Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 ?m with the intrusion event.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

Abstract: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly.

Abstract: The embodiments relate to a method for integrating a venting system in a circuit board. Three or more interconnected accesses (VIAs) are formed in a printed circuit board (PCB). The VIAs are interconnected by routing a bi-planar channel spanning through the VIAs. The channel includes at least two sections, including a first channel section at a first plane extending from the first VIA to the second VIA and a second channel section at a second plane extending from the second VIA to the third VIA. The first and second sections are at different planar levels.

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure.

Abstract: The embodiments relate to integrating a venting system in a circuit board. Three or more interconnected accesses (VIAs) are formed in a printed circuit board (PCB). The VIAs are interconnected by routing a bi-planar channel spanning through the VIAs. The channel includes at least two sections, including a first channel section at a first plane extending from the first VIA to the second VIA and a second channel section at a second plane extending from the second VIA to the third VIA. The first and second sections are at different planar levels.

Abstract: Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: The embodiments relate to integrating a venting system in a circuit board. Three or more interconnected accesses (VIAs) are formed in a printed circuit board (PCB). The VIAs are interconnected by routing a bi-planar channel spanning through the VIAs. The channel includes at least two sections, including a first channel section at a first plane extending from the first VIA to the second VIA and a second channel section at a second plane extending from the second VIA to the third VIA. The first and second sections are at different planar levels.

Abstract: The embodiments relate to a method for integrating a venting system in a circuit board. Three or more interconnected accesses (VIAs) are formed in a printed circuit board (PCB). The VIAs are interconnected by routing a bi-planar channel spanning through the VIAs. The channel includes at least two sections, including a first channel section at a first plane extending from the first VIA to the second VIA and a second channel section at a second plane extending from the second VIA to the third VIA. The first and second sections are at different planar levels.