Abstract: A composite having a substrate and a plurality of core-shell nanoparticles. The substrate has microporosity, nanoporosity, or free volume and is a polymer matrix, a metal-organic framework, a micro-porous structure, or a nano-porous structure. The plurality of core-shell nanoparticles each has a core and at least one shell layer. The core is made from a decomposed product of a first precursor disposed in the microporosity, nanoporosity, or free volume of the substrate. The at least one shell layer is made from a decomposed product of a second precursor and is disposed on the core.

Abstract: An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.

Abstract: An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device.

Abstract: A composite having a substrate and a plurality of core-shell nanoparticles. The substrate has microporosity, nanoporosity, or free volume and is a polymer matrix, a metal-organic framework, a micro-porous structure, or a nano-porous structure. The plurality of core-shell nanoparticles each has a core and at least one shell layer. The core is made from a decomposed product of a first precursor disposed in the microporosity, nanoporosity, or free volume of the substrate. The at least one shell layer is made from a decomposed product of a second precursor and is disposed on the core.

Abstract: An apparatus is provided and includes a housing, a block formed to define an array of holes corresponding to an array of plugs into which connectors with spring loaded sleeves are pluggable such that the block engages with a respective sleeve of each connector, the block being supportively disposed within the housing to be movable with respect to the housing between first and second block positions at which the sleeves are extended and retracted, respectively and a cam lever supported on the housing and coupled to the block, which selectively occupies first and second lever positions at which the cam lever causes the block to assume the first and second block positions, respectively.

Abstract: The disclosed device primarily consists of a band, ring, or other piece of shape memory polymer (SMP) or SMP composite in various embodiments that allows or disallows containment. When the SMP reaches its transition temperature (Tg) the SMP provides the means for releasing containment of the pressurized material so as to prevent ignition or explosion of hazardous material. At normal operating temperatures, the SMP is in a deformed shape maintaining an environmental seal to protect the contents of the container. When environmental conditions cause the SMP or SMP composite to exceed its Tg, specified by the operating requirements, the SMP returns to its memory shape in a controlled geometry, rather than simply melting. The return of the SMP to its memory shape causes the venting of the container in different manners depending on which embodiment is utilized.

Abstract: An intelligent highlighting system for automatically determining where the author has marked a manuscript for insertion of multimedia, and then inserting the multimedia into digital publications is provided. In the system, digital publication are parsed to identify multimedia references, such as footnotes, comments and hyperlinks. A database table index containing the parsed results is generated and stored in a projected identification database. Next, metadata specific to the parsing results are also stored in the project identification database and a pre-determined highlighting method is identified. The metadata and highlighting method are compiled into an intelligent highlighting object, which is used to embed a hidden multimedia path within the keywords. The keywords with the embedded multimedia are then stored as a binary file.

Abstract: The disclosed device primarily consists of a band, ring, or other piece of shape memory polymer (SMP) or SMP composite in various embodiments that allows or disallows containment. When the SMP reaches its transition temperature (Tg) the SMP provides the means for releasing containment of the pressurized material so as to prevent ignition or explosion of hazardous material. At normal operating temperatures, the SMP is in a deformed shape maintaining an environmental seal to protect the contents of the container. When environmental conditions cause the SMP or SMP composite to exceed its Tg, specified by the operating requirements, the SMP returns to its memory shape in a controlled geometry, rather than simply melting. The return of the SMP to its memory shape causes the venting of the container in different manners depending on which embodiment is utilized.

Abstract: An apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.

Abstract: An apparatus is provided and includes a housing, a block formed to define an array of holes corresponding to an array of plugs into which connectors with spring loaded sleeves are pluggable such that the block engages with a respective sleeve of each connector, the block being supportively disposed within the housing to be movable with respect to the housing between first and second block positions at which the sleeves are extended and retracted, respectively and a cam lever supported on the housing and coupled to the block, which selectively occupies first and second lever positions at which the cam lever causes the block to assume the first and second block positions, respectively.

Abstract: A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements.

Abstract: The disclosed device primarily consists of a band, ring, or other piece of shape memory polymer (SMP) or SMP composite in various embodiments that allows or disallows containment. When the SMP reaches its transition temperature (Tg) the SMP provides the means for releasing containment of the pressurized material so as to prevent ignition or explosion of hazardous material. At normal operating temperatures, the SMP is in a deformed shape maintaining an environmental seal to protect the contents of the container. When environmental conditions cause the SMP or SMP composite to exceed its Tg, specified by the operating requirements, the SMP returns to its memory shape in a controlled geometry, rather than simply melting. The return of the SMP to its memory shape causes the venting of the container in different manners depending on which embodiment is utilized.

Abstract: A method and apparatus used for actuation is provided. In one embodiment, the apparatus comprises an actuation body having a gradually tapered wider end received at one end by an expandable member and at an opposing end by a drive shell. The actuation body being movable from a first position to a second position by means of the drive shell such that this movement causes a looser or tighter fit at the wider end with respect to the expandable member.

Abstract: An apparatus and method used for connecting surfaces to one another is provided. In one embodiment, the apparatus comprises of a mounting body with a front and a back portion. The front portion includes an opening that is aligned with another opening of a block, fixably attached to this front portion. The openings of the block and/or front section can include internal threading. A threaded insert is then placed inside the block such that the insert can move from a first position to a second position using threading movement.

Abstract: A system for airflow management in an electronic enclosure includes a backplane assembly having at least one backplane connector, at least one daughter card, and components disposed on the daughter card oriented to facilitate front-to-back airflow, wherein inlet cooling air impinges on the backplane assembly and splits into at least two flow portions flowing in different directions along a surface defining the backplane assembly

Abstract: A dual-blower assembly includes a single blower housing, the single blower housing defined by a base and opposite top, a pair of opposing side walls and a pair of opposing end walls intermediate the base and the top; a pair of inlet openings in the top; a front blower and a rear blower serially packaged in the single blower housing in a same plane, each blower aligned with a respective inlet opening of the pair of inlet openings; a rear blower exhaust opening for the rear blower disposed in one of the pair of end walls proximate the rear blower; and a front blower side exhaust opening for the front blower disposed in one of the pair of opposing side walls, the front blower side exhaust opening aligned with the front blower. Both the front and rear blowers are configured to force air in a direction from the front blower to the rear blower.

Abstract: An exemplary embodiment is a method and apparatus for a multiple card enclosure. The multiple card enclosure is arranged for mounting a mother card enclosure and a daughter card enclosure and at least another daughter card enclosure. The mother card enclosure has a first and second daughter card enclosure removably inserted into the mother card enclosure for connecting the first and second daughter card with the mother card. The first daughter card enclosure and the second daughter card enclosure are independently removable to facilitate interchanging the first daughter card and the second daughter card. The daughter card enclosures connected to the mother card enclosure are enclosed in the multiple card enclosure and a mother card connects to a back plane connector of a logic board.

Abstract: An apparatus for locating a workpiece on a processing surface includes a first locator arm assembly, a second locator arm assembly, and a pivotal member. The first locator arm assembly includes a first surface disposed for lateral movement and mating engagement with a first portion of the workpiece. The second locator arm assembly includes a second surface disposed for lateral movement parallel to the first surface, the second surface further for mating engagement with a second, opposite side, portion of the workpiece.

Abstract: An apparatus for locating a workpiece on a processing surface includes a first locator arm assembly, a second locator arm assembly, and a pivotal member. The first locator arm assembly includes a first surface disposed for lateral movement and mating engagement with a first portion of the workpiece. The second locator arm assembly includes a second surface disposed for lateral movement parallel to the first surface, the second surface further for mating engagement with a second, opposite side, portion of the workpiece.

Abstract: The present invention relates to a method of splicing a hollow gasket such that the final welded joint remains highly flexible and does not impair the fluid flow between the two spliced sections. The two gasket sections having identical multiple-chambered cross-sections are held in a splice mold by precision tooling and air drawn through small holes in the splice mold by a vacuum pump. Heat is applied to each end of the gasket sections and the ends are brought into contact with one another. As the ends cool, a welded joint is formed. The integrity of each individual chamber is maintained so that, when spliced, the two gaskets sections become one, with the chambers forming continuous channels. The continuous channels create a higher insulating quality than if the channels were blocked at the welded joints. Further, corners spliced in this manner remain as flexible as the adjoining gasket sections.