub shaft includes a second outer spline. The dog clutch has an inner spline engaged with the second outer spline and the inner race is rotationally fixed and axially displaceable relative to the housing to axially displace the dog clutch and engage or disengage the inner spline with the first outer spline. In some example embodiments, the axle shaft disconnect clutch has a bushing pad fixed to the inner race. The inner race is arranged to push the dog clutch towards the first outer spline to engage the dog clutch, and the inner race is arranged to pull the bushing pad to pull the dog clutch away from the first outer spline to disengage the dog clutch.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: June 24, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge
  • Patent number: 12320413
    Abstract: A differential includes a housing rotatable about a center axis of the differential.
    Type: Grant
    Filed: March 15, 2024
    Date of Patent: June 3, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Kenneth Hunt, Michael Hodge, Matthew Fowler, Greg Copeland
  • Patent number: 12322714
    Abstract: An electronic assembly has a host wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.
    Type: Grant
    Filed: October 20, 2023
    Date of Patent: June 3, 2025
    Assignee: PseudolithIC, Inc.
    Inventors: James Buckwalter, Michael Hodge, Justin Kim, Florian Herrault, Daniel Green
  • Publication number: 20250060012
    Abstract: An electromagnetic switchable clutch includes a dog clutch, a one-way clutch and a coil assembly. The dog clutch includes a dog clutch hub with a first outer spline and first pockets, a dog clutch disc with a second outer spline and a dog clutch sleeve with an inner spline, complementary to the first outer spline and the second outer spline. The inner spline is drivingly engaged with the first outer spline and axially displaceable to engage the second outer spline. The one-way clutch includes a cam ring and pawls. The cam ring includes second pockets. The pawls are disposed the first pockets or the second pockets and arranged to engage the other of the first pockets or the second pockets to rotationally lock the cam ring to the dog clutch hub in a single rotational direction. The coil assembly is arranged to axially displace the dog clutch sleeve.
    Type: Application
    Filed: February 27, 2024
    Publication date: February 20, 2025
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Peter Burke, Michael Hodge, Brian Lee
  • Patent number: 12196301
    Abstract: A housing half for a stamped steel differential housing including an outer annular ring and a radially outer cylindrical protrusion with a gear portion. The housing half is integrally formed from a single piece of material. In an example embodiment, the housing half is formed by stamping. In an example embodiment, the gear portion is formed by broaching or rolling. In some example embodiments, the housing half also includes a first pocket arranged for receiving a portion of a first end of a pinion pin and a second pocket, circumferentially opposite the first pocket, arranged for receiving a portion of a second end of the pinion pin. A stamped steel differential housing including the housing half and a stamped steel differential assembly including the stamped steel differential housing are also disclosed.
    Type: Grant
    Filed: December 19, 2023
    Date of Patent: January 14, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Michael Hodge, David Burky
  • Patent number: 12191295
    Abstract: An electronic assembly heterogeneously integrates radio-frequency (RF) transistor chiplets into a host wafer, and the chiplets have interconnections to host wafer circuits. The assembly has at least one RF transistor chiplet having a chiplet circuit including a high-electron-mobility transistor (HEMT) or a heterojunction bipolar transistor (HBT). The host wafer has at least one host wafer circuit for the purpose of producing bias conditions that optimize performance of the HEMT or HBT. The host wafer circuit includes first circuitry to provide a DC bias of the HEMT or HBT; or second circuitry configured to sense radio-frequency operating conditions of the HEMT or HBT. The electrical interconnects are between the chiplet and the wafer, and electrically connect the host wafer circuit to the chiplet circuit.
    Type: Grant
    Filed: June 25, 2024
    Date of Patent: January 7, 2025
    Assignee: PseudolithIC, Inc.
    Inventors: James F. Buckwalter, Florian Herrault, Justin Kim, Michael Hodge, Daniel S. Green
  • Patent number: 12188529
    Abstract: A radially compliant connection includes an axis, a first plate with a first connection portion, a second plate with a second connection portion, an intermediate plate with third and fourth connection portions, a first flexible element fixed to the first connection portion and to the third connection portion, and a second flexible element fixed to the second connection portion and to the fourth connection portion. In some example embodiments, the first connection portion has a radially inner surface with a first radius, and the second connection portion has a first radially outer surface with a second radius, less than the first radius. In an example embodiment, the third connection portion has a second radially outer surface with a third radius, equal to the second radius, or the fourth connection portion has a third radially outer surface with a fourth radius, equal to the second radius.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: January 7, 2025
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Patrick Lindemann, Matthew Payne, Markus Steinberger, Jordan Geiser, Kenneth Hunt, Michael Hodge
  • Patent number: 12173786
    Abstract: A differential for an e-axle that includes an oil collector for enhancing oil distribution to the differential. Unlike conventional differentials, a differential in accordance with the present disclosure is not submerged in fluid. Rather, the oil collector collects fluid sprayed by other transmission components (e.g., a ring gear) and directs the fluid to the differential.
    Type: Grant
    Filed: January 11, 2024
    Date of Patent: December 24, 2024
    Assignee: Schaeffler Technologies AG & Co. KG
    Inventors: Jordan Geiser, Michael Hodge, Matthew Fowler
  • Publication number: 20240418251
    Abstract: An electronic differential disconnect clutch includes a differential unit, a first flange, a hub, a second flange, a hub sleeve and a solenoid. The differential unit has a pair of splines arranged for receiving a pair of axle shafts. The first flange has a first face spline and is fixed to the differential unit. The hub is rotatable relative to the differential unit and arranged to receive an input torque. The second flange is rotationally fixed and axially displaceable on the hub and has a second face spline arranged for engaging the first face spline. The hub sleeve is arranged to axially displace the second flange to engage the second face spline with the first face spline. The solenoid is arranged to axially displace the hub sleeve.
    Type: Application
    Filed: February 22, 2024
    Publication date: December 19, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Brian Lee, Michael Hodge
  • Publication number: 20240418250
    Abstract: A housing half for a stamped steel differential housing including an outer annular ring and a radially outer cylindrical protrusion with a gear portion. The housing half is integrally formed from a single piece of material. In an example embodiment, the housing half is formed by stamping. In an example embodiment, the gear portion is formed by broaching or rolling. In some example embodiments, the housing half also includes a first pocket arranged for receiving a portion of a first end of a pinion pin and a second pocket, circumferentially opposite the first pocket, arranged for receiving a portion of a second end of the pinion pin. A stamped steel differential housing including the housing half and a stamped steel differential assembly including the stamped steel differential housing are also disclosed.
    Type: Application
    Filed: December 19, 2023
    Publication date: December 19, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Michael Hodge, David Burky
  • Publication number: 20240413103
    Abstract: An electronic assembly has a host wafer having a first circuit including passive devices for the purpose of one of tuning or matching networks. Chiplets are placed in the cavities. At least one chiplet has a second circuit including at least one transistor or switch device and passive tuning circuits including at least one of a stabilization network, a gain boosting network, a power delivery network, or a low-noise network. Electrical interconnects between the chiplets and wafer electrically connect the first circuitry to the second circuitry.
    Type: Application
    Filed: October 20, 2023
    Publication date: December 12, 2024
    Inventors: James BUCKWALTER, Michael HODGE, Justin KIM, Florian HERRAULT, Daniel GREEN