Abstract: A preconditioning mechanism for preconditioning a polishing pad is described. The preconditioning mechanism includes an arm capable of being disposed over the polishing pad and a head section located on a distal end of the arm and rotatable about a central axis. Furthermore, the head section includes at least two heads oriented about the central axis and have surfaces for either conditioning or preconditioning the polishing pad, whereby rotation of the head section about the central axis by defined amounts presents at least two heads to the polishing pad so that different of the two heads can engage the polishing pad for conditioning or preconditioning depending upon how far rotation has proceeded.

Abstract: An automated endpoint detection process includes obtaining a baseline graph of reflected radiation signal versus time of radiation exposure for a standard integrated circuit substrate surface that is substantially free of residual metal, directing radiation generated from a radiation source through a radiation transparent region of a polishing pad such that radiation is incident on at least a portion of a surface of the integrated circuit substrate, detecting a reflected radiation signal from the integrated circuit substrate surface through the radiation transparent region of the polishing pad, comparing an area under a graph of the reflected radiation signal versus time of radiation exposure obtained for the integrated circuit surface to the baseline graph of the standard integrated circuit substrate surface and thereby determining whether residual metal is present on the surface of the integrated circuit substrate and signaling the chemical-mechanical polishing assembly to stop polishing after polishing for

Abstract: The present invention advantageously provides a method for conditioning a polishing pad used for chemical mechanical polishing of a semiconductor wafer surface. The method involves directing a fluid at a relatively high pressure toward the surface of the pad, thereby roughening the surface of the pad and removing particles embedded in pores of the pad. This process provides for uniform conditioning across the surface of the pad and excludes the use of particles which might become disposed on the pad, unlike some other conventional conditioning methods. The exclusion of abrasive particles prevents scratching of wafers which may subsequently undergo CMP using the polishing pad. The conditioning fluid hereof may, among other things, be a typical CMP slurry or variation thereof, or may be deionized water.

Abstract: A method for producing cosmetic samplers that incorporates the genuine cosmetic through the use of bulk thin film application techniques such as extrusion or spray technology. The method comprises first applying a cosmetic slurry to a base substrate and then attaching a cover sheet by means of an adhesive on either wide-web offset or label equipment.

Abstract: A post metal chemical-mechanical polishing cleaning process that effectively inhibits corrosion of a metallic plug is described. The process includes providing a partially fabricated integrated circuit (IC) substrate having a metallic plug that is formed by subjecting a metallic surface on the integrated circuit (IC) substrate to chemical-mechanical polishing, which produces a contaminated dielectric layer containing metallic contaminants. The process also includes scrubbing the IC substrate surface in the presence of a mixture including ethylene glycol and hydrofluoric acid to remove at least a portion of the contaminated dielectric layer and to effectively inhibit corrosion of the metallic plug. The mixture has ethylene glycol in an amount that is between about 2 times and about 7 times the amount of hydrofluoric acid.

Abstract: An odorant composition in the form of a colloidal suspension. A colloidal suspension odorant composition comprised of a colloidal material and a liquid fragrance component is provided. A package comprised of a multiple layer top substrate and a multiple layer bottom substrate is also provided. The colloidal suspension odorant composition may be packaged in the vapor impermeable package and the combination may be used to supply test quantities of odorants.

Abstract: Provided is a chemical mechanical polishing pad having grooves in its polishing surface which have a sub-surface cross-sectional span greater than the grooves' surface opening span. In this way, the edges of the groove are undercut. This provides both increased groove volume for a given pad surface area and groove depth, and variable flexibility in the polishing pad's surface. Grooves in pads of the invention also typically include a neck region at the top of the groove, where the groove side walls are substantially parallel. This provides a margin for the pad to wear during polishing without affecting the pad's surface area. The invention also provides a method and apparatus for cutting grooves in a chemical mechanical polishing pad.

Abstract: A method for determining the thickness of a film in a film stack using reflectance spectroscopy is provided in which one of the films in the stack has unknown optical constants. Conventional methods of using reflectance measurements to determine the thickness of a film require knowledge of the thicknesses and optical constants of all underlying films. An embodiment involves forming a test layer across a substrate having a known thickness and known optical constants. The thickness of the layer is determined using reflectance measurements. A first layer of the same material is then formed across a second layer at the same conditions that the test layer was formed. Thus, the test layer and the first layer can be assumed to have the same thicknesses. A spectral response curve may be determined for the first layer. The first layer is then processed so that its thickness is no longer known.

Abstract: An odorant composition in the form of a colloidal suspension. A colloidal suspension odorant composition comprised of a colloidal material and a liquid fragrance component is provided. A package comprised of a multiple layer top substrate and a multiple layer bottom substrate is also provided. The colloidal suspension odorant composition may be packaged in the vapor impermeable package and the combination may be used to supply test quantities of odorants.

Abstract: The output signal level of a data node connected with a headend for use in a two-way cable communication network is monitored and adjusted at the node so that the signals received at the headend from all of the nodes in the network are substantially at the same level. The node terminal signal, which includes information identifying the address of the node, is initially transmitted from the node at a minimum level and is thereafter incrementally increased until a correct return signal is detected at the node, thereby indicating that the signal transmitted from that node is at a sufficient level to achieve the desired signal level equalization at the headend.